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来自VIA的设计资料。
资料简介:C7+CN800 +VT8251主板方案的设计规范。VIA最新的嵌入式CPU-C7。
This document provides design guidelines for motherboard manufacturers on developing VIA C7 NanoBGA2 and VIA Eden
NanoBGA2 processors and VIA CN800 (CN800 North Bridge and VT8251 Version CE South Bridge) based systems. The
CN800 ballout is optimized for VIA C7 / Eden NanoBGA2 processor in the 400-ball package. All the major underlying
subsystems, especially Host (or so called CPU), Memory, PCI Express and V-Link interfaces, related to the motherboard design
are described in detail. General motherboard layouts, routing guidelines and power requirements of each subsystem are presented.
【文件名】:061222@52RD_dg_cn800_vt8251 ce_031.rar
【格 式】:rar
【大 小】:3215K
【简 介】:
【目 录】:
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