寻找笔记本电脑整机测试资料

lly318

里面要包括,老化测试,兼容性测试,可靠性测试,
要深入到每个测试的内容.可以送3RD币.

hardyfung

ddddddddddddddddd

wujie_027

关注中哦

evan710

这么多人关注!怎么就没哪个大侠出手相助呢![em03]

dhlgdx2002

筆記本測試和臺式機測試其實都差不多，以下意見僅供參考

老化测试:主要還是高低溫下run程式、 reboot、winboot、on/off等一定時長及環境

兼容性测试:兼容性測試主要還是測試各種常用軟件吧比如3D MARK、passmark、burin test，photoshot，ccwinstone等還有一些常用的office之類的測試，公司大就多安排點，公司小人力少就少安排點

可靠性:的話就要考慮到外部電源拉偏的情況下的高低溫測試，不僅僅考慮到run程式過程中系統的穩定性，還要測試筆記本內部各power mos，IC等的thermal等，詳細計劃還是要根據自己公司的具體情況具體考慮，不可一概而論~

xwh283

Hewlett Packard Company(HP) Mobile Platform Engineering System Validation Requirement Document_Rev4.01

惠普研发内部绝密资料(54MB Word文档)，有需要请下载，谢谢！！！

Hewlett Packard Company
Mobile Platform Engineering SYSTEM(SVTP) Validation Requirement Document
REV: 4.01
Hewlett-Packard Confidential—Need to know required.
Copyright Hewlett-Packard Company, 2002, 2003, 2004, 2005, 2006, 2007, 2008 all rights reserved.
This document contains information proprietary to Hewlett-Packard Company (Hewlett-Packard). Use or disclosure without written permission of an officer of Hewlett-Packard is expressly forbidden.

