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【文件名】:Analog,RF and EMC Considerations in Printed Wiring Board Design.pdf
【格 式】:pdf
【大 小】:1506K
【简 介】: Advances in digital and analog technologies present new
challenges PWB design
? Clock frequencies approach the L Band region
- Dielectric absorption, Skin Depth, Impedances, Dispersion
? High Power and/or Lower Voltage
- Power distribution, decupling
? High dynamic-range/low-noise analog circuitry
- Noise immunity, stability
? High Density Components
- Xilinx FG1156 Fine Pitch BGA (1.0 mm pitch 39 mils)
- Finer pitch BGAs 0.8 mm (31 mils) and 0.5 mm (20 mils)
? Overlap between Disciplines
- Electrical, Mechanical, Manufacturing, Design/Drafting
【目 录】:
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