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发表于 2009-5-10 09:30:29
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PCBstandards
PCB LAYER CONFIGURATION STACK-UPS
Rev A Layer Configurations.doc 3/20/2003 9:44 AM
a 2003 PCBstandards, Inc. 3/20/2003
02A 02B 02C
Layer 1
Layer 2
(Top)
(Bottom)
(Top)
(GND)
(GND)
(Bottom)
04 A 04 B 04 C 04 D 04 E 04 F
Layer 1
Layer 2
Layer 3
Layer 4
(Top)
(GND)
(PWR)
(Bottom)
(Top)
(PWR)
(GND)
(Bottom)
(PWR)
(Signal)
(Signal)
(GND)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Sig/Pwr)
(Sig/Pwr)
(GND)
(Top)
(Signal)
(Signal)
(Bottom)
06 A 06 B 06 C 06 D 06 E 06 F 06 G 06 H 06 J 06 K 06 L
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
(Top)
(GND)
(Signal)
(Signal)
(PWR)
(Bottom)
(Top)
(PWR)
(Signal)
(Signal)
(GND)
(Bottom)
(Top)
(Signal)
(GND)
(PWR)
(Signal)
(Bottom)
(Top)
(Signal)
(PWR)
(GND)
(Signal)
(Bottom)
(GND)
(Signal)
(GND)
(PWR)
(Signal)
(GND)
(GND)
(Signal)
(PWR)
(GND)
(Signal)
(GND)
(Top)
(GND)
(Signal)
(PWR)
(GND)
(Bottom)
(Top)
(GND)
(PWR)
(Signal)
(GND)
(Bottom)
(Top)
(PWR)
(GND)
(Signal)
(PWR)
(Bottom)
(Top)
(PWR)
(Signal)
(GND)
(PWR)
(Bottom)
(Top)
(Signal)
(Signal)
(Signal)
(Signal)
(Bottom)
08 A 08 B 08 C 08 D 08 E 08 F 08 G 08 H 08 J 08 K 08 L
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
Layer 7
Layer 8
(Top)
(Signal)
(GND)
(Signal)
(Signal)
(PWR)
(Signal)
(Bottom)
(Top)
(Signal)
(PWR)
(Signal)
(Signal)
(GND)
(Signal)
(Bottom)
(Top)
(GND)
(Signal)
(GND)
(PWR)
(Signal)
(GND)
(Bottom)
(Top)
(GND)
(Signal)
(PWR)
(GND)
(Signal)
(GND)
(Bottom)
(GND)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(GND)
(Signal)
(Signal)
(PWR)
(Signal)
(GND)
(GND)
(Signal)
(PWR)
(Signal)
(Signal)
(GND)
(Signal)
(PWR)
(Top)
(GND)
(Sig/Pwr)
(GND)
(Sig/Pwr)
(GND)
(Sig/Pwr)
(Bottom)
(Top)
(GND)
(PWR)
(Signal)
(Signal)
(PWR)
(GND)
(Bottom)
(Top)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Bottom)
10 A 10 B 10 C 10 D 10 E 10 F 10 G 10 H 10 J 10 K
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
Layer 7
Layer 8
Layer 9
Layer 10
(Top)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(GND)
(Bottom)
(Top)
(GND)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(Bottom)
(Top)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(Bottom)
(Top)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(Bottom)
(Top)
(GND)
(Signal)
(PWR)
(GND)
(Signal)
(PWR)
(Signal)
(GND)
(Bottom)
(Top)
(GND)
(Signal)
(PWR)
(Signal)
(Signal)
(PWR)
(Signal)
(GND)
(Bottom)
(GND)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(PWR)
(Signal)
(Signal)
(GND)
(GND)
(Signal)
(Signal)
(PWR)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(GND)
(GND)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(GND)
(GND)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(GND)
12 A 12 B 12 C 12 D 12 E 12 F 12 G 12 H 12 J 12 K 12 L
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
Layer 7
Layer 8
Layer 9
Layer 10
Layer 11
Layer 12
(Top)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Bottom)
(Top)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Bottom)
(Top)
(GND)
(Signal)
(PWR)
(Signal)
(GND)
(PWR)
(Signal)
(PWR)
(Signal)
(GND)
(Bottom)
(Top)
(GND)
(Signal)
(GND)
(Signal)
(PWR)
(GND)
(Signal)
(PWR)
(Signal)
(GND)
(Bottom)
(Top)
(GND)
(Signal)
(Signal)
(PWR)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(GND)
(Bottom)
(Top)
(GND)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(PWR)
(Signal)
(Signal)
(GND)
(Bottom)
(Top)
(GND)
(Signal)
(Signal)
(PWR)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(PWR)
(Bottom)
(Top)
(PWR)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(PWR)
(Signal)
(Signal)
(GND)
(Bottom)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(GND)
(Top)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(GND)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(GND)
(PWR)
Note:
This document is used for the naming convention of the PowerPCB Start Files, PowerPCB CAM Files, PowerPCB
2D-Line “Below Board Text” items and AutoCAD Lay-up Details.
Page 2 of 2
PCBstandards
PCB LAYER CONFIGURATION STACK-UPS
Rev A Layer Configurations.doc 3/20/2003 9:44 AM
a 2003 PCBstandards, Inc. 3/20/2003
14A 14B 14C 14D 14E 14F 14G
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
Layer 7
Layer 8
Layer 9
Layer 10
Layer 11
Layer 12
Layer 13
Layer 14
(Top)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(Bottom)
(Top)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(Bottom)
(GND)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(PWR)
(PWR)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(GND)
(Top)
(GND)
(Signal)
(Signal)
(GND)
(Signal)
(PWR)
(GND)
(Signal)
(PWR)
(Signal)
(Signal)
(GND)
(Bottom)
(Top)
(PWR)
(Signal)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(Signal)
(GND)
(Bottom)
(Top)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Bottom)
16 A 16 B 16 C 16 D
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
Layer 7
Layer 8
Layer 9
Layer 10
Layer 11
Layer 12
Layer 13
Layer 14
Layer 15
Layer 16
(Top)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Bottom)
(Top)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Bottom)
(GND)
(Signal)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(PWR)
(Signal)
(Signal)
(GND)
(Signal)
(PWR)
(PWR)
(Signal)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(GND)
(Signal)
(Signal)
(PWR)
(Signal)
(GND)
Notes:
1. Stack-ups with GND & PWR on outer layers are primarily meant for fanout and short trace runs only. For HDI purposes, the
second layer is a signal layer to run traces from fine pitch BGA’s. In this HDI application, the manufacturer would use laser drills
to perform a control depth drilling process to access layer 2.
2. Balance of laminate thickness between layers from the centerline of the PCB structure is required for all stack-ups in order to
minimize or eliminate warpage. You must determine laminate type and thickness prior to the start of CAD layout.
3. It is imperative that analysis of the stack-up be done with the manufacturer to determine copper weights, prepreg and core
thickness before CAD layout to insure controlled impedance.
4. 1.6mm FR4 material can be used for Stack-ups 2 – 16 Layers. 1.8mm FR4 is used for the 10 - 20 Layer, 2.3mm FR4 is used
for the 10 - 32 Layer stack-ups.
5. Common PC Board thickness’ are:
A. 0.8mm (.031”)
B. 1.0mm (.040”)
C. 1.6mm (.062”)
D. 1.8mm (.070”)
E. 2.3mm (.090”)
F. 3.2mm (.125”)
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