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Job Description
You will work closely with a world-class team of IC designers to perform physical design of highly-integrated, high-performance ICs with RF, analog, mixed-signal, and digital signal processing systems integrated on a single chip. Responsibilities include physical design of demanding mixed-signal and RF layout blocks, chip-level floorplanning, place and route of digital blocks, top-level chip assembly, full-chip verification, chip tapeout, and mask data verification. This position will require strong communication and problem-solving skills. Versatility, initiative and the ability to adapt to a dynamic startup environment are essential.
Requirement:
BS Degree in EE (with relevant specialization) or higher, with 5+ years of industrial working experience.
Experience in analog and digital IC physical design with exposure to top-level assembly and chip tapeout procedures
Solid understanding of physical, electrical rules and DFM rules for fine-geometry CMOS processes
Direct experience in RF layout and knowledge of semiconductor devices and fabrication principles
Proficiency in block level floorplanning, understanding of device matching issues such as WPE and STI
Ability to estimate and minimize parasitics prior to detailed layout extraction
Comprehension of isolation issues and ability to create effective shielding / isolation structures
Experience with industry-standard layout and verification tools (Cadence: Viruoso, Assura, Encounter; Mentor: Calibre) and proficiency in a Unix workstation environment
Experience with PCB layout tools, lab test and measurement equipment, VBA programming or LabView programming beneficial.
有意向者请联系Veronica,发送简历至veronica@genhr.com
或拨打65081009转131
或15921267159
谢谢! |
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