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POSITION SUMMARY
Design, build, test, and debug Windows Mobile BSP (Board Support Package) for mobile computer products. Provide tier III level support for field issues.
PRINCIPAL RESPONSIBILITIES
Area of Responsibility [/COLOR]
1. Design and coding of Windows Mobile operating system 
Device driver development and integration into Windows Mobile BSP.
Perform System level tuning / balancing and resource management for Windows Mobile BSP
Coding of System functions (Bootloader, IPL, …etc) in C/C++ and Assembly
2. Test and debug of Windows Mobile BSP 
Design, Develop, and Execute BSP stress / reliability applications.
Design and execute Device driver stress / reliability tests
Execute BSP test plan and document results; including Design Validation Testing (DVT) and Engineering Validation Testing (EVT).
Design, document, and implement corrective action (i.e. bug fix) for assigned issues
3. Triage customer level III customer issues. 
Develop reliable reproduction process for field issues
Work with PSO (level II) team to communicate corrective action plan
Assist with bug identification and corrective action plan.
4. Execute formal Logo Test Kit (LTK) testing of Windows Mobile BSP
Execute intermediate and formal LTK testing.
Document and track LTK MTTF testing on intermediate builds and regression testing.
Develop and submit formal LTK documentation for Logo Certification
KNOWLEDGE, SKILLS AND ABILITIES
Education level and/or relevant experience(s)
Bachelor of Science in Computer Engineering, Electrical Engineering, or Computer Science.
2 – 5 yeas experience working with commercially available RTOS (Real Time Operating System). Proprietary RTOS experience is not acceptable.
Win32 device driver development experience.
2 – 5 years embedded development experience (firmware, operating system development)
Knowledge and skills (general and technical) [/COLOR]
Strongly prefer Windows Mobile® BSP development experience.
Prefer Windows Embedded® / Windows CE® development BSP development experience.
Alternative telephony operating system (Android®, Symbian®) development experience is desirable.
Strong C/C++ development skills are required. Experience in ARM® assembly development is desirable.
Strong ability to debug complex BSP issues is required.
Experience at optimizing a BSP for power management and performance is desired.
Other requirements (licenses, certifications, specialized training, physical or mental abilities required)[/COLOR]
Ability to read and write English is required
补充几点：
工作地点：苏州工业园区
薪资待遇：1年13薪+2-3个月的绩效奖金+车贴+苏州工业区标准的四金福利（国内最高）+额外医疗保险
注意事项：英文可以做技术口头交流，面试中会有美国总部的英文电话面试环节
发展目标：目前是一个全新的团队，这个BU将会发展新一代智能手机平台下手持条形码扫描设备系统，如果应聘者除了熟悉windwosCE/Mobile系统开发之外，也熟悉Android或者Symbian系统更佳，薪资还有一定程度提高。
本人联系方式如下：
电子邮件：bill@21cnmanager.com
QQ：5667805
msn: jialei.liu@hotmail.com
Gtalk: jialei.liu@gmail.com
[此贴子已经被作者于2010-4-7 10:04:06编辑过] |
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发表于 2010-4-6 15:31:46
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