PCB无铅封装焊盘设计指南

simon2000

【文件名】:07618@52RD_无铅封装焊盘设计指南(1).pdf
【格　式】:pdf
【大　小】:571K
【简　介】:
【目　录】:Suggested PCB Land Pattern Designs for Leaded
and Leadless Packages and Detailed Surface Mount
Guidelines for Leadless Packages
It is recommended that
you consult with the company doing the component mounting
and soldering to the printed circuit board. These companies have
more information on options (various possible dimensions) of
actual land patterns.

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