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以下是一个有关PCB板的检验和厂商生产能力的评估标准(Class 1,2,3). 此标准对PCB板的检查和等级划分方面非常详细,是一个公认的非常专业的标准.(Total: 180 Page). 对搞PCB板制造工程和SMT的朋友,有很好的帮助.
内容如下:
1.0. Introduction
1.1. Scope
1.2. Purpose
1.3. Approach To This Document
1.4. Calssification
1.5. Acceptance Criteria
1.6. Reference
1.7. Dimensions And Definitions
1.8. Terms And Definitions
1.9. Workmanship
2.0. Externally Observable Characteristics
2.1. Board Edges
2.2. Base Materials
2.3. Base Materials Subsurface
2.4. Solder Coatings and Fused Tin Lead
2.5. Holes-Plated-Through-General
2.6. Holes-Unsupported
2.7. Printed Contacts
2.8. Marking
2.9. Solder Mask
2.10. Pattem Definition-Demensional
2.11. Flatness
3.0. Intermally Observable Characteristics
3.1. Dielectric Materials
3.2. Conductive Pattems-General
3.3. Plated-Through Holes-General
3.4. Plated-Through Holes-Drilled
3.5. Plated-Through Holes-Punched
4.0. Miscellaneous
4.1. Flexible And Rigid-Flex Printed Wiring
4.2. Metal Core Printed Boards
4.3. Flush Printed Boards
5.0. Cleanliness Testing
5.1. Solderablility Testing
5.2. Electrical Integrity
【文件名】:06108@52RD_IPC-A-600F标准.pdf
【格 式】:pdf
【大 小】:3397K
【简 介】:
【目 录】:
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