Flip-chip, as from the name, all contact points is under the DIE, sothe DIE will be integrated into substrate by soldering ratherthan Bonding wire. It has advantage to do flip chip, for example, toavoid boding wire coupling issues, better heat dissipation.... One ofthe disadvantage is to require more sophisticated packaging and moduledesign...
IP卡
狗仔卡
发表于 2005-12-31 20:22:00
提升卡
置顶卡
沉默卡
喧嚣卡
变色卡
显身卡