ExpressCard standard (release 1.0) draft -111303

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【文件名】:08710@52RD_ExpressCard standard (release 1.0) draft -111303.pdf
【格　式】:pdf
【大　小】:1467K
【简　介】:This specification describes the Personal Computer Memory Card International Association
(PCMCIA) and the Japan Electronics and Information Technology Industries Association (JEITA)
ExpressCard Standard. It covers the ExpressCard electrical specifications, module specifications,
connector specifications, and host system requirements.
【目　录】:CONTENTS
1. Introduction___________________________________________ 1
1.1 ExpressCard Standard Overview................................................................................................1
1.2 Relationship to the PC Card Standard .......................................................................................2
1.3 Conventions ..................................................................................................................................3
1.3.1 Signal Naming ................................................................................................................................................... 3
1.3.2 Numeric Representation................................................................................................................................... 3
1.4 Terms and Abbreviations.............................................................................................................4
2. Related Documents ____________________________________ 7
3. Electrical Specifications ________________________________ 9
3.1 Signal Descriptions.......................................................................................................................9
3.1.1 Pin Assignments................................................................................................................................................ 9
3.1.2 Signal/Pin Description................................................................................................................................... 12
3.1.2.1 PCI Express Pins.................................................................................................................................. 12
3.1.2.2 Universal Serial Bus (USB) Pins.......................................................................................................... 12
3.1.2.3 SMBus Pins........................................................................................................................................... 12
3.1.2.4 System Auxiliary Pins.......................................................................................................................... 13
3.1.2.5 Power Pins............................................................................................................................................ 13
3.1.3 Voltages and Grounds.................................................................................................................................... 13
3.1.4 SMBus Support................................................................................................................................................ 13
3.2 Module Detection and Operation .............................................................................................14
3.2.1 Module presence pins (CPPE# and CPUSB#) .............................................................................................. 14
3.2.2 PCI Express functional reset (PERST#) ......................................................................................................... 15
3.2.3 PCI Express clock request (CLKREQ#) ......................................................................................................... 16
3.2.4 PCI Express module power control operation ............................................................................................. 16
3.2.4.1 Initial power up for PCI Express-based modules ............................................................................ 16
3.2.4.2 Power state transitions (S0 to S3/S4 to S0) for PCI Express-based modules................................ 17
3.2.4.3 Power down for PCI Express-based modules .................................................................................. 18
3.2.5 USB power control operation ......................................................................................................................... 19
3.2.6 I/O interface detection, set-up and operation.............................................................................................. 19
3.2.7 Power management ........................................................................................................................................ 20
3.2.7.1 PCI Express WAKE#........................................................................................................................... 20
3.2.7.2 PCI Express link power management ............................................................................................... 21
3.2.7.3 USB wakeup......................................................................................................................................... 21
3.3 Electrical Requirements..............................................................................................................21
3.3.1 Signal Interface ................................................................................................................................................ 21
CONTENTS RELEASE 1.0 DRAFT 1.0 - V111303
THIS DRAFT DOCUMENT IS FOR REVIEW ANDDISCUSSION ONLY. THIS DOCUMENT IS NOT FORPUBLICATION OR
GENERAL DISTRIBUTION AND IS SUBJECT TO REVISION OR REJECTION BY THE PCMCIA.
vi All rights reserved.  2003 PCMCIA/JEITA
Registered to:
Draft 1.0 -
v111303
3.3.2 PCI Express Reference Clock (REFCLK) requirements............................................................................... 22
3.3.3 Power Supply Limits ...................................................................................................................................... 23
3.3.4 Power Supply Ramp-up Timing and Sequencing ....................................................................................... 24
4. Module Specifications ________________________________ 27
4.1 Module Dimensions....................................................................................................................27
4.2 Module Electrical Requirements ...............................................................................................34
4.2.1 PCI Express Signal Integrity Requirements.................................................................................................. 35
4.2.1.1 Link Definition .................................................................................................................................... 35
4.2.1.2 Electrical Budgets ................................................................................................................................ 36
4.2.1.2.1 AC Coupling Capacitors ............................................................................................................. 37
4.2.1.2.2 Insertion Loss Values (Voltage Transfer Function) ................................................................. 37
4.2.1.2.3 Jitter Values .................................................................................................................................. 40
4.2.1.2.4 Crosstalk....................................................................................................................................... 41
4.2.1.2.5 Equalization ................................................................................................................................. 42
4.2.1.2.6 Skew within differential pair...................................................................................................... 42
4.2.1.3 Eye diagrams at the ExpressCard module interface ....................................................................... 42
4.2.1.3.1 ExpressCard module transmitter path compliance eye-diagram.......................................... 42
4.2.1.3.2 ExpressCard module minimum Receiver path sensitivity requirements............................. 43
4.2.1.3.3 Host system Transmitter path compliance eye diagram ........................................................ 44
4.2.1.3.4 Host system minimum Receiver path sensitivity requirements ............................................ 45
4.2.2 Grounding/EMI clips..................................................................................................................................... 46
4.2.2.1 Contact resistance requirement and test procedure ........................................................................ 46
4.2.3 Other Electrical Requirements....................................................................................................................... 47
4.3 Module Thermal Requirements ................................................................................................48
4.4 Environmental and Mechanical Requirements.......................................................................49
4.4.1 Environmental Performance.......................................................................................................................... 49
4.4.1.1 Operating Environment ...................................................................................................................... 49
4.4.1.2 Storage Environment ........................................................................................................................... 50
4.4.1.3 High Storage Temperature.................................................................................................................. 50
4.4.1.4 Low Storage Temperature................................................................................................................... 50
4.4.1.5 High Operating Temperature............................................................................................................. 50
4.4.1.6 Low Operating Temperature.............................................................................................................. 51
4.4.1.7 Thermal Shock..................................................................................................................................... 51
4.4.1.8 Moisture Resistance ............................................................................................................................. 51
4.4.1.9 Vibration and High Frequency........................................................................................................... 51
4.4.1.10 Shock..................................................................................................................................................... 52
4.4.1.11 Drop Test.............................................................................................................................................. 52
4.5 Approved Test Procedures ........................................................................................................53
4.6 Labeling (Marking) .....................................................................................................................53
DRAFT 1.0 - V111303 RELEASE 1.0 EXPRESSCARD STANDARD
THIS DRAFT DOCUMENT IS FOR REVIEW ANDDISCUSSION ONLY. THIS DOCUMENT IS NOT FORPUBLICATION OR
GENERAL DISTRIBUTION AND IS SUBJECT TO REVISION OR REJECTION BY THE PCMCIA.
 2003 PCMCIA/JEITA All rights reserved. vii
Registered to:
Draft 1.0 -
v111303
5. Connector Specifications ______________________________ 55
5.1 Module Connector......................................................................................................................55
5.2 Host Connector...........................................................................................................................58
5.3 Connector Electrical Requirements ..........................................................................................60
5.4 Environmental Requirements....................................................................................................62
5.5 Mechanical Requirements..........................................................................................................62
5.6 Additional Requirements...........................................................................................................63
6. Host System Specification _____________________________ 65
6.1 Slot power control requirements...............................................................................................65
6.2 PCI Express Slot Capabilities Register .....................................................................................65
6.3 BIOS ACPI Requirements ..........................................................................................................66

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