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[资料] 射频设计指南

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发表于 2011-12-8 22:37:49 | 显示全部楼层 |阅读模式
1  Table of Contents
1  Table of Contents............................................................................................................................. 2
1.1  Index of Figures ..................................................................................................................... 2
1.2  Index of Tables ...................................................................................................................... 2
2  Introduction ...................................................................................................................................... 3
3  General PCB Layout Techniques .................................................................................................... 4
3.1  4-Layer Designs..................................................................................................................... 4
3.2  2-Layer Designs..................................................................................................................... 5
3.3  PCB Transmission Lines ....................................................................................................... 6
3.4  Current Loops and Decoupling .............................................................................................. 7
3.5  PCB Parasitics ....................................................................................................................... 7
4  RF Device PCB Layout and Optimization........................................................................................ 9
4.1  Thermal Relief Pad ................................................................................................................ 9
4.2  VCO and Loop Filter .............................................................................................................. 9
4.2.1  PCB Layout ....................................................................................................................... 9
4.2.2  Optimization..................................................................................................................... 11
4.3  Transmitter Circuit ............................................................................................................... 12
4.3.1  Optimization..................................................................................................................... 12
4.3.2  PCB Layout ..................................................................................................................... 16
4.4  Receiver LNA Circuit ........................................................................................................... 16
4.4.1  PCB Layout ..................................................................................................................... 16
4.4.2  Circuit Optimization ......................................................................................................... 17
5  Passive Components ..................................................................................................................... 20
5.1  Capacitors............................................................................................................................ 20
5.2  Inductors .............................................................................................................................. 21
1.1  Index of Figures
Figure 1: Semtech Transceiver Architecture........................................................................................... 3
Figure 2: 4-Layer PCB Build-Up ............................................................................................................. 4
【文件名】:11128@52RD_RF_Design_Guidelines_Semtech.pdf
【格 式】:pdf
【大 小】:610K
【简 介】:
【目 录】:


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发表于 2011-12-21 13:38:24 | 显示全部楼层
5 Passive Components Just as the PCB and any active devices have associated parasitic elements, so do simple passive components such as capacitors and inductors. Knowledge of the physical properties of these passive components can assist with the circuit design and the choice of component.
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发表于 2017-2-4 08:25:32 | 显示全部楼层
下来看看先
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发表于 2017-2-8 11:00:34 | 显示全部楼层
要好好学习下
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发表于 2017-2-8 13:32:05 | 显示全部楼层

不错不错,好东西,多谢了
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