BGA测试插座

lingmeitest

Fast Lock IC Development Sockets - Over View
very easy open/close method,no screws, no tools required

SMT, thru hole or compression mount

Bandwidths up to 3GHz (SMT)

Bandwidths over 10GHz (compression mount)

Integrated aluminum heatsink available

Lid opening allows for failure analysis/probing

Lid opening allows for optical IC development

Low profile and mounts in IC's footprint (SMT mount)

Pitches down to 0.5mm (SMT and thru hole mounts) or 0.4mm (compression mount)

Any grid



Fast-Lock Type BGA Socket Data Sheet

MECHANICAL DATA

Contact life:
10,000 cycles min.

Solderability :
as per IEC 60068-2-58

Individual contact force:
40 grams max.


MATERIAL
Insulator (RoHS Compliant):
High temp plastic or epoxy FR4

Terminal (RoHS compliant):
Brass

Contact (RoHS compliant):
BeCu


ELECTRICAL DATA

Contact resistance:
< 100 mΩ

Current rating:
500 mA max.

Insulation resistance:
at 500V DC  100 MΩ if 0.50 to 0.80mm pitch
                  500 MΩ 1.00mm pitch upwards

Breakdown voltage:
  at 60 Hz   500V min.

Capacitance:
< 1 pF

Inductance:
< 2 nH

Operating temperature:
-55°C to +125°C ; 260°C for 60 sec.



　
These sockets are available for almost any IC package style, size, lead-count and lead-pitch down to 0.5mm pitch: BGA, MLF/QFN, uBGA, SOIC, QFP and also custom packages or die. Furthermore, these sockets provide flexibility in the PCB mounting method: SMT, raised SMT, through-hole, or compression mount.
SMT (pin type -30) uses a standard reflow process to mount the sockets to the target PCB. These sockets mount in the same footprint as the IC, but typically require a mimimum clearance of 6mm betyond the package's periphery. In situations where adjacent components lie in this area, either the socket body can be modified to clear the components, or a special raised SMT (pin types -28 or -29) pin can be used in place of the standard SMT pin. These pins raise the socket body from 2-5mm above the PCB. Although this method does not require any drilled holes in the target PCB, it is highly recommended to provide two such plated holes in order to accomodate mounting pegs and greatly strengthen the physical connection between the socket and PCB. Alternatively, epoxy can be used to strengthen the connection, but this more or less creates a permanent bond between the socket and PCB.
Through-hole (pin type -70) requires plated holes to be drilled in the PCB into which the pins of the socket will be soldered. This provides for a very robust and reliable electrical and mechancial connection. However, the electrical performance is reduced due to the longer pin lengths. This method is highly suitable for burn-in applications.
Compression (pin type -90) mount removes the need for any soldering and just requires the socket to be held to the PCB via screws. The benefit of this method is that it allows the customer to easily attach the socket to the target board in the lab, without the extra cost, lead-time, and potential problems caused by sending the board to an assembly house. However, this method requires that the target PCB has mounting holes drilled to accomodate the mounting screws and socket body alignment posts. Furthermore, depending on the size of the IC, the PCB thickness, etc., a backing plate is required to provide rigidity and ensure the socket pins contact the PCB pads. This plate can usually be modified to accomodate any backside compononents.
   
SMT (-28, -29, -30) Through-Hole (-70) Compression (-90)

SOCKET BODY VERTICAL OFFSET
The following table shows the vertical clearance of the socket body from the PCB. This is only applicable to the SMT mounting style. In situations where the clearance is insufficient, or the standard SMT pin is preferred, it is possible to modify the socket body to accomodate for adjacent components.
　Pitch  Vertical Offset Using Special Raised SMT
(-28)  Vertical Offset Using Raised SMT
(-29)  Vertical Offset Using Standard SMT
(-30)  
0.50-0.75  N/A  2.3  0.4  
0.8  4.5  2.8  0.6  
1.00  4.5  3.2  0.8  
1.27  N/A  5.0  1.2  
Dimensions in mm
FEATURES & BENEFITS
Easily exchange ICs in your system
High bandwidth: 3GHz @ -1dB
Available for any IC package style: BGA, uBGA, CSP, QFN/MLF, LGA, PGA, SOIC, QFP, custom or die
Any lead count, grid and package size
Minimum 0.5mm lead pitch
Maximum 40g force per contact
Mounts to same PCB footprint as the IC (no holes required for SMT version)
Low profile: <10mm high with IC
Minimal keepout area: approx. 6mm beyond ICs periphery
Raised SMT version available for lifting socket over adjacent components
Heat dissipation via lid cut-out or integrated heatsink
Thermal expansion, shock & vibration absorbed by contact design
LGA contact design can also be used for board-to-board connections
Standard-process design & manufacturing = lower cost and tailored to your needs


http://www.lm-power.cn/E-TEC.htm