Designing for Board Level Electromagnetic Compatibility 1RD币

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【文件名】:07331@52RD_Designing for Board Level Electromagnetic Compatibility.pdf
【格　式】:pdf
【大　小】:1618K
【简　介】:
【目　录】:



© Freescale Semiconductor, Inc., 2005. All rights reserved.

Designing for Board Level Electromagnetic Compatibility
by: T.C. Lun
Applications Engineering Microcontroller Division

This application note discusses board level electromagnetic compatibility (EMC), from component
selection, circuit design, to printed circuit board layout.
The text is divided into the following parts:
• PART 1: An overview of EMC
• PART 2: Component selection and circuit design techniques
• PART 3: Printed circuit board layout techniques
• APPENDIX A: Glossary of EMC terms
• APPENDIX B: Immunity measurement standards

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highness

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bjohn

理清功能方框图
􀂾 网表导入PCB Layout工具后进行初步处理的技巧
􀂾 射频PCB布局与数模混合类PCB布局
􀂾 无线终端PCB常用HDI工艺介绍
􀂾 信号完整性（SI）的基础概念
􀂾 射频PCB与数模混合类PCB的特殊叠层结构
􀂾 特性阻抗的控制
􀂾 射频PCB与数模混合类PCB的布线规则和技巧
􀂾 射频PCB与数模混合类PCB布线完成后的收尾处理
􀂾 PCB板级的ESD处理方法和技巧
􀂾 PCB板级的EMC/EMI处理方法和技巧
􀂾 PCB中的DFM 设计
􀂾 FPC柔性PCB设计
􀂾 设计规范的必要性