QSC6010™, QSC6020™, QSC6030™QUALCOMM Single Chi

jackqiao

1        Introduction
1.1        Documentation overview...................................................................................... 12
1.2        Concise device and application descriptions ........................................................ 14
1.2.1        Analog/RF functional description........................................................ 17
1.2.2        Baseband functional description .......................................................... 19
1.2.3        Power management functional description .......................................... 20
1.3        Device features ..................................................................................................... 21
1.3.1        Analog and RF features ....................................................................... 21
1.3.2        Baseband features ................................................................................ 23
1.3.3        Power management features ................................................................ 27
1.3.4        QSC60X0 variants ............................................................................... 29
1.4        Terms and acronyms............................................................................................. 30
1.5        Special marks ....................................................................................................... 32

2        Pin Definitions
2.1        I/O parameter definitions...................................................................................... 33
2.2        Pin assignments .................................................................................................... 34
2.3        Pin descriptions .................................................................................................... 48

3        Electrical Specifications
3.1        Absolute maximum ratings .................................................................................. 73
3.2        Recommended operating conditions .................................................................... 74
3.3        DC power consumption........................................................................................ 75
3.3.1        Power consumption from VDD ........................................................... 75
3.3.2        Power consumption from internal regulators ....................................... 77
3.3.3        Off-state power consumption ............................................................... 79
3.4        Digital logic characteristics .................................................................................. 80
3.4.1        Digital I/O specifications - baseband functions ................................... 80
3.4.2        Digital I/O specifications - power management functions................... 83
3.5        Timing characteristics .......................................................................................... 84
3.5.1        Timing diagram conventions................................................................ 84
3.5.2        Pad design methodology ...................................................................... 84
3.6        Analog and RF performance specifications ......................................................... 87
3.6.1        RF receiver performance...................................................................... 87
3.6.2        RF transmitter performance ................................................................. 92
3.6.3        CODEC performance........................................................................... 93
3.6.4        Housekeeping ADC performance ...................................................... 107
3.7        Baseband performance specifications ................................................................ 108
3.7.1        Processor characteristics .................................................................... 108
3.7.2        Memory support................................................................................. 110
3.7.3        Single EBI bus ................................................................................... 113
3.7.4        Dual EBI bus ...................................................................................... 129
3.7.5        Connectivity ....................................................................................... 151
3.7.6        Camera and video .............................................................................. 151
3.7.7        Air interfaces...................................................................................... 152
3.7.8        Interfaces with other functions........................................................... 152
3.7.9        Internal functions ............................................................................... 153
3.7.10        General purpose I/Os ......................................................................... 154
3.8        Power management performance specifications ................................................ 155
3.8.1        Input power management................................................................... 155
3.8.2        Output voltage regulation................................................................... 168
3.8.3        General housekeeping ........................................................................ 177
3.8.4        User interfaces.................................................................................... 184
3.8.5        PM status and control interfaces ........................................................ 188
3.8.6        Multi-purpose pins ............................................................................. 193

4        Mechanical Specifications
4.1        Device physical dimensions ............................................................................... 195
4.2        Thermal characteristics....................................................................................... 196
4.3        Device moisture sensitivity level........................................................................ 196
4.4        Device marking .................................................................................................. 197

5        PCB Mounting Specifications
5.1        Land pad and stencil design ............................................................................... 198
5.2        SMT process characterization ............................................................................ 200
5.3        SMT process verification ................................................................................... 201
5.4        Storage conditions, unpacking, and handling..................................................... 201
5.4.1        Storage conditions.............................................................................. 201
5.4.2        Out-of-bag duration ........................................................................... 201
5.4.3        Baking ................................................................................................ 201
5.4.4        Electrostatic discharge ....................................................................... 202
6        Packing Methods and Materials

Contents

6.1        Tape and reel information................................................................................... 203
6.2        Packing for shipment.......................................................................................... 204
6.3        Packing materials ............................................................................................... 206
6.3.1        Shipping box barcode label................................................................ 206
6.3.2        Moisture barrier bag........................................................................... 207
6.3.3        Humidity indicator cards.................................................................... 208

7        Part Reliability
7.1        QSC60X0 351 MSP reliability qualification summary...................................... 209
7.2        Qualification sample description ........................................................................ 210

jackqiao

【文件名】:09518@52RD_80-VA552-1.pdf
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jjfoxzhou

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wgx2zxr

谢谢楼主

YUN12

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caowei1732

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wgzllcx

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wenjianbin

多谢楼主
不要钱就好了

wenjianbin

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alphasyc99

[em14][em14]

yuxiangj

谢谢分享.........................

balu_dark

[em14][em14] bravo

54n

thanks....

yjx0352

多谢楼主，感激不尽啊～

jzzhufeng

多谢楼主，感激不尽啊～
本文来自：我爱研发网(52RD.com) - R&D大本营
详细出处：http://www.52rd.com/bbs/Dispbbs.asp?BoardID=35&ID=158330

jzzhufeng

多谢楼主，感激不尽啊～
本文来自：我爱研发网(52RD.com) - R&D大本营
详细出处：http://www.52rd.com/bbs/Dispbbs.asp?BoardID=35&ID=158330

jzzhufeng

多谢楼主，感激不尽啊～
本文来自：我爱研发网(52RD.com) - R&D大本营
详细出处：http://www.52rd.com/bbs/Dispbbs.asp?BoardID=35&ID=158330

jzzhufeng

多谢楼主，感激不尽啊～
本文来自：我爱研发网(52RD.com) - R&D大本营
详细出处：http://www.52rd.com/bbs/Dispbbs.asp?BoardID=35&ID=158330

six_1_2

好东西，谢谢了

flywithme

还有效吗？怎么看不到链接？