TI OMAP4430平台，Multimedia device ES.(6.320M，共443页)，共两个压缩包。

uceuce

Contents
1 Introduction ...................................................................................................................... 21
1.1 AboutThisManual........................................................................................................ 21
1.2 OMAP4430MIPI®Disclaimer........................................................................................... 22
1.3 Trademarks................................................................................................................. 22
1.4 History....................................................................................................................... 24
1.5 CommunityResources.................................................................................................... 24
2 TerminalDescription.......................................................................................................... 25
2.1 TerminalAssignments.................................................................................................... 25
2.2 BallCharacteristics........................................................................................................ 26
2.3 MultiplexingCharacteristics.............................................................................................. 70
2.4 SignalDescriptions........................................................................................................ 87
2.4.1 ExternalMemoryInterfaces ................................................................................... 87
2.4.1.1 GPMC............................................................................................... 87
2.4.1.2 LPDDR2............................................................................................. 89
2.4.2 VideoInterfaces ................................................................................................. 92
2.4.2.1 Camera.............................................................................................. 92
2.4.2.2 Display............................................................................................... 93
2.4.3 SerialCommunicationInterfaces ............................................................................. 95
2.4.3.1 HDQ/1-Wire......................................................................................... 95
2.4.3.2 I
2
C.................................................................................................... 96
2.4.3.3 SmartReflex™...................................................................................... 96
2.4.3.4 McBSP.............................................................................................. 96
2.4.3.5 PDM ................................................................................................. 97
2.4.3.6 DMIC................................................................................................. 97
2.4.3.7 McASP.............................................................................................. 98
2.4.3.8 SLIMbus
®
............................................................................................ 98
2.4.3.9 HSI................................................................................................... 99
2.4.3.10 McSPI................................................................................................ 99
2.4.3.11 UART............................................................................................... 100
2.4.3.12 USB ................................................................................................ 101
2.4.4 RemovableMediaInterfaces ................................................................................ 103
2.4.4.1 MMC/SDIO........................................................................................ 103
2.4.4.2 USIM............................................................................................... 104
2.4.5 TestInterfaces ................................................................................................. 104
2.4.5.1 JTAG ............................................................................................... 104
2.4.5.2 DPM................................................................................................ 105
2.4.5.3 TPIU................................................................................................ 105
2.4.5.4 STM ................................................................................................ 107
2.4.5.5 ATTILA............................................................................................. 107
2.4.5.6 VideoEncoderTest.............................................................................. 108
2.4.6 General-PurposeIOs ......................................................................................... 108
2.4.7 General-PurposeIn ........................................................................................... 112
2.4.8 SystemandMiscellaneous.................................................................................. 113
2.4.8.1 DMTimer .......................................................................................... 113
2.4.8.2 KeyPad............................................................................................. 113
Copyright©2010–2012,TexasInstruments Incorporated Contents 3
PRODUCT PREVIEW
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OMAP4430
SWPS041D–DECEMBER2010–REVISEDJANUARY2012 www.ti.com
2.4.8.3 POP................................................................................................ 114
2.4.8.4 SystemAndMiscellaneous..................................................................... 114
2.4.9 PowerSupplies................................................................................................ 116
3 ElectricalCharacteristics.................................................................................................. 119
3.1 AbsoluteMaximumRatings............................................................................................. 119
3.2 RecommendedOperatingConditions................................................................................. 122
3.3 DCElectricalCharacteristics........................................................................................... 126
3.3.1 GPMCDCElectricalCharacteristics....................................................................... 127
3.3.2 LPDDR2DCElectricalCharacteristics..................................................................... 131
3.3.3 CameraDCElectricalCharacteristics...................................................................... 134
3.3.4 DisplayDCElectricalCharacteristics....................................................................... 136
3.3.5 HDQ/1-WireDCElectricalCharacteristics................................................................. 137
3.3.6 I
2
CDCElectricalCharacteristics............................................................................ 138
3.3.7 AudioMcBSP/ PDM/ DMICDCElectricalCharacteristics............................................. 140
3.3.8 McSPIDCElectricalCharacteristics........................................................................ 142
3.3.9 UARTDCElectricalCharacteristics........................................................................ 145
3.3.10 USBDCElectricalCharacteristics.......................................................................... 148
3.3.11 MMC/SDIODCElectricalCharacteristics.................................................................. 154
3.3.12 JTAGDCElectricalCharacteristics......................................................................... 156
3.3.13 DPMDCElectricalCharacteristics......................................................................... 158
3.3.14 KeypadDCElectricalCharacteristics...................................................................... 160
3.3.15 SystemDCElectricalCharacteristics...................................................................... 161
3.4 ExternalCapacitors...................................................................................................... 165
3.4.1 VoltageDecouplingCapacitors.............................................................................. 165
3.4.1.1 Core,MPU,IVA, AudioVoltageDecoupling.................................................. 165
3.4.1.2 IO VoltageDecoupling........................................................................... 166
3.4.1.3 AnalogVoltageDecoupling..................................................................... 168
3.4.2 OutputCapacitors............................................................................................. 172
3.5 Power-upandPower-downSequences.............................................................................. 175
3.5.1 Power-UpSequence.......................................................................................... 175
3.5.2 Power-DownSequence...................................................................................... 176
4 ClockSpecifications ........................................................................................................ 178
4.1 Input ClockSpecifications .............................................................................................. 180
4.1.1 Input ClockRequirements................................................................................... 180
4.1.2 sys_32kCMOSInput Clock................................................................................. 180
4.1.3 fref_xtalin CMOSInput Clock................................................................................ 181
4.1.3.1 fref_xtal_in / fref_xtal_out ExternalCrystal.................................................... 181
4.1.3.2 fref_xtal_in SquarerInput Clock................................................................ 182
4.1.4 fref_slicer_in SquarerInput Clock........................................................................... 183
4.2 OutputClocksSpecifications........................................................................................... 185
4.2.1 FREFOutputClocks.......................................................................................... 185
4.3 DPLLs,DLLsSpecifications............................................................................................ 187
4.3.1 DPLLsCharacteristics........................................................................................ 188
4.3.2 DLLsCharacteristics.......................................................................................... 190
4.3.3 DPLLsandDLLsNoiseIsolation ............................................................................ 190
4.4 Internal 32-kHzOscillator............................................................................................... 190
5 VideoDACSpecifications................................................................................................. 191
4 Contents Copyright©2010–2012,TexasInstruments Incorporated
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uceuce