MOBILE PLATFORM ENGINEERING 2
SYSTEM 2
(SVTP) 2
VALIDATION REQUIREMENT DOCUMENT 2
1. INTRODUCTION 7
1.1 SCOPE 7
1.2 PURPOSE 8
1.3 STATEMENT OF RESPONSIBILITY 8
1.4 REFERENCE INFORMATION 8
1.5 SVTP DOCUMENT OVERVIEW 11
1.6 SVTP TEST WAIVERS 12
1.7 SVTP TEST MATRIX VER. 4.01 13
1.8 QUALIFICATION MATRICES 17
2. ELECTRICAL EVALUATIONS 17
2.1 BASIC FUNCTIONAL/SYSTEM 18
2.2 RESIDUAL VOLTAGE 19
2.3 PARALLEL PORT DRIVE 20
2.4 LAYOUT REVIEW 20
2.5 ETHERNET LAYOUT 21
2.6 ETHERNET ELECTRICAL TEST 22
2.7 SIGNAL INTEGRITY 23
2.8 VGA OUTPUT 24
2.9 SVIDEO/COMPOSITE VIDEO OUTPUT 25
2.10 POWER RAIL LEAKAGE 26
2.11 DVI PORT 27
2.12 PORT LOAD TEST 27
2.13 VIDEO MEMORY INTERFACE 28
2.14 RTC ACCURACY 30
2.15 RTC POWER CONSUMPTION/BATTERY LONGEVITY 31
2.16 POWER MANAGEMENT VERIFICATION 31
2.17 STANDBY (S3) BATTERY LIFE 32
2.18 OFF/HIBERNATION (S5) BATTERY LIFE 33
2.19 SYSTEM STANDBY CYCLING 34
2.20 SYSTEM HIBERNATE CYCLING 35
2.21 BOOT INTEGRITY 35
2.22 POWER CYCLING 36
2.23 LOADED POWER SUPPLY TEST 36
2.24 MEMORY MODULE STRESS TEST 37
2.25 SYSTEM POWER TIMING 38
2.26 VREF VOLTAGE MARGINING 39
2.27 PROCESSOR SIDE BUS (PSB) VREF VOLTAGE MARGINING 43
2.28 DC VOLTAGE MARGIN TEST 47
2.29 DC VOLTAGE MARGIN TEST TO FAILURE 48
2.30 AIRLINE/COMBO ADAPTER TEST 49
2.31 CURRENT DRAW FROM LEGACY AC ADAPTER 50
2.32 CURRENT DRAW FROM BATTERY 51
2.33 PROCESSOR THROTTLING TO PREVENT CURRENT OVERLOAD 52
2.34 VOLTAGE MEASUREMENTS DURING DOCK EVENT 54
2.35 CPU TRANSIENT VOLTAGE TESTING AT MARGIN 54
2.36 THERMAL SOLUTION FUNCTIONAL VERIFICATION 55
2.37 MICROPROCESSOR QUALIFICATION 56
2.38 PROCESSOR P-STATE QUALIFICATION 57
2.39 CPU/MEMORY STRESS TEST 57
2.40 PORT REPLICATOR/DOCK TESTING 58
2.41 ELECTRICAL PRINTED CIRCUIT ASSEMBLY ACOUSTIC NOISE 59
2.42 AUDIO FUNCTIONAL VERIFICATION TEST 61
2.43 SPDIF AUDIO QUALITY TEST 62
2.44 SYSTEM RF INTERFERENCE IN WIRELESS WAN RADIO MODULE RECEIVE BANDS 62
2.45 WIRELESS LAN RADIO INTERFERENCE 64
2.46 EMBEDDED BLUETOOTH MODULE TEST 65
2.47 WLAN FUNCTIONAL TEST 65
2.48 USB 1.1/2.X FUNCTIONALITY TEST 66
2.49 DISPLAY PERFORMANCE VERIFICATION 67
2.50 MODEM ELECTRICAL TEST 69
2.51 EXTENDED RUN-IN TEST 69
2.52 HD CODEC AC TIMING AND SIGNAL INTEGRITY 70
2.53 DIGITIZER TEST 71
2.54 RESISTOR TERMINATION VERIFICATION 71
2.55 SYSTEM BATTERY CHARGER TEST 72
2.56 EXTERNAL WIRELESS RADIO INTERFERENCE TEST 73
2.57 MODEM ON MOTHERBOARD LAYOUT 74
2.58 AMBIENT LIGHT SENSOR TEST 74
2.59 HP SMART ADAPTER FUNCTIONAL TEST 76
2.60 BATTERY FAST CHARGE VERIFICATION 78
2.61 CURRENT DRAW FROM HP SMART AC ADAPTER 78
2.62 DISPLAY INVERTER VALIDATION TEST 80
2.63 ALL-IN-ONE FLASH INTERFACE TEST 83
2.64 POWER CONSUMPTION ON EXTERNAL POWER ADAPTER 84
2.65 WWAN FUNCTIONAL TEST 86
2.66 PANEL BRIGHTNESS TABLE TEST 87
2.67 SIM SIGNAL INTEGRITY 88
2.68 CAMERA TEST 89
2.69 HDMI PORT 90
2.70 POWER RAILS IN TRANSIENT STATES 91
2.71 POWER RAILS IN STEADY STATE 93
2.72 HEADPHONE OUTPUT VOLTAGE LIMITS 94
2.73 BATTERY THERMAL ENVIRONMENT TEST 95
2.74 SATA SIGNAL INTEGRITY 96
2.75 CAPACITIVE BUTTON BOARD TEST 97
2.76 VGA OUTPUT VISUAL QUALITY 99
2.77 BATTERY CAPACITY FOR CRITICAL HIBERNATION 101
3. PERFORMANCE EVALUATIONS 102
3.1 SYSTEM PERFORMANCE BENCHMARKS 102
3.2 BATTERY LIFE TESTS 103
3.3 INTEGRATED MODEM 104
3.4 INTEGRATED NETWORK INTERFACE CARD 104
3.5 RESERVED 105
3.6 RESERVED 105
3.7 EMBEDDED DRAFT 802.11N TEST 105
3.8 WIRELESS LAN PERFORMANCE 107

szkalwa

楼上的，在哪有？

jxliux

DDDDDDDDDDDDDDDDDDDDDDD

zhjping

路过的，还没有一个更好

wangbo351

现在回复可能实效性没有了~不过还是回复下吧。
电脑整机测试，大概需要分下。研发是研发测试，工厂分组装测试、runin测试。
研发测试项目繁杂，测试种类繁多不在这里说了。
工厂组装测试 主要跑在产线上，其中每个厂商都有写DMI信息，有个字串可以标示出识别具体安装的硬件信息。根据这个信息可以进行硬件信息收集，确认是否安装正确的硬件，硬件有没有被驱动起来等等。这部分测试重点在于确保硬件安装预定的型号没有混料，确保硬件都被安装并被识别。同时可以简单的调用各个外设确保驱动正常。例如这里可以进行wifi pair,wifi power,bt pair，camera open/close，S3 ，FN , LED ligth等等测试。runin 重点在CPU负载，mem负载,还有一个最重要的S3，S4。在高负载的情况下S3，S4确保设备不会丢失，确保驱动不会丢失即可。[em02]