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以下内容有那位英文高手帮忙翻译一下吗?这资料对我魏重要,小弟英文水平有限,在此谢过了.
E-mail:johny78@21cn.com
Summary of manufacturing requirements
6555 fixed focus VGA module with
JBC lens chip
1) Executive summary:
This document summarizes the basic requirements for manufacturing of the 6555 fixed focus reflow able VGA camera module based on a JBC supplied lens chip. The primary basis for this are the JBC specifications: EO_033_Lens_Req_Spec_VS6555_VGA_2.2_no_focus_AE, 8024923_A and 7593297 RevA . Those specifications have originally been defined for a traditional adjustable focus module with mount and barrel. Therefore as applicable, adaptations have to be made with respect to the present single part fixed focus design.
2) Overview:
The fixed focus VGA module essentially consists of a single part mount moulded of LCP with a glued-in lens chip supplied by JBC.
Fig. 2.1.schematically shows the mount with outer dimensions of 4.5x4.5x2.075mm3. This single part mount has to be moulded from DuPont Zenite 5130L BK LCP. As shown in Fig. 2.2. The outer part of the top surface, side walls and bottom feet are to be metallized with an EMI shielding consisting of at least 1μm Cu covered by 0.1 μm stainless steel.
A cross section of the JBC supplied lens chip with dimensions of 3.5x3.5x1.2 mm3 is schematically shown fin Fig. 2.2. This lens chip is to be glued into the mount forming the fully functional optical module. After visual inspection and verification of optical performance, this part is to be sent in reel tape to the customer.
Fig. 2.1: Scheme of LCP mount top view (left) and bottom view (right). Outer dimensions: 4.5x4.5x2.075mm3
Fig. 2.2: Single piece mount: Schematic view of EMI shielding plated areas. Left: Bottom view with lens, right top view.
Fig. 2.3: Scheme of cross section for the JBC VGA lens chip with dimension of 3.5x3.5x1.2 mm3.
The JBC contract manufacturing partner is expected to deliver the following items for volume production of the module:
a) Manufacturing of N-cavity (N=4, 8, t.b.a.) mould tools which are capable of producing the LCP mount parts in specified quality, dimension and tolerances. Upon agreement, the mould tools can be supplied by JBC from a qualified, external supplier.
b) Moulding of LCP parts in specified quality, dimension and tolerances.
c) Metal plating for EMI shielding of the moulded mount. Upon agreement, this process can be outsourced to an external, JBC approved supplier.
d) Visual inspection, screening and pick-up of JBC supplied lens chip from UV releasing tape frame
e) Gluing of lens chip into module.
f) 100% optical testing and screening of MTF and BFL of the completed module
g) 100% visual OQC for the finished goods
h) Packing in reel tape, strictly sorted by mould tool and cavity, sealing in agreed upon shipping containers.
i) Generation and supply of all required shipping documents and data.
General:
j) Monitoring, statistical process control and regular reporting of critical process parameters through the complete manufacturing process.
k) Quarterly conduction and reporting of a reliability monitoring program.
3)Mould tool
The N-cavity (N=4, 8, t.b.a.) mould tool has to be capable of producing the LCP mount parts in specified quality, dimension and tolerances. Each cavity has to show a labelling scheme provided by JBC to ensure full traceability of parts. The mould tool has to show a life time of at least 1Mio shots. Upon agreement, the mould tools can be supplied by JBC from a qualified, external supplier.
For any new mould tool, a complete dimensional report, a list of cpk values for critical dimensions and evaluation parts have to be supplied for a representative quantity of devices. Release into production is only accepted for JBC/ST approved tools.
4) Moulding of mounts
Mounts have to be produced according to the above specification documents. As plastic material, liquid crystal polymer: DuPont Zenite 5130L BK is to be used. Only parts from ST approved mould tools and cavities are to be released for production. Parts from different tools and cavities are strictly to be separated.
A solid level of quality control has to be implemented for production of above parts. For each batch of parts an each cavity, quality data (mean, std. Dev., and Cpk) on the t.b.a critical dimensions and supplemental characterization tests have to be supplied for a representative quantity of devices. The sampling rate will be defined based on experience gained from production data. All measurement equipment has to be calibrated and has to show capable R&R.
The surface quality has to conform to the ST demerit system, described e.g. in ST Spec 7593297 Rev A. Moulded parts have to be free of flash. On the mount surface, there may not be any features or fibers which might break off and could fall onto the CMOS sensor chip. All part have to undergo an extensive cleaning before used for assembly.
