[免费]Basic ESD And IO Design
主要集中讨论IC设计中使用的防ESD的方法，layout的注意要点，IO接口设计，固定电压ESD，失效模式分析等。全文九大章节，共315页，内容极为翔实。为影印版英文，具体不多加介绍。免费给大家！52RD.com]2RD.com]
小附目录一段：
L.7Y,, to- V} Core Clamps 161
2.7.1.MDS Hased / 61
2.7.2.Diode Clamps/ 62
2.7.3.Cantilevered Diode / 68
2.8_ CDM Guidelines / 71
2.9. Summary / 79
Referencm J SO
ADDITIONAL ESO CON 51OCRATION5
3.1
3.2
Capacitor Bm6ts in Stress Reduction / 81
Packaging Effects oil ESA / 86
3.2.1.Conventional Packaging J 86
3.2.2.MU1tichip Modules / 90
Small-Chip ESD issues 1 93
Benefits of Distributed Clamps / 95
Predriver Designs / 96
3.3.
3.4.
3.5
3.6. Antenna Diode Issues / 99
3.7.Hot-Electron Interactions f 103
3.8.Latchup Issues / l05
3.9.Silicon-on-Insulator ESD Protection / 107
3.10. Summary / 109
References / 110
4.1 D. Digital Compensation / 158
4.11. Frequency-Based Compensation / 161
4.12. Simultaneous Switching Output Naise / 162
4.12.1_ Design for SSO Reduction / 168
4.12.1.1.Predriver Skewing / 16&
4.12_1.2.NP-Inverted Stack Driver / 169
4.12.1.3.DlfererdW Signaling ,' 172
4.12.1.4.SSO Reduction Using Packaging
Options / 172
4.12.1.5.SSO Reduction Using Loii-Weigi
Coding / 173
4.13. System Modeling / 174
4.14. IJO lnfarmation on the Internet / 178
4.15_ Summary / 174
References } 180
COM,6N,
LAYOUT Issues
5.1.Output Transistor Layout J 133
5.2,Thick-Field Oxide (TFO) Layout / 19
5.3.Diode Layout / 191
5.4.Decoupling Capacitors / 192
5.5.SCR Layout ) 196
5.5.Antenna Diode Layout j 197
5.7.Resistor Layouts / 197
5.8.Periphery Layout / 202
5.8.1.Power Delivery / 2112
5.8.2 IJo Routing Channels / 206
5_9.Metal Design [;uses J 207
5.10. PSD Layout Verificatiou ! 212
5.10.1. Manual PSD Veri&catiox
5.10_2. Automated Verification
5.11. Summary / 213
References 1 214
eso near 110 INTERACTIONS
6-1. V0 Pcifotxnance Trade-off 1 219
6.1.1-impact on Output Buffer
6-1.2,Impact on Compensation
Implementation 1 220
Input Pass Transistor Jitters
OthcrInleractions / 224
rv Noise Cannon. ;nfn !'n,n
rln
Snpvlics r z26
120 and Corc Switching Current
Characterisrirc 1 '177
Peripheral Noise Coupling ThrouSf
FSn no-l- ) iie
5.2.3.Peripheral IYoiss anc
Lnterartinn 1 711
Power System imvcdarnca
ESD Diodes and I/4 Signal Integrity / 233
6.3.1.High-Frequency Leakage in LJD f 24:
6.3
R} }ow.ee17A.
-nwl
MIXED-VOLTAQ6 ESD 2-
7.1, Mixed-Voltage Input Design 1 246
7.1.1.Input Design for Low-VOSWE Core and
High-Voltage 1/O / 246
7,1,2_Input Design far High-Voltage Core and
Low-Voltage 1/0 17.55
7.1.3.Capacidve-COUpled Input Receiver / 7.56
7.2.Output Design for Mixed Voltage j 257
7.2_ LOpcn-Dwain Design for High-Voltage 110 / 258
7,2,2.CMOS Buffcr Design for Higb-Voltage 1/O 1260
7.2.3.Output Predrirars for High-Voltage 1/O 1 263
7,3-Effect on power Supply Coupling Diodes 1 264
7.4.Separate FSD Bus j 266
7.5.Back Biasing / 269
7.6.Process Modifications to Support High Voltages / 272
7.7.Summary / 273
【文件名】:06812@52RD_06810@52RD_Basic ESD And IO Design.part1.rar
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go0d 谢谢楼主!不过英文不好办呐...... 不错，多谢 虽然都是英文～还是给楼主推一下 GOOOOOD!!
支持, good 同志辛苦拉～～～！！！ good resources
thank you <DIV class=quote><B>以下是引用<I>yunyun</I>在2006-8-12 11:39:00的发言：</B>
主要集中讨论IC设计中使用的防ESD的方法，layout的注意要点，IO接口设计，固定电压ESD，失效模式分析等。全文九大章节，共315页，内容极为翔实。为影印版英文，具体不多加介绍。免费给大家！文件名】:06812@52RD_06810@52RD_Basic ESD And IO Design.part1.rar
【格 式】:rar
【大 小】:4000K
【简 介】:
【目 录】:
</DIV>
网络原因，我给你加不上分，能回复一下吗。 不顶不厚到 不顶,就没礼貌了.详细读解 楼主真是大好人啊！ 不回对不起党中央 非常感谢！！好东东！！ 顶一个 好人啊！
太感谢了 楼主，太感谢你了啊！
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