以下是引用maotou在2010-9-30 18:23:43的发言：
你这里面啥东西都没有，你的后缀名都不是PCB，LAYOUT能打开吗？

的确, 没人顶一下啊。？

uceuce

PRODUCT PREVIEW
PublicVersion
OMAP4430
www.ti.com SWPS041D–DECEMBER2010–REVISEDJANUARY2012
5.1 TVOUTBufferMode(DAC +Buffer).................................................................................. 191
5.2 TVOUTBypassMode(DAC Only).................................................................................... 191
5.3 ElectricalSpecificationsOverRecommendedOperatingConditions............................................. 192
5.4 TVOUTBypassModeSpecifications(DAC-Only) ElectricalSpecificationsOverRecommended
OperatingConditions.................................................................................................... 195
5.5 AnalogSupply(vdda_hdmi_vdac)NoiseRequirements............................................................ 196
5.6 ExternalComponentValueChoice.................................................................................... 197
6 TimingRequirementsandSwitchingCharacteristics........................................................... 198
6.1 TimingTestConditions.................................................................................................. 198
6.2 Interface ClockSpecifications.......................................................................................... 198
6.2.1 Interface ClockTerminology................................................................................. 198
6.2.2 Interface ClockFrequency................................................................................... 198
6.2.3 ClockJitterSpecifications.................................................................................... 198
6.2.4 ClockDutyCycleError....................................................................................... 199
6.3 TimingParameters....................................................................................................... 199
6.4 ExternalMemoryInterface .............................................................................................. 199
6.4.1 General-PurposeMemoryController(GPMC) ............................................................ 200
6.4.1.1 GPMC/NORFlashInterface—SynchronousMode—100MHz............................. 200
6.4.1.2 GPMC/NORFlashInterface—SynchronousMode—66MHz.............................. 207
6.4.1.3 GPMC/NORFlashInterface—AsynchronousMode......................................... 217
6.4.1.4 GPMC/NANDFlashInterface—AsynchronousMode....................................... 225
6.4.2 ExternalMemoryInterface (EMIF) .......................................................................... 229
6.4.2.1 EMIF—DDRMode............................................................................... 229
6.5 MultimediaInterfaces .................................................................................................... 244
6.5.1 CameraInterface .............................................................................................. 244
6.5.1.1 CameraSerialInterface (CSI2) ................................................................. 245
6.5.1.2 CameraSerialInterface (CCP2—CSI22)..................................................... 247
6.5.2 DisplaySubsystemInterface ................................................................................ 249
6.5.2.1 DSS—DisplayController(DISPC) .............................................................. 249
6.5.2.2 DSS—RemoteFrameBufferInterface (RFBI) Applications................................ 252
6.5.2.3 DisplaySerialInterface (DSI1).................................................................. 259
6.5.2.4 HighDefinitionMultimediaInterface (HDMI) .................................................. 261
6.6 SerialCommunicationsInterfaces ..................................................................................... 261
6.6.1 MultichannelBufferedSerialPort(McBSP) ............................................................... 261
6.6.1.1 McBSP1,McBSP2,andMcBSP3Set#1...................................................... 262
6.6.1.2 McBSP3—I2S/PCM .............................................................................. 273
6.6.1.3 McBSP4—I2S/PCM .............................................................................. 279
6.6.2 MultichannelBufferedSerialPort(McASP) ............................................................... 284
6.6.3 MultichannelSerialPortInterface (McSPI) ................................................................ 286
6.6.3.1 McSPI—MCSPIInterface in TransmitandReceive—SlaveMode........................ 287
6.6.3.2 McSPI—McSPIInterface in TransmitandReceive—MasterMode........................ 292
6.6.4 DigitalMicrophone(DMIC) ................................................................................... 303
6.6.5 MultichannelPulseDensityModulation(McPDM) ........................................................ 306
6.6.6 SlimBus......................................................................................................... 308
6.6.6.1 ABESlimBus1,SlimBus2—SLIMBUSSDR24.6MHz...................................... 308
6.6.6.2 ABESlimBus1,SlimBus2—SLIMBUSSDR19.2MHz...................................... 310
6.6.7 High-SpeedSynchronousInterface (HSI) ................................................................. 312
6.6.7.1 High-SpeedSynchronousInterface 1.......................................................... 312
Copyright©2010–2012,TexasInstruments Incorporated Contents 5
PRODUCT PREVIEW
