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发表于 2006-6-8 16:41:00
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<P>Provide List of Contents.</P><DT>Part 1: The Directive, Standards and Testing <DT> <DT>Chapter 1 Introduction <DD>What is EMC? <DD>Compatibility between systems <DD>The scope of EMC <DD>The compatibility gap <DD>The EMC Directive <DD>The new approach directives <DD>Background to the legislation <DD>Scope, requirements and exceptions <DD>The CE mark and the declaration of conformity <DD>Manufacturing yuality assessment <DD>Systems and installations <DD>Implementation, enforcement and sanctions <DD>Compliance with the Directive <DD>Self certification The technical construction file <DD>The transition period <DD>Telecomms terminal and satellite ea:rth station equipment radio transmitters <DD>Testing and the competent body <DD>Standards <DD>Action for compliance <DT> <DT>Chapter 2 Standards <DD>The standards making bodies <DD>The International Electro technical Commission <DD>CENELEC <DD>Basic and generic standards - emissions <DD>EN 50 ()81 part 1: 1992* <DD>EN 50 081 part 2: 1993* <DD>EN 55 011: 1991 * <DD>EN 55 014: 1993* <DD>EN 55 022: 1994* <DD>Generic standards-immunity <DD>EN 50 082 part I: 1992 * <DD>EN 50 082 part 2: 1995* <DD>Basic standards - IEC 1000 <DD>IEC 1000-3 <DD>IEC 1000-4 <DD>Product standards <DD>EN 55 013: 1990* <DD>EN 55 015: 1993* <DD>EN 55 020: 1933 <DD>EN 55 104: 1995* <DD>EN 50 065-1: 1991 * <DD>EN 60 601-1-2: 1993* <DD>EN 60 945: 1993* <DD>ETS 300 127: 1994 pr <DD>ETS 300 339 <DD>Automotive standards <DD>Other product standards in development <DD>Other standards not related to the EMC Directive <DD>FCC Rules <DD>German standards <DD>Other nonharmonized standards <DD>RF emissions limits <DT> <DT>Chapter 3 EMC measurements <DD>RF emissions <DD>Measurement instrumentation <DD>Transducers <DD>Facilities <DD>Test methods <DD>Sources of uncertainty <DD>RF immunity <DD>Equipment <DD>Facilities <DD>Test methods <DD>Conducted RF immunity <DD>ESD and transient immunity <DD>ESD <DD>Transients <DD>Sources of uncertainty <DD>Evaluation of results <DD>Performance criteria <DD>Mains harmonic emission <DD>Equipment <DD>Test conditions <DT> <DT>Part 2: Design Principles <DT> <DT>Chapter 4 Interference coupling mechanisms <DD>Source and victim <DD>Common impedance coupling <DD>Mains coupling <DD>Radiated coupling <DD>Coupling modes <DD>Emissions <DD>Radiated emissions <DD>Conducted emissions <DD>Susceptibility <DD>Radiated field <DD>Transients <DD>Electrostatic discharge <DD>Magnetic fields <DD>Supply voltage phenomena <DD>Mains harmonics <DD>The supplier's problem <DD>Non-linear loads <DT> <DT>Chapter 5 Layout and grounding <DD>Equipment layout and grounding <DD>System partitioning <DD>Grounding <DD>Ground systems <DD>Grounding and layout of large systems <DD>PCB layout <DD>Ground layout without a ground plane <DD>Ground plane <DD>Loop area <DD>Configuring 1/0 grounds <DD>Rules for PCB layout <DT> <DT>Chapter 6 Digital and analogue circuit design <DD>Design for emissions control <DD>The Fourier spectrum <DD>Radiation from logic circuits <DD>Digital circuit decoupling <DD>Analogue circuits: emissions <DD>The switching power supply <DD>Design for immunity <DD>Digital circuits: interference paths <DD>Logic noise immunity <DD>The microprocessor watchdog <DD>Defensive programming <DD>Transient and RF immunity: analogue circuits <DT>Chapter 7 Interfaces, filtering and shielding <DD>Cables and connectors <DD>Cable segregation and returns <DD>Cable screens at low frequencies <DD>Cable screens at RF <DD>Types of cable screen <DD>Screened cable connections <DD>Unscreened cables <DD>Filtering and suppression <DD>Filter configuration <DD>Components <DD>Mains filters <DD>I/O filtering <DD>Transient suppression <DD>Contact suppression <DD>Shielding <DD>Shielding theory <DD>LF magnetic fields <DD>The effect of apertures <DD>The image plane <DD>Enclosure resonance <DD>Shielding hardware <DT> <DT>Chapter 8 EMC management <DD>Managing the EMC process <DD>Putting EMC in context <DD>The EMC co-ordinator <DD>Control plan <DD>The purpose of the control plan <DD>Contents <DD>Test plan <DD>The need for a test plan <DD>Contents <DD>Test and calibration procedures <DD>Susceptibility criteria <DD>Production QA testing <DT> <DT>Appendix A Design checklist <DT> <DT>Appendix B CAD for EMC <DD>Overview <DD>Available packages <DD>Circuit CAD <DT> <DT>Appendix C Useful tables and formulae <DD>The deciBel <DD>Antennas <DD>Fields <DD>Shielding <DD>Capacitance, inductance and pcb layout <DD>Filters <DD>Fourier series <DT> <DT>Appendix D The EU and EEA countries <DD>The European Union <DD>The European Economic Area <DT> <DT>Glossary <DT>Bibliography <DT>Index
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