|
【文件名】:07319@52RD_mwee1205p23.rar
【格 式】:rar
【大 小】:1115K
【简 介】:Today’s cell phone printed circuit
boards (PCB) are much more complex and
internally “noisy” than ever before, due to
added functionality and less board space. In
many cases, the speaker is very close to the
radio-frequency (RF) antenna, and the audio
amplifier is closer to the RF power amplifier
section. This means that the components on
the board have to deal with higher levels of
RF noise than in previous generations.
【目 录】:
1.Introduction
2.RF Noise
3.Master/Slave BTL Audio Power Amplifier Architecture
4.Fully-Differential BTL Audio Power Amplifier Architecture
5.Conclusion
|
本帖子中包含更多资源
您需要 登录 才可以下载或查看,没有账号?注册
×
|