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[资料] Design Techniques for EMC

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发表于 2006-7-16 13:45:00 | 显示全部楼层 |阅读模式
【文件名】:06716@52RD_Design Techniques for EMC.pdf
【格 式】:pdf
【大 小】:1212K
【简 介】:
【目 录】:



Table of contents for part 1
1. Circuit design and choice of components for EMC
1.1 Digital components and circuit design for EMC
1.1.1Choosing components
1.1.2Batch and mask-shrink problems
1.1.3IC sockets are bad
1.1.4Circuit techniques
1.1.5Spread-spectrum clocking
1.2 Analogue components and circuit design
1.2.1Choosing analogue components
Preventing demodulation problems
1.2.3Other analogue circuit techniques
1.3 Switch-mode design
1.3.1Choice of topology and devices
Snubbing
1.3.3Heatsinks
Rectifiers
1.3.5Problems and solutions relating to magnetic components
1.3.6Spread-spectrum clocking for switch-mode
1.4 Signal communication components and circuit design
1.4.1Non-metallic communications are best
1.4.2Techniques for metallic communications
1.4.3Opto-isolation
1.4.4External I/O protection
1.4.5“Earth – free” and “floating” communications
1.4.6Hazardous area and intrinsically safe communications
1.4.7Communication protocols
1.5 Choosing passive components
1.6 References:
1. Circuit design and choice of components for EMC
Correct choice of active and passive components, and good circuit design techniques used
from the beginning of a new design and development project, will help achieve EMC
compliance in the most cost-effective way, reducing the cost, size, and weight of the
eventual filtering and shielding required.
These techniques also improve digital signal integrity and analogue signal-to-noise, and
can save at least one iteration of hardware and software. This will help new products
achieve their functional specifications, and get to market, earlier. These EMC techniques
should be seen as a part of a company’s competitive edge, for maximum commercial
benefit.
1.1 Digital components and circuit design for EMC
1.1.1 Choosing components
Most digital IC manufacturers have at least one glue-logic range with low emissions, and a
few versions of I/O chips with improved immunity to ESD. Some offer VLSI in “EMC

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