找人合作翻译一本书《Understanding Fabless IC Technology》

genius1978

我看到麦格劳希尔的一本书，觉得非常好，想翻译过来，有没有人愿意一起来翻译。

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书名：《Understanding Fabless IC Technology》
目录：

Acknowledgements .............................................................................................xv
Preface .............................................................................................................xvii

PART 1 – Manufacturing Strategies: Understanding Fabless IC Technology ....... 1
制造策略：理解无晶圆IC技术
Chapter 1: More than a Decade of Transition in the Semiconductor Industry .............. 3
半导体产业的10年转变
1.1 FSA is Established .........................................................................................3

1.2 Early Success ................................................................................................3
早期的成功
1.3 Early Success Trend Continues .......................................................................6
仍在
1.4 Semiconductor Business Models ....................................................................7
半导体公司的商业模式
1.4.1 Integrated Device Manufacturer ............................................................8
整合元件厂商
1.4.2 Fabless ................................................................................................8
无晶圆厂
1.4.3 Hybrids ...............................................................................................9
混合厂商
1.4.4 Foundries ..........................................................................................10
晶圆代工厂
1.5 Outsourcing Will Accelerate ........................................................................10
外包将会加速
1.6 IDMs are Going Fabless ...............................................................................14
整合元器件厂商向无晶圆厂过渡
1.6.1 Semiconductor Firms are Forging a New Path ......................................14
半导体公司另辟蹊径
1.6.1.1 Outsourcing: A Fundamental Model for Success ......................15
外包：走向成功的基本模式
1.7 A Case Study: Cypress Semiconductor ..........................................................18
案例分析：塞普拉斯半导体
1.8 More IDMs are Outsourcing ........................................................................20
越来越多的整合器件厂商将业务外包
1.9 Geographic Manufacturing Centers .............................................................22
地理上的制造中心
Chapter 2: Fabless Semiconductor Manufacturing ................................................. 25
无晶圆厂是如何生产半导体的？
2.1 Foundry Revenue Growth ............................................................................25
晶圆代工厂商收益增长
2.2 Semiconductor Back-End Services ................................................................27
半导体的后端服务
2.3 Semiconductor Equipment ..........................................................................29
半导体设备
Chapter 3: Qualities of Successful Fabless Companies ............................................ 33
成功的无晶圆半导体厂商所具备的特质
3.1 Defining Events for the Fabless Market .........................................................33
无晶圆市场大事记
3.2 Thriving in the Fabless Model ......................................................................33
蒸蒸日上的无晶圆厂模式
3.2.1 Application-Specific Standard Products ..............................................34
真对特殊应用的标准产品
3.2.2 Programmable Logic ..........................................................................34
可编程逻辑
3.2.3 High-Performance Processors ............................................................34
高性能处理器
3.2.4 High-Speed SRAM .............................................................................34
高速SRAM
3.3 Key Qualities for Success .............................................................................35
成功的关键因素
3.3.1 Essential Market and Customer Understanding ..................................35
重要市场和客户理解
3.3.2 Relentless Focus on Execution ............................................................36
连续聚焦完成
3.3.3 Relentless Focus on Costs ..................................................................36
连续聚焦成本
3.3.4 Management ....................................................................................37
管理
3.4 The Future of Fabless ..................................................................................37
无晶圆厂的未来
PART 2 – An In-Depth Understanding of the Fabless Semiconductor Business Model ............................................................................................... 39
深入了解无晶圆半导体厂的商业模式
Chapter 4: Semiconductor Manufacturing Basics ................................................... 41
半导体制造基础
4.1 Semiconductor Processes ............................................................................41
半导体制造流程
4.1.1 CMOS ..............................................................................................41
CMOS
4.1.2 Specialty/Compound ........................................................................41
特殊/复合
4.2 Semiconductor Manufacturing Steps ...........................................................42
半导体制造的步骤
4.3 Wafer Size ..................................................................................................43
晶圆的型号
4.4 Manufacturing Costs ..................................................................................44
制造成本
4.5 Conclusion .................................................................................................45
总结
Chapter 5: Fabless ASICs ................................................................................... 47
无晶圆厂的ASICs芯片
5.1 Introduction ...............................................................................................47
介绍
5.2 Origins of the ASIC Industry ........................................................................47
原始的ASIC行业
5.3 Emergence of the Fabless ASIC Business Model ............................................48
无晶圆厂ASIC产品商业模式初露苗头
5.4 The Fabless ASIC Model: How It Works .......................................................48
无晶圆厂的ASIC模式是怎么运作的
5.5 The Services and Capabilities of a Fabless ASIC Supplier ...............................49
ASIC无晶圆厂供应商应具备的服务和能力
5.5.1 Physical Design .................................................................................49
物理设计的能力
5.5.2 Selecting and Integrating IP into an SOC Design .................................51
选择并整合IP完成一个SoC设计的能力
5.5.3 Package Design .................................................................................51
封装设计的能力
5.5.4 Design for Testability and Production Test ..........................................51
设计测试和生产测试
5.5.5 Characterization ...............................................................................52
特征描述
5.5.6 Quality and Reliability .......................................................................52
质量和可靠性
5.5.7 Volume Manufacturing .....................................................................53
量产
5.6 Conclusion .................................................................................................54
总结