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OMAP4430
SWPS041D–DECEMBER2010–REVISEDJANUARY2012 www.ti.com
6.6.7.2 High-SpeedSynchronousInterface 2.......................................................... 314
6.6.8 UniversalSerialBus(USB) .................................................................................. 318
6.6.8.1 UniversalSerialBus(USB)—USBA0.......................................................... 318
6.6.8.2 UniversalSerialBus(USB)—USBC1.......................................................... 319
6.6.8.3 UniversalSerialBus(USB)—USBB1.......................................................... 324
6.6.8.4 UniversalSerialBus(USB)—USBB2.......................................................... 335
6.6.9 Inter-Integrated CircuitInterface (I
2
C)...................................................................... 346
6.6.9.1 I
2
CandSmartReflex—StandardandFastModes........................................... 347
6.6.9.2 I
2
CandSmartReflex—High-SpeedMode..................................................... 348
6.6.10 HDQ/ 1-WireInterface (HDQ/1-Wire) ...................................................................... 349
6.6.10.1 HDQ/ 1-Wire—HDQMode..................................................................... 349
6.6.10.2 HDQ/1-Wire—1-WireMode..................................................................... 351
6.6.11 UniversalAsynchronousReceiverTransmitter(UART) .................................................. 352
6.6.11.1 UART3IrDA ....................................................................................... 359
6.7 RemovableMediaInterfaces ........................................................................................... 361
6.7.1 MultimediaMemoryCardandSecureDigitalIO Card(SDMMC) ...................................... 361
6.7.1.1 MMC/SD/SDIO1Interface ...................................................................... 361
6.7.1.2 MMC/SD/SDIO2Interface ...................................................................... 370
6.7.1.3 MMC/SD/SDIO3,4,and5Interfaces ......................................................... 377
6.8 TestInterfaces ............................................................................................................ 380
6.8.1 DigitalProcessingManagerInterface (DPM) .............................................................. 380
6.8.1.1 TracePortInterface Unit(TPIU) ................................................................ 380
6.8.1.2 SystemTraceModuleInterface (STM) ........................................................ 381
6.8.2 JTAGInterface (JTAG) ....................................................................................... 385
6.8.2.1 JTAG—Free-RunningClockMode............................................................. 385
6.8.2.2 JTAG—AdaptiveClockMode................................................................... 387
6.8.3 cJTAGInterface (cJTAG) .................................................................................... 388
7 ThermalManagement....................................................................................................... 391
7.1 PackageThermalCharacteristics...................................................................................... 391
7.2 TemperatureSensorRecommendation............................................................................... 392
7.2.1 PCBTemperatureSensor ................................................................................... 392
7.2.2 JunctionTemperatureSensor............................................................................... 392
8 PackageCharacteristics................................................................................................... 394
8.1 DeviceNomenclature.................................................................................................... 394
8.1.1 StandardPackageSymbolization........................................................................... 394
8.1.2 SAPPartNumber............................................................................................. 395
8.1.3 DeviceNamingConvention.................................................................................. 395
8.2 MechanicalData......................................................................................................... 396
A OMAP4430ProcessorMultimediaDevicePCBGuideline...................................................... 397
A.1 Introduction ............................................................................................................... 397
A.2 Initial RequirementsandGuidelines................................................................................... 397
A.2.1 Introduction to the PCBGuidelines......................................................................... 397
A.2.2 PCBPowerGeneralRoutingGuidelines................................................................... 399
A.2.2.1 Step1:PCBStack-upGuidelines.............................................................. 399
A.2.2.2 Step2:PhysicalLayoutGuidelinesofthe PDN.............................................. 401
A.2.2.3 Step3:StaticIR DropPDNGuidelines........................................................ 406
A.2.3 LumpedandDistributedResistance/IRDropAnalysisMethodology.................................. 407
A.2.4 SystemESDGenericGuidelines............................................................................ 408
6 Contents Copyright©2010–2012,TexasInstruments Incorporated
