[综合资料] 美国专利printed lumped element stripline circuit stracture and method

发表于 2005-12-31 13:24:00 | 显示全部楼层 |阅读模式

【文件名】:051231@52RD_us_patent_stripline structure and method.pdf
【简　介】: A novel circuit packaging structure including a combination of printed lumped elements within a multi-layer stripline architecture and method of making it
【目　录】:
【格　式】:pdf
【大　小】:1156K

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