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[讨论] Recruit New Field Application Engineer - Shenzhen, RF Micro Devices

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发表于 2007-4-9 15:38:25 | 显示全部楼层 |阅读模式
Job Description
Support customers in the field with any and all technical issues involving system architecture (definition, system specifications, block diagrams), product type and family (MMIC’s, chip sets, modules), applications (troubleshoot circuits, demonstrate product functionality, offer alternate design methods), designs (external matching, bias schemes), reliability (MSL, HTOL, FA’s, HAST, MTBF, Thermal analysis), packaging (substrates, MSL, material sets, modules, MMIC’s), Assembly (Manufacturing notes, reflow profiles, solder properties, MSL) system board and IC layouts (impedance control, board material, BOM, layer stack up), Testing (performance correlation, yield analysis, qualifications), and failure analysis (RMA, Corrective action).   Work with technical team in U.S. offices to communicate and resolve field technical issues
Job Specifications
A. Education:   Require BSEE, MSEE prefered
B. Experience:  3 years of RF design experience, GSM handset design prefered.
C. Abilities:  Multi-tasking, problem-solving, communications skills, RF, fluent in English (spoken and written) and Mandarin
If you are interested in this position, please send you CV to jyang@rfmd.com;
发表于 2007-4-9 20:09:03 | 显示全部楼层
想问一下,有没有上海的职位
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 楼主| 发表于 2007-4-11 13:28:07 | 显示全部楼层
no, this position locates in Shenzhen.
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