MTK Layout Guide

donglang2007 · 发表于 2010-5-26 22:33:23

台湾硬件工程师15年layout经验分享！
【文件名】:10526@52RD_Layout Guide-V1.0-070905.doc
【格　式】:doc
【大　小】:3872K
【简　介】:
【目　录】:

LAYOUT REPORT .................................................................................................................. 1
目錄.......................................................................................................................................... 1
1. PCB LAYOUT 術語解釋(TERMS)......................................................................................... 2
2. Test Point : ATE 測試點供工廠ICT 測試治具使用.................................................... 2
3. 基準點 (光學點) -for SMD:........................................................................................... 4
4. 標記 (LABEL ING)............................................................................................................. 5
5. VIA HOLE PAD..................................................................................................................... 5
6. PCB Layer 排列方式.......................................................................................................... 5
7.零件佈置注意事項 (PLACEMENT NOTES)........................................................................... 5
8. PCB LAYOUT 設計................................................................................................................ 6
9. Transmission Line ( 傳輸線 )..................................................................................... 8
10.General Guidelines – 跨Plane.................................................................................. 8
11. General Guidelines – 繞線....................................................................................... 9
12. General Guidelines – Damping Resistor............................................................. 10
13. General Guidelines - RJ45 to Transformer......................................................... 10
14. Clock Routing Guideline........................................................................................... 12
15. OSC & CRYSTAL Guideline........................................................................................... 12
16. CPU 􀃎 RAM􀃎FLASH.................................................................................................... 14
17. General Guidelines –Decoupling Capacitor..................................................... 14
18.POWER 部分........................................................................................................................ 15
19. GND & Vcc Plan 切割................................................................................................... 17
20. DRC : Design Rule Check........................................................................................... 19
21. CAM 輸出/輸出文件(參考gerber file 流程圖)........................................................ 20
22. 其他注意事項................................................................................................................. 21
23.PCB 製作規範填寫注意事項............................................................................................ 23

bjohn · 发表于 2010-5-28 22:53:36

1. PCB工艺
1）线宽/线距：0.1mm/0.1mm，表层局部可以按3mil/3mil处理（主要是infenion DSP）
2）钻孔：
a. Laser via(via12,via56/via78):  4mil/10mil
b. Buried via(via25/via27):    8mil/16mil
c. Through via(via16/via18):    8mil/16mil
3) 迭层结构：(目前两个平台的项目均是参考以下两种迭层，如果以下两种不能满足要求，可以和厂家协商，修改迭层)

frankleee · 发表于 2010-5-30 23:58:25

支持我们已经有这个资料了

shenqjsz · 发表于 2010-6-4 17:52:43

顶一下再看

zhxc1228 · 发表于 2011-6-4 11:50:07

Thank you very much[em04][em04], Thank you very much

san_water · 发表于 2011-6-9 16:19:24

何必都搞的这么贵呢，^_^，虽然我有了

ip_chen · 发表于 2011-6-9 19:21:25

hhhhhhhh

sandy123470031 · 发表于 2013-12-11 09:26:21

为何我看不到资料，附件在哪里呢?如何购买？

sandy123470031 · 发表于 2013-12-11 09:26:46

为何我看不到资料，附件在哪里呢?如何购买？

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[资料] MTK Layout Guide