PRODUCT PREVIEW
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OMAP4430
www.ti.com SWPS041D–DECEMBER2010–REVISEDJANUARY2012
A.2.4.1 IEC61000-4-2 StandardOverview—SystemESD........................................... 408
A.2.4.2 ObjectiveandLimitationofthe ProtectionStrategy.......................................... 410
A.2.4.3 ConceptofIsolation Impedance ................................................................ 410
A.2.4.4 SystemESDGenericPCBGuideline.......................................................... 410
A.2.4.5 MiscellaneousEMCGuidelinesto MitigateESDImmunity ................................. 411
A.3 Single-EndedInterfaces ................................................................................................. 412
A.3.1 GeneralRoutingGuidelines................................................................................. 412
A.3.2 Single-EndedPCBGuidelinein OMAP4................................................................... 413
A.3.2.1 OMAP4430Single-EndedInterfaces—PCBGuideline...................................... 413
A.3.2.2 OMAP4430Single-EndedInterfaces—OMAP4430SystemESDGuideline............. 416
A.4 DifferentialInterface PCBGuidelines................................................................................. 418
A.4.1 GeneralRoutingGuidelines................................................................................. 418
A.4.2 Three-stepDesignandValidationMethodologyfor OMAPBoards.................................... 419
A.4.2.1 Three-stepDesignandValidationMethodology—GeneralGuidelines.................... 419
A.4.2.2 Step1:GeneralGuidelinesfor OMAPBoards............................................... 420
A.4.2.3 Step2:LengthMismatchGuidelinesfor OMAPBoards.................................... 421
A.4.2.4 Step3:Frequency-domainSpecificationGuidelinesfor OMAPBoards.................. 422
A.4.3 MIPID-PHYPCBGuidelinesin OMAP4................................................................... 427
A.4.3.1 CSI21andCSI22MIPICSI-2@1Gbps(Up to 3DataLanes,OPP100),@824Mbps(Up
to 4DataLanes,OPP100),@800Mbps(Up to 4DataLanes,OPP50)DevicePCB
Guidelines......................................................................................... 427
A.4.3.2 DSI1andDSI2MIPIDSI1@900Mbps(Up to 3DataLanes),@824Mbps(Up to 4Data
Lanes)DevicePCBGuideline.................................................................. 429
A.4.4 USBA0PHYInterface in OMAP4........................................................................... 430
A.4.4.1 USBA0PHYPCBGuideline.................................................................... 430
A.4.4.2 USBA0PHYImplementation Example........................................................ 432
A.4.4.3 ESDImplementation—USBA0PHY........................................................... 433
A.4.5 HDMIInterface in OMAP4................................................................................... 433
A.5 TVOUTInterface in OMAP4............................................................................................ 433
A.5.1 TV-OUTPCBRequirements................................................................................. 434
A.5.1.1 SelfParasiticRequirements..................................................................... 434
A.5.1.2 MutualCapacitanceRequirements............................................................ 434
A.5.1.3 MutualInductance Requirements.............................................................. 435
A.5.2 TV-OUTImplementation Proposal.......................................................................... 435
A.5.3 ESDImplementation—TV-OUT............................................................................. 435
A.6 ClockGuidelines......................................................................................................... 436
A.6.1 32-kHzOscillatorRouting.................................................................................... 436
A.6.2 OscillatorGroundConnection............................................................................... 437
A.6.3 ElectromagneticInterference (EMI) Preventionin ClockDistribution.................................. 438
A.7 GroundGuidelines....................................................................................................... 438
A.7.1 GuardRingonPCBEdges.................................................................................. 438
A.7.2 AnalogandDigitalGround................................................................................... 439
B Glossary......................................................................................................................... 440
B.1 Glossary................................................................................................................... 440
【文件名】:12428@52RD_OMAP4430_ES.part1.rar

【文件名】:12428@52RD_OMAP4430_ES.part2.rar
【格　式】:rar
【大　小】:3093K
【简　介】:
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Gavin_lee

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huangruini

下来看看，多谢！

uceuce

给力。

2984438

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liuyingkai87

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rupert

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xiaowu8050

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dr25dr

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yinkzhdmi

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zhang137234

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