niuniu302 发表于 2012-5-20 21:21 从模组来讲，并联背光占空PIN脚数量多；串联背光少； 背光IC的构架不同，并联一般用charger pump，串联用DC ...
Undo
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Removeformat
Autotypeset Left Center Right
FloatLeft FloatRight Orderedlist Unorderedlist
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