DM642应用程序移植

boniel

【文件名】:06414@52RD_DM642应用程序移植.pdf
【格　式】:pdf
【大　小】:326K
【简　介】:
【目　录】:

taoqishuijing

【文件名】:111227@52RD_datasheet.pdf
【格　式】:pdf
【大　小】:2352K
【简　介】:
【目　录】:1 OMAP-L138 Low-Power Applications Processor . 1 6.8 Power and Sleep Controller (PSC).................. 93
1.1 Features .............................................. 1 6.9 EDMA ............................................... 98
1.2 Trademarks ........................................... 4 6.10 External Memory Interface A (EMIFA)............. 104
1.3 Description............................................ 5 6.11 DDR2/mDDR Controller............................ 113
1.4 Functional Block Diagram ............................ 7 6.12 MMC / SD / SDIO (MMCSD0, MMCSD1) ......... 126
2 Revision History ......................................... 9 6.13 Serial ATA Controller (SATA)...................... 129
3 Device Overview........................................ 10 6.14 Multichannel Audio Serial Port (McASP) .......... 131
3.1 Documentation Support ............................. 10 6.15 Multichannel Buffered Serial Port (McBSP)........ 140
3.2 Device Characteristics .............................. 10 6.16 Serial Peripheral Interface Ports (SPI0, SPI1)..... 150
3.3 Device Compatibility................................. 12 6.17 Inter-Integrated Circuit Serial Ports (I2C) .......... 176
3.4 ARM Subsystem .................................... 12 6.18 Universal Asynchronous Receiver/Transmitter
3.5 DSP Subsystem..................................... 15 (UART) ............................................. 180
3.6 Memory Map Summary ............................. 21 6.19 Universal Serial Bus OTG Controller (USB0)
[USB2.0 OTG] ..................................... 182
3.7 Pin Assignments .................................... 25 6.20 Universal Serial Bus Host Controller (USB1)
3.8 Pin Multiplexing Control ............................. 28 [USB1.1 OHCI]..................................... 189
3.9 Terminal Functions .................................. 29 6.21 Ethernet Media Access Controller (EMAC) ........ 190
4 Device Configuration .................................. 65 6.22 Management Data Input/Output (MDIO)........... 198
4.1 Boot Modes ......................................... 65 6.23 LCD Controller (LCDC) ............................ 200
4.2 SYSCFG Module .................................... 65 6.24 Host-Port Interface (UHPI)......................... 215
5 Device Operating Conditions ........................ 68 6.25 Universal Parallel Port (uPP) ...................... 223
5.1 Absolute Maximum Ratings Over Operating 6.26 Video Port Interface (VPIF) ........................ 228
Junction Temperature Range
(Unless Otherwise Noted) ................................. 68 6.27 Enhanced Capture (eCAP) Peripheral............. 234
5.2 Recommended Operating Conditions............... 69 6.28 Enhanced High-Resolution Pulse-Width Modulator
(eHRPWM)......................................... 237
5.3 Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating Junction 6.29 Timers.............................................. 242
Temperature (Unless Otherwise Noted) ............ 71 6.30 Real Time Clock (RTC) ............................ 244
6 Peripheral Information and Electrical 6.31 General-Purpose Input/Output (GPIO)............. 247
Specifications ........................................... 72 6.32 Programmable Real-Time Unit Subsystem
6.1 Parameter Information .............................. 72 (PRUSS) ........................................... 251
6.2 Recommended Clock and Control Signal Transition 6.33 Emulation Logic .................................... 254
Behavior ............................................. 73 7 Mechanical Packaging and Orderable
6.3 Power Supplies...................................... 73 Information ............................................. 261
6.4 Reset ................................................ 74 7.1 Device Support..................................... 261
6.5 Crystal Oscillator or External Clock Input ........... 77 7.2 Thermal Data for ZCE Package ................... 263
6.6 Clock PLLs .......................................... 78 7.3 Thermal Data for ZWT Package ................... 264