5) Plating of mounts
The outer surfaces sketched in Fig. 5.1 of the mounts must be plated with an EMI shielding consisting of at least 1μm Cu covered by 0.1 μm stainless steel. Most important is that the plating is capable to withstand the reflow conditions of heating to 3x260C for 30s without any change. Upon agreement, this process can be outsourced to an external, JBC approved supplier. All relevant details are described in ST Spec 7593297 Rev A.
With each plating batch, process information, including the resistance measured on a representative number of samples, as well as layer thickness measured on a witness sample is to be supplied. The adhesion of plating after the reflow process is to be verified on a regular basis. The frequency and method is to be agreed upon with JBC.
Fig. 5.1: Mount areas to be plated with EMI shielding
6) Delivery of JBC lens chip
JBC will supply diced lens chips on UV releasing tape frame together with relevant process data. The manufacturing partner will have pick-up these chips from tape and has to do a 100% visual inspection according to agree upon criteria and screening from both lens sides before assembly.
7) Assembly of JBC lens chip
General
Module assembly, testing and packaging for shipment has to be done in clean room environment. Clean room conditions and practice, including dressing of operators has to be in such way that a critical particle size below 5μm is guaranteed.
Assembly of module
The JBC lens chip is to be glued into the barrel using the thermal curing ThreeBond 2234E epoxy (Curing conditions: 150oC, 30minutes). Fig. 7.1 schematically shows the gluing areas. For redundancy, both glue pockets in the barrel have to be used for attaching the lens chip. Gluing has to be performed in such way, that:
? There is no tilt of the lens chip in the barrel.
? The lens chip is precisely pressed onto the 4 Lens reference pads on the bottom of the barrel.
? There is no spilling of glue into more than 50% of the inner area indicated in Fig. 7.1
Fig. 7.1: Scheme of glue application for lens chip fixing in module. Glue has to be applied in both pockets. No flow of glue into 50% of inner area is allowed.
Push out force for the glued-in lens chips have to be assessed on a meaningful population for every lot. A minimum push-out force of 500gf has to be guaranteed. The sampling rate will be defined by JBC based on experience gained from production data. The quality data of push-out force has to be supplied with every lot.
8) Testing of module
The completely assembled module has to be 100% tested for MTF and screened for optical performance. A gauge R&R of the measurement equipment has to be performed in order to demonstrate satisfactory measurement system performance. A cross calibration to the ST and JBC MTF testers has to be performed for production all MTF test equipment.
As shown in Fig. 8.1, the focus plane for this module will be about 190μm from the bottom inside the module. Since there is no focusable part, therefore the MTF tester has to be capable of measuring in such a configuration.
As described in above Specifications, a 100% quality check and screen has to be performed for:
? MTF on 9 defined lens positions
? EFL or BFL
Sampling data per batch on a representative population have to be collected for the other optical parameters as defined in ST Spec: EO_033_Lens_Req_Spec_VS6555_VGA_2.2_no_focus_AE.
The sampling rate will be defined by JBC based on experience gained from production data. The complete set of optical measurement data and a statistics summary has to be supplied for each batch of modules delivered.
Fig. 8.1: JBC VGA lens chip in fixed focus module. The focal plane of the lens will be ~190μm from the bottom inside the module.
9) Final visual inspection
The produced modules are subject to a 100% final visual inspection and screen. The plastic parts have to be inspected and screened for any kind of mechanical damage as specified in above specifications.
In addition, under at least 100x magnification, all parts must be free of any foreign material or material which could fall-off during further processing. This included fibers, flashed LCP material and possible glass particles from the lens chip.
The lens chip is to be inspected according to ISO10110-7:5/1x0.06.
All visual rejects have to be removed from the production lot and may not be shipped to customer.
10) Shipping of parts
Good, finished parts are to be shipped on reel tape, loaded and sealed under clean room conditions. Tape and reel have to be approved by ST before use. Lots packed on reel have to be separated by mould tool and cavity.
Along with every shipment, the complete set of above specified quality data as well as a certificate of conformance has to be supplied.
11) Reliability requirements
Before final product release, the module has to pass an extensive reliability qualification test described in ST Spec:
EO_033_Lens_Req_Spec_VS6555_VGA_2.2_no_focus_AE. The manufacturing partner has to set-up a regular reliability monitoring program to monitor the critical reliability parameters during ongoing production. The detailed list of reliability tests, frequency and number of devices has to be agreed upon. |
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发表于 2007-10-26 17:36:24
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