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1 Digital Design Manager
Responsibilities:
1) Lead product development of digital part, digital group management, to ensure the product can be
finished on schedule with high-quality and high-efficiency.
2) Lead and develop products
3) Team build-up and management
4) Technology support for team member
5) Team member personal evaluation
6) Management review
7) Projects management
8) Documentation
9) Resource allocation cooperate with project manager/lead
Requirements:
1) MSEE with 6+ years of experience.
2) Have excellent communication skills and the ability to adapt towards working in a cross cultural work
environment.
3) Strong logic design skills:
- excellent verilog RTL coding skills along with good debugging skills
- MCU, DSP, USB, digital video, audio compression knowledge and experience
- Independently designed a major part of a multi-million gate SOC
- Hands on experience on multiple clock domain designs, design for low power and DFT
- Exhaustively used simulators like NC-Verilog, VCS.
4) handle design verification at least at module level
5) Well proficient with synthesis and· timing tools
6) Should be able to come up with design specifications from top· level architecture definitions
7) Preferable understanding of ARM and MCU processors· and knowledge of wireless or broadband
communications
8) Preferable C/C++ knowledge and· coding at assembly level programming
9) Preferable prototyping experience· using FPGAs
10) Should be a good team player and leadership
Sr. Optical Engineer
Responsibilities:
1. Operate optical experiments with the use of beam propagation software.
2. Develop opto-mechanical designs and measurement software and electronics, build optical breadboard
systems and simulation model.
3. Analyze and summarize experiment results, and write reports under the guidance of R&D research.
Requirements:
1. BS degree and 5+ years experience or MS degree and 3+ years experience in Optical Engineering, physics or a
related field is required.
2. Familiar with optical and mechanical design tools, such as ZEMAX, AutoCAD, ProE and etc.
3. Skills in theoretical modeling and simulation, set up of test optical breadboards, developing mechanical
engineering design.
4. Experience in fabrication and manufacturing of optical, imaging, or electro-optic systems
Lazer-base product design experience preferred.
5. Team management experience preferred.
Digital Design Engineer
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Responsibilities:
1) 设计及研发高效CMOS 数字及混合信号半导体产品。
2) 参与产品定义,定制逻辑及芯片主要模块的ASIC 设计。
3) 与版图工程师一起,对版图的布局布线进行指导与校正、设计仿真与验证,以及后端版图检查以
确保设计的完整与正确性。
Requirements:
1) MSEE with 1+ years or BSEE with 3+ years of IC design experience
2) Good communication skills and the ability to adapt towards working in a cross cultural work
environment.
3) Good work attitude and learning capability.
4) Good verilog RTL coding skills along with good debugging skills
5) Successful IC tape out experience is preferred
6) MCU, DSP, USB, digital video, audio compression knowledge and experience is preferred
7) Proficient with synthesis and timing tool
8) Preferable C/C++ knowledge and coding at assembly level programming
9) Preferable prototyping experience using FPGAs
Analog Design Engineer
Responsibilities:
1) Design state of the art analog and mixed signal circuits for VLSI integration.
2) Assist in defining functional and performance requirements.
3) Assist product definition including specification, partitioning, architecture, project scheduling, tracking
and resource estimations.
4) Design custom analog and mixed signal blocks CMOS examples include very high performance ADCs,
DACs, PLLs and signal conditioning circuits.
5) Verification of performance requirements using appropriate simulation and verification tools.
6) Validate and debug silicon in the lab.
Requirements:
1) MSEE with 1+ years or BSEE with 3+ years of IC design experience count ASIC or mixed-signal
projects from netlist to Tape-out.
2) Familiar with Cadence, Hspice, Matlab prefer
3) Good communication skills and the ability to adapt towards working in a cross cultural work
environment.
4) Familiar with fundamental process flow.
5) UNIX OS
6) Good English and Chinese Verbal and Written Communication Skills.
7) Good work attitude and learning capability.
8) Candidate with following experience is preferred
􀁺 Successful IC tape out
􀁺 High performance analog macro block layout such as ADCs, DACs, PORs, PLLs and ESD design
Field Application Engineer
Responsibilities:
1) Drive design in activity and maintain design in or pipeline.
2) Obtain product feedback from customers
3) Identify product opportunity.
4) Help to define new product
5) Support engineering management needs, such as
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􀁺 Provide the first line of technical support to customer
􀁺 Customer system diagrams and other similar information
􀁺 Customer engineering schedule information
􀁺 Critical engineering challenges at custom
Requirement:
1) Minimum 5 years of R&D experience in the semiconductor industry, with proven career track record at a
major IC supplier or disty.
2) Hold bachelor at Electronic Engineering
3) Fluently in written and spoken English and mandarin.
Product Management Manager
Requirements:
1) 5-10 years of product management experience in the semiconductor industry within China.
2) Have deep understanding of IC technologies, a IC tech background preferred.
2) Excellent English and Chinese verbal and written capabilities.
3) Self motivator, passionate, creative person.
4) Team management experience is a must.
Audio Application Engineer
Requirements:
(1) B.S. degree or above in Electrical Engineering.
(2) More than 3 years of hands-on experience in class-D audio products, and can work independently to provide
reference design solutions to customers.
(3) Eager to learn, willing to take challenges, and result-oriented.
(4) Excellent communication skills in both verbal and writing
Work location:Shenzhen office
SCM Engineer(IC供应链管理工程师)
Responsibilities:
Manage subcons on capacity and schedule to make sure they can deliver our products on time, and meet our
demand
Logistic management, shipping, and import/export
Communicate with marketing and sales to meet our customers demands
Warehouse management
职责:
外包商生产管理,包括产能控制,产品交期控制,价格商谈,等
物流管理,包括运输和进出口,以及库房管理
和销售和市场沟通,满足客户的需求
条件:
工程管理学士
有IC工业经验者优先
有很强的沟通能力和团队精神
流利的读写英文
欢迎符合要求的应届大学毕业生
Test Engineer(测试工程师)
Responsibilities:
1) 1 用先进的测试方法来测试复杂的混合信号芯片,与设计团队紧密合作以最小的测试成本达到最大的
测试成效;
2) 与设计团队配合保证产品的最大产出率与最小的生产成本;
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3) 与生产厂家建立稳固的关系以确保产品的顺利投产。
4) 完成上级布置的各项任务。
Requirements:
1) 电子类本科以上学历,1 年以上半导体测试工作经验。
2) 熟悉半导体测试编程,会操作数字/模拟类的测试机
3) 与测试代工厂能有较强的沟通能力。
4) 熟悉电子线路
感兴趣的人请投简历至lwan@apexonemicro.com.
Apexone Microelectronics 是一家从事多媒体及通讯系统级芯片(SOC)设计的高科技企
业。其主要投资方为具有金融及工业背景的美国及亚洲投资基金。埃派克森微电子(上海)
有限公司是Apexone Microelectronics 在中国的全资子公司, 公司拥有应用于包括宽带有线网
络通讯,3G 无线通讯基站以及多媒体电子领域的一系列IC 设计核心技术。其被公认为是亚
太地区混合信号(Mixed-signal)集成电路设计行业中最具发展潜力的公司之一。 |
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