著名PC制造商 硬件测试手册

Pennell429

1 General Description............................................................................................................8
1.1 Disclaimer 8
2 NPI Checklist......................................................................................................................9
3 Notification of Change Requirements............................................................................11
4 Documentation Requirements.........................................................................................12
4.1 General Product Design Documents 12
4.2 Safety and Compliance Agency Documents 12
4.3 Manufacturing 12
4.4 Service 12
5 Product Classification......................................................................................................13
6 Sample Size.......................................................................................................................14
6.1 Objective 14
6.2 Description 14
7 Regulatory and Environmental Requirements...............................................................16
7.1 Service 16
7.2 Product Safety Agency Approvals 16
7.3 Electro-Magnetic Interference, Certification 16
7.4 Environmental Requirements 16
8 Test Requirements for External Reference....................................................................17
9 Specifications...................................................................................................................18
9.1 Environmental 18
9.2 EMC 19
9.3 Safety 20
9.4 Datacom 21
9.5 X-Ray Radiation 21
9.6 Ergonomics 21
9.7 Product Stewardship “Green PC” 22
9.8 Regulatory specifications for Bluetooth and 802-11b devices 23
10 Safety................................................................................................................................24
10.1 Objective 24
10.2 HBSE 25
10.3 Testing 26
10.4 Documentation 27
11 EMC...................................................................................................................................30
11.1 Objective 30
11.2 General Requirements 30
11.3 EMC Tests and Standards 30
11.4 Test Report Requirements 32
11.5 Acceptance criteria for Immunity tests: Interpretation. 34
11.6 Documentation 34
11.7 Marking and Labeling of Devices 34
12 ESD Test Procedure.........................................................................................................35
12.1 Objective 35
12.2 Test Requirements 35
12.3 Equipment and Software 35
12.4 Test Samples 35
12.5 Test Specification 35
12.6 Operating Conditions 36
12.7 Test Procedure 36
12.8 Test Results Criteria 37
12.9 Deliverables 38
13 Acoustic Test Procedure..................................................................................................41
13.1 Objective 41
Hardware Quality Test Manual
Consumer PC Division Hardware Quality Test Manual Page 5 of 106
Revision 2.2 Last Modified: 04/15/05
mpany Confidential
*** Co***
13.2 Test Requirements 41
13.3 Equipment and Software 41
13.4 Test Samples 41
13.5 Test Specification 41
13.6 Operating Conditions 43
13.7 Sound Pressure Test Procedure 43
13.8 Magnetic Storage 43
13.9 Optical Storage 43
13.10 Calculating Sound Pressure 44
13.11 Sound Power Test Procedure 44
13.12 Calculating Sound Power 45
14 Temperature and Humidity Test Procedure...................................................................48
14.1 Objective 48
14.2 Equipment and Software 48
14.3 Test Samples 48
14.4 Test Specifications 48
14.5 Operating & Non-Operating Conditions 48
14.6 Procedure 48
14.7 Test Results Criteria 49
14.8 Deliverables 49
15 Thermal Profile Test Procedure.......................................................................................51
15.1 Objective 51
15.2 Equipment and Software 51
15.3 Test Samples 51
15.4 Test Specifications 52
15.5 Operating Conditions 52
15.6 Setup Procedure 52
15.7 Test Procedure 53
15.8 Test Results Criteria 55
15.9 Deliverables 56
16 Shock Test Procedure......................................................................................................59
16.1 Objective 59
16.2 Equipment and Software 59
16.3 Test Samples 59
16.4 Test Specifications 59
16.5 Operating Conditions 59
16.6 Half-Sine Shock - End-Use Handling, Non-Operational 59
16.7 Trapezoidal Shock –Transportation Environment, Non-Operational 61
16.8 PASS/FAIL CRITERIA 62
16.9 Deliverables 62
17 Vibration Test Procedure.................................................................................................65
17.1 Objective 65
17.2 Equipment and Software 65
17.3 Test Samples 65
17.4 Test Specifications 65
17.5 Operating Conditions 65
17.6 Test I: Random Vibration Test - Operating 66
17.7 Test II: Vibration – Sweep Sine, Non-Operational 67
17.8 Test III: Random Vibration – Survival, Non-Operational 68
17.9 Pass/Fail Criteria 68
17.10 Deliverables 69
18 DC Margin/4 Corner Test Procedure...............................................................................71
18.1 Objective 71
18.2 Equipment and Software 71
18.3 Test Samples 71
Hardware Quality Test Manual
Consumer PC Division Hardware Quality Test Manual Page 6 of 106
Revision 2.2 Last Modified: 04/15/05
mpany Confidential
*** Co***
18.4 Test Specifications 71
18.5 Operating Conditions 71
18.6 Procedure 71
18.7 Test Results Criteria 72
18.8 Deliverables 72
19 Altitude Test Procedure...................................................................................................74
19.1 Objective 74
19.2 Equipment and Software 74
19.3 Test Samples 74
19.4 Test Specifications 74
19.5 Operating Conditions 74
19.6 Procedure 75
19.7 Test Results Criteria 75
19.8 Deliverables 75
20 Powercycling Test Procedure..........................................................................................77
20.1 Objective 77
20.2 Equipment and Software 77
20.3 Test Samples 77
20.4 Test Specifications 77
20.5 Operating Conditions 77
20.6 Procedure 77
20.7 Test Results Criteria 78
20.8 Deliverables 78
21 Packaging Test Procedure....................................................................................................81
21.1 Objective 81
21.2 Equipment and Software 82
21.3 Test Samples 83
21.4 Test Specifications 83
21.5 Operating Conditions 83
21.6 TEST 1: Compression Test 83
21.7 TEST 2: Random Vibration Survival, Non-Operational 84
21.8 TEST 3: Impact Test - Type 3A and 3B Shipping Unit 86
21.9 TEST 4: Horizontal Impact for Type 3A and Type 3B 88
21.10 TEST 5: Drop Test for Type 1 Products 89
21.11 TEST 6: Drop Test for Type 1 High Exposure 90
21.12 TEST 7: Drop test for Type 3A 91
21.13 TEST 8: Drop Test for Type 3B 92
21.14 TEST 9: Production Test for Bundle Manufacturing and Warehousing 93
21.15 TEST 10: Production Trial for Bundle Manufacturing and Warehousing 94
21.16 Deliverables 95
22 PLD (Power Line Disturbance) Test Procedure.............................................................96
22.1 Objective 96
22.2 Equipment and Software 96
22.3 Test Samples 96
22.4 Test Specifications 96
22.5 Operating Conditions 96
22.6 Survival Conditions 97
22.7 Safety Notice 98
22.8 Procedure 98
22.9 Test Results Criteria 98
22.10 Deliverables 99
23 Reliability Test Program.................................................................................................100
23.1 Objective 100
23.2 Thermal Evaluation 100
23.3 Over Temperature Step Stress Test 100
Hardware Quality Test Manual
Consumer PC Division Hardware Quality Test Manual Page 7 of 106
Revision 2.2 Last Modified: 04/15/05
mpany Confidential
*** Co***
23.4 110% Electrical Overload Stress Test 101
23.5 Strife Test 101
23.6 MTBF Verified 102
23.7 ORT (Ongoing Reliability Testing) 102
23.8 Process Capability 102

Pennell429

我的附件呢[em10]
【文件名】:1078@52RD_Hardware quality test.pdf
【格　式】:pdf
【大　小】:2759K
【简　介】:
【目　录】: