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Advanced® 3.0 Release 2.0
PICMG® Base Specification
Member Review Draft D1.90
September 28, 2004
Introduction and objectives ...............................................................................1-1
1.1 Objective ....................................................................................................1-2
1.1.1 Relationship to PICMG® 2.0 family of specifications ....................1-2
1.1.2 Statement of compliance...............................................................1-3
1.2 Reference documents ................................................................................1-4
1.2.1 Reference specifications ...............................................................1-4
1.2.2 Contact information for reference organizations............................1-6
1.2.3 Environment and regulatory documents........................................1-6
1.3 Contributors................................................................................................1-7
1.4 Special word usage ....................................................................................1-7
1.5 Name and logo usage ................................................................................1-8
1.5.1 Logo use........................................................................................1-8
1.5.2 Trademark policy ...........................................................................1-8
1.6 Signal naming conventions ........................................................................1-9
1.7 Intellectual property ....................................................................................1-9
1.8 Special terms and acronyms......................................................................1-9
1.9 Dimensions...............................................................................................1-18
2 Mechanical...........................................................................................................2-1
2.1 Mechanical overview ..................................................................................2-1
2.1.1 Tolerances.....................................................................................2-4
2.1.2 Standard orientation ......................................................................2-4
2.1.3 Horizontal orientation ....................................................................2-4
2.1.4 Drawing symbols ...........................................................................2-4
2.1.5 Keepout Zones ..............................................................................2-5
2.2 Front Board assembly ................................................................................2-5
2.2.1 Front Board PCB dimensions........................................................2-5
2.2.2 Front Board PCB thickness ...........................................................2-9
2.2.3 Front Board Pitch and offset..........................................................2-9
2.2.4 Component height .......................................................................2-10
2.2.4.1 Front Board warpage...................................................2-11
2.2.4.2 Front Board stiffening ..................................................2-11
2.2.5 ESD discharge strip.....................................................................2-11
2.2.6 Front Board covers......................................................................2-13
2.2.7 Front Board Face Plate ...............................................................2-14
2.2.7.1 Front Board Face Plate Handles .................................2-17
2.2.7.2 Front Board Face Plate alignment and safety ground
pin................................................................................2-19
2.2.7.3 Front Board Face Plate retention screws ....................2-20
2.2.7.4 Front Board filler panels ..............................................2-20
2.2.8 LEDs............................................................................................2-20
2.2.8.1 General status LEDs ...................................................2-21
2.2.8.2 Application specific LEDs ............................................2-22
2.2.9 Face Plate labels.........................................................................2-23
2.2.9.1 AdvancedTCA® logo label ..........................................2-23
2.2.9.2 Barcode label...............................................................2-23
2.2.10 Test dimensions ..........................................................................2-23
ii AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004
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Contents
2.3 RTM assembly .........................................................................................2-25
2.3.1 RTM direct mate to Front Board..................................................2-25
2.3.1.1 RTM PCB thickness ....................................................2-27
2.3.1.2 RTM Pitch and offset ...................................................2-27
2.3.1.3 RTM PCB bow, warp, component height, and
stiffening ......................................................................2-27
2.3.1.4 RTM ESD discharge strip ............................................2-28
2.3.1.5 RTM Face Plate and Covers .......................................2-29
2.3.1.6 RTM Face Plate alignment/GND features ...................2-31
2.3.1.7 RTM retention screws..................................................2-31
2.3.1.8 RTM filler panels..........................................................2-32
2.3.1.9 RTM airflow requirements and direction......................2-32
2.3.1.10 Zone 3 airflow seal ......................................................2-32
2.3.1.11 RTM Zone 3 keying .....................................................2-34
2.3.2 Zone 3 cable bulkhead................................................................2-34
2.3.3 RTM connection to Zone 3 midplane ..........................................2-35
2.4 Zone 1, 2, and 3 connectors.....................................................................2-37
2.4.1 Zone 1 connector ........................................................................2-37
2.4.1.1 Description...................................................................2-37
2.4.1.2 -48 VDC power circuit definitions ................................2-40
2.4.1.3 Metallic Test Bus circuits .............................................2-41
2.4.1.4 Ringing Generator Bus circuit......................................2-42
2.4.1.5 Shelf management circuit definitions...........................2-43
2.4.2 Zone 2 connectors.......................................................................2-43
2.4.2.1 General description of Zone 2 connectors...................2-44
2.4.2.2 Pin numbering .............................................................2-44
2.4.2.3 Sequential mating........................................................2-44
2.4.3 Zone 3 connectors.......................................................................2-44
2.4.3.1 General description .....................................................2-45
2.4.3.2 Zone 3 connector envelope .........................................2-45
2.4.3.3 Insertion force..............................................................2-47
2.4.3.4 Alignment allowances/gatherability .............................2-47
2.4.4 Front Board and RTM alignment/keying......................................2-47
2.4.4.1 Alignment overview .....................................................2-47
2.4.4.2 Keying overview ..........................................................2-47
2.4.4.3 Zone 1 and Zone 2 keying/alignment ..........................2-49
2.4.4.4 RTM alignment ............................................................2-51
2.4.4.5 Zone 3 alignment and keying ......................................2-54
2.5 Backplanes...............................................................................................2-57
2.5.1 Description ..................................................................................2-58
2.5.2 Connector locations.....................................................................2-59
2.6 Subrack ....................................................................................................2-61
2.6.1 Subrack features .........................................................................2-61
2.6.2 Backplane support bar ................................................................2-67
2.6.3 Subrack interface requirements for Front Boards .......................2-69
2.6.4 Subrack EMC gasketing requirements........................................2-70
2.6.5 Guide Rail requirements..............................................................2-70
2.6.5.1 Front Board and RTM Guide Rail requirements ..........2-70
2.6.5.2 Logical Slot identification .............................................2-72
2.6.5.3 ESD clip position in the Guide Rails ............................2-72
2.6.6 Face Plate alignment and safety ground pin ...............................2-74
2.6.7 Retention screw receptacle .........................................................2-74
AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004 iii
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Contents
2.6.8 Subrack load carrying capability..................................................2-74
2.6.9 Subrack integrity tests .................................................................2-75
2.6.9.1 Subrack shock and vibration performance ..................2-75
2.6.9.2 Earthquake performance .............................................2-75
2.6.9.3 Flammability ................................................................2-75
2.6.9.4 Shelf climatic test.........................................................2-75
2.6.9.5 Shelf atmosphere test..................................................2-75
2.6.9.6 Insertion cycles............................................................2-75
2.6.10 Physical Slot numbering..............................................................2-76
2.7 Shelf .........................................................................................................2-76
2.7.1 Shelf types...................................................................................2-76
2.7.2 Shelf width and Shelf height........................................................2-76
2.7.3 Shelf depth ..................................................................................2-76
2.7.4 Air filter provision .........................................................................2-76
2.7.5 ESD wrist strap interface.............................................................2-77
2.7.6 Telco inputs and alarm outputs ...................................................2-78
2.7.6.1 Telco alarm information ...............................................2-78
2.7.6.2 Telco alarm signaling I/O connector example .............2-78
2.7.6.3 Telco alarm electrical specifications ............................2-78
2.7.6.4 Shelf alarm LEDs.........................................................2-79
2.7.7 Cable management .....................................................................2-79
2.7.8 Power entry .................................................................................2-82
2.7.8.1 Power entry space allocation.......................................2-82
2.7.8.2 Position........................................................................2-82
2.7.8.3 Safety ..........................................................................2-82
2.7.8.4 Method.........................................................................2-83
2.7.8.5 Switching .....................................................................2-83
2.7.8.6 Fusing..........................................................................2-83
2.7.8.7 Monitoring....................................................................2-83
2.7.8.8 Power filtering..............................................................2-83
2.7.9 Shelf mounting hole pattern and location ....................................2-83
2.8 Frame and Subrack references (informative)...........................................2-84
3 Shelf management ..............................................................................................3-1
3.1 Overview ....................................................................................................3-1
3.1.1 Shelf management architecture ....................................................3-2
3.1.2 Overall relationship with IPMI specification ...................................3-6
3.1.3 Internet Protocol-based services ...................................................3-7
3.1.4 Multi-Tenant architectures.............................................................3-7
3.1.4.1 Multi-Tenant usage model origin ...................................3-7
3.1.4.2 Areas of impact..............................................................3-8
3.1.5 Command and record definition conventions ................................3-8
3.1.5.1 IPMI command definition conventions...........................3-8
3.1.5.2 Type/Length Bytes.......................................................3-10
3.1.5.3 Handling Reserved bits and fields ...............................3-12
3.1.6 IPMI specification clarifications....................................................3-12
3.1.6.1 “Send Message” response format ...............................3-12
3.1.6.2 Calculating MD2 and MD5 checksums........................3-12
3.2 IPM Controller ..........................................................................................3-12
3.2.1 Payload Interface ........................................................................3-13
3.2.2 IPMI event support ......................................................................3-13
3.2.2.1 Guidelines and requirements for FRU sensor events..3-14
iv AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004
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Contents
3.2.3 Addressing ..................................................................................3-14
3.2.3.1 Hardware Address.......................................................3-14
3.2.3.2 Intelligent Platform Management Bus address............3-15
3.2.3.3 Physical Address .........................................................3-17
3.2.3.4 Shelf addressing..........................................................3-24
3.2.4 Managed FRU operational state management ...........................3-26
3.2.4.1 FRU states and transitions ..........................................3-27
3.2.4.2 FRU Hot Swap commands..........................................3-33
3.2.4.3 FRU Hot Swap Sensor ................................................3-36
3.2.4.4 Communication Lost....................................................3-41
3.2.4.5 FRU Payload Control...................................................3-44
3.2.4.6 IPM Controller resets...................................................3-45
3.2.5 Front Board Face Plate indicators...............................................3-47
3.2.5.1 BLUE LED ...................................................................3-47
3.2.5.2 LED 1 (mandatory) ......................................................3-48
3.2.5.3 LED 2 (optional)...........................................................3-48
3.2.5.4 LED 3 (optional)...........................................................3-49
3.2.5.5 Application specific LEDs (optional) ............................3-49
3.2.5.6 FRU LED Control commands......................................3-49
3.3 Shelf Manager..........................................................................................3-58
3.3.1 Overall Shelf Manager functional requirements ..........................3-60
3.3.1.1 Basic IPMI requirements .............................................3-60
3.3.1.2 Internet Protocol addressing of the Shelf Manager .....3-61
3.3.1.3 IPMI-oriented System Manager communications........3-63
3.3.1.4 AdvancedTCA® extensions to IPMI’s BMC
requirements................................................................3-64
3.3.2 Shelf Manager initialization .........................................................3-66
3.4 Sensor Data Records ...............................................................................3-67
3.4.1 IPM Controller SDR requirements...............................................3-68
3.4.2 Shelf Manager SDR requirements ..............................................3-70
3.4.3 Entities.........................................................................................3-71
3.4.3.1 PICMG Entity IDs ........................................................3-72
3.4.3.2 System and device relative Entities.............................3-72
3.4.3.3 Entity requirements......................................................3-73
3.4.3.4 Example Entities and sensors .....................................3-74
3.5 System Event Logs ..................................................................................3-78
3.6 FRU Information.......................................................................................3-78
3.6.1 FRU Information definitions.........................................................3-78
3.6.2 FRU Information access commands ...........................................3-79
3.6.3 IPM Controller FRU Information ..................................................3-80
3.6.4 Shelf FRU Information.................................................................3-80
3.6.4.1 Locating the Shelf FRU device(s)................................3-81
3.6.4.2 Determining validity of Shelf FRU contents .................3-81
3.6.4.3 Behavior if valid Shelf FRU Device not found or
inaccessible .................................................................3-82
3.6.4.4 Accessing Shelf FRU Information................................3-83
3.6.4.5 Updating Shelf FRU Information..................................3-83
3.7 Electronic Keying......................................................................................3-84
3.7.1 E-Keying process ........................................................................3-84
3.7.2 Point-to-Point E-Keying ...............................................................3-85
3.7.2.1 Point-to-Point Link connectivity ...................................3-85
3.7.2.2 Backplane Point-to-Point Connectivity information......3-86
AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004 v
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Contents
3.7.2.3 Board Point-to-Point interface information...................3-88
3.7.2.4 Set Port State command .............................................3-96
3.7.2.5 Get Port State command .............................................3-96
3.7.3 Bused E-Keying...........................................................................3-97
3.7.3.1 Synchronization Clock Interface ..................................3-98
3.7.3.2 Metallic Test Bus .........................................................3-99
3.7.3.3 Ringing Generator Bus ................................................3-99
3.7.3.4 Bused Resource Control command.............................3-99
3.8 Intelligent Platform Management Bus ....................................................3-105
3.8.1 Radial IPMB-0 topology.............................................................3-106
3.8.1.1 Radial IPMB-0 Link Mapping Record requirements ..3-107
3.8.2 Electrical characteristics ............................................................3-107
3.8.3 I2C requirements .......................................................................3-108
3.8.4 IPMB Control commands...........................................................3-110
3.8.4.1 Physical IPMB-0 Sensors .........................................3-110
3.8.4.2 Physical IPMB-0 Status Change Event Message......3-113
3.8.4.3 Set IPMB State ..........................................................3-114
3.8.5 Hot Swap requirements.............................................................3-115
3.8.6 IPMB expansion connector .......................................................3-118
3.8.7 IPMB fault detection and control ...............................................3-119
3.9 Shelf power and cooling .........................................................................3-121
3.9.1 Discovery stage.........................................................................3-122
3.9.1.1 Shelf participation ......................................................3-123
3.9.1.2 Board/FRU participation ............................................3-128
3.9.1.3 Fan Tray participation................................................3-135
3.9.2 Normal Operation Stage............................................................3-137
3.9.2.1 Hot Swap insertion or extraction................................3-137
3.9.2.2 Renegotiation of Power Level....................................3-138
3.9.2.3 Normal cooling adjustments ......................................3-139
3.9.3 Abnormal Operation Stage........................................................3-139
3.9.3.1 IPM Controller/FRU sensors......................................3-139
3.9.3.2 Abnormal Event Message .........................................3-140
3.9.3.3 Cooling management ................................................3-143
3.10 AdvancedTCA® IPMI functions, commands, and records .....................3-144
3.10.1 Required Shelf Manager and IPM Controller functions .............3-144
3.10.2 Command assignments.............................................................3-146
3.10.3 AdvancedTCA® FRU Records, Sensors, and Entity IDs ..........3-153
4 Power distribution...............................................................................................4-1
4.1 Dual -48 VDC power distribution ................................................................4-1
4.1.1 Power architecture ........................................................................4-2
4.1.2 Supported voltage levels ...............................................................4-3
4.1.2.1 Voltage level background information (informative) ......4-3
4.1.2.2 Voltage level requirements ............................................4-4
4.1.3 Single or multiple Feeds to the Shelf and Backplane....................4-5
4.1.4 Fusing and fault protection ............................................................4-6
4.1.4.1 Inrush current limiting ....................................................4-8
4.1.4.2 Battery Plant characterization for fusing (informative)...4-9
4.1.4.3 Transients....................................................................4-11
4.1.4.4 Fusing and local energy storage .................................4-11
4.1.5 Filtering........................................................................................4-13
4.1.5.1 Board conducted emissions ........................................4-13
vi AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004
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Contents
4.1.5.2 Shelf Conducted emissions .........................................4-13
4.1.5.3 Radiated emissions .....................................................4-14
4.1.6 Board power sequencing.............................................................4-14
4.1.6.1 Introduction..................................................................4-14
4.1.6.2 Power and ground sequencing....................................4-14
4.1.6.3 Management power.....................................................4-18
4.1.6.4 Payload power.............................................................4-18
4.2 Grounding strategy...................................................................................4-18
4.2.1 Shelf Ground ...............................................................................4-18
4.2.2 Shelf Ground and –48 VDC return ..............................................4-18
4.2.3 Shelf Ground and Logic Ground..................................................4-18
4.3 Board-level power conversion..................................................................4-19
4.3.1 Conversion architectures.............................................................4-19
4.3.2 DC to DC converter requirements ...............................................4-21
4.3.2.1 Power supply noise voltages.......................................4-21
5 Thermal ................................................................................................................5-1
5.1 General.......................................................................................................5-1
5.1.1 Air cooling......................................................................................5-2
5.2 Front Board thermal requirements .............................................................5-3
5.2.1 Front Board power dissipation.......................................................5-3
5.2.2 Front Board airflow direction .........................................................5-3
5.2.3 Front Board cooling requirements .................................................5-3
5.2.3.1 Air distribution in a Slot..................................................5-4
5.3 RTM thermal requirements.........................................................................5-5
5.3.1 RTM power dissipation..................................................................5-5
5.3.2 RTM airflow direction.....................................................................5-6
5.3.3 RTM Zone 3 airflow seal ...............................................................5-6
5.4 Shelf thermal requirements ........................................................................5-6
5.4.1 Shelf air inlet and exhaust .............................................................5-6
5.4.2 Slot cooling capability....................................................................5-6
5.4.2.1 Slot impedance curve ....................................................5-7
5.4.2.2 Slot fan flow curve .........................................................5-7
5.4.3 Shelf thermal requirements for Front Board ..................................5-8
5.4.4 Shelf thermal support for RTM ......................................................5-8
5.5 Frame airflow..............................................................................................5-8
5.6 Thermal and acoustic noise environments.................................................5-9
5.6.1 Airflow requirements......................................................................5-9
5.6.2 ETSI ............................................................................................5-11
5.6.3 NEBS...........................................................................................5-11
5.6.4 Altitude ........................................................................................5-11
5.6.5 Maximum temperature of human-accessible surfaces................5-11
5.6.6 Heat release target for high power Shelves and Frames............5-11
5.7 Fan failure ................................................................................................5-12
5.8 Air filters ...................................................................................................5-12
5.9 Shelf temperature sensors .......................................................................5-13
5.10 Design recommendations.........................................................................5-13
5.10.1 Identify airflow path .....................................................................5-14
5.10.1.1 Series paths.................................................................5-15
5.10.1.2 Parallel paths...............................................................5-16
5.10.2 Optimal distribution of airflow impedances..................................5-16
AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004 vii
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Contents
5.10.3 Calculating Shelf impedance, total volumetric airflow and airflow distribution........................................................................................
5-16
5.10.3.1 Example.......................................................................5-17
5.10.4 Calculating temperature rise along each airflow path..................5-18
5.10.5 Meeting worst case requirements................................................5-19
6 Data transport......................................................................................................6-1
6.1 General.......................................................................................................6-1
6.1.1 Data transport zone (Zone 2) ........................................................6-1
6.2 Backplane requirements.............................................................................6-2
6.2.1 Backplane fabric topologies ..........................................................6-3
6.2.1.1 Dual Star........................................................................6-4
6.2.1.2 Dual-Dual Star ...............................................................6-4
6.2.1.3 Full Mesh .......................................................................6-5
6.2.2 Zone 2 interface support requirements..........................................6-5
6.2.3 Electrical design requirements ......................................................6-6
6.2.3.1 Base and Fabric Interface requirements .......................6-7
6.2.3.2 Synchronization Clock Interface requirements ..............6-7
6.2.3.3 Update Channel Interface requirements........................6-8
6.2.4 Electronic Keying support..............................................................6-8
6.3 Board requirements....................................................................................6-8
6.3.1 Hub Boards ...................................................................................6-8
6.3.2 Node Boards .................................................................................6-9
6.3.3 Mesh Enabled Boards ...................................................................6-9
6.3.4 Zone 2 support requirements for Boards.......................................6-9
6.3.4.1 Base Interface Board support........................................6-9
6.3.4.2 Fabric Interface - Board support..................................6-10
6.3.4.3 Synchronization Clock Interface - Board support ........6-11
6.3.4.4 Update Channel Interface - Board support..................6-11
6.3.5 Electronic Keying support............................................................6-11
6.4 Data transport ZD connector ....................................................................6-11
6.4.1 Base and Fabric Channels ..........................................................6-12
6.4.2 Channel mapping ........................................................................6-13
6.4.3 Pin mapping ................................................................................6-14
6.4.4 Connector usage .........................................................................6-20
6.5 Base Interface ..........................................................................................6-21
6.5.1 Base Interface usage model........................................................6-22
6.5.2 Base Interface Channel assignments..........................................6-22
6.5.3 ShMC Port...................................................................................6-23
6.5.4 Electrical design requirements ....................................................6-24
6.5.5 Base Interface Dual Star Backplane routing................................6-24
6.5.6 Dual Star Backplane Hub Slot position........................................6-25
6.6 Fabric Interface ........................................................................................6-26
6.6.1 Fabric Interface usage models ....................................................6-27
6.6.2 Electrical design requirements ....................................................6-27
6.6.3 Fabric Interface Backplane configurations and Channel routing.6-29
6.6.3.1 Full Mesh Backplane ...................................................6-30
6.6.3.2 Fabric Interface Dual Star............................................6-31
6.6.3.3 Dual Star with Base (Fabric Star + Base Star) ............6-32
6.6.3.4 Fabric Interface Dual-Dual Star ...................................6-34
6.6.3.5 Reduced Slot Backplanes and Replicated Meshes.....6-36
viii AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004
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Contents
6.7 Synchronization Clock Interface...............................................................6-40
6.7.1 Clock bus architecture and Backplane topology .........................6-41
6.7.2 Board interfaces to clock buses ..................................................6-41
6.7.3 Bus group signal usage, frequencies, and quality.......................6-42
6.7.4 Synchronization system architectures and clock bus usage
models.........................................................................................6-44
6.7.5 Redundancy model .....................................................................6-45
6.7.6 Electronic Keying support............................................................6-46
6.7.7 Electrical design requirements ....................................................6-47
6.8 Update Channel Interface ........................................................................6-47
6.8.1 Update Channel overview / usage models..................................6-48
6.8.1.1 Backplane routing considerations................................6-48
6.8.2 Electrical design requirements ....................................................6-50
6.9 System integration guidelines ..................................................................6-50
7 Regulatory guidelines.........................................................................................7-1
7.1 All equipment..............................................................................................7-1
7.1.1 Safety (North America and Europe) ..............................................7-1
7.1.2 Electromagnetic compatibility (North America and Europe)..........7-2
7.1.3 Safety and EMC: additional considerations...................................7-2
7.2 Equipment for use in telecommunications central offices ..........................7-3
7.2.1 Safety ............................................................................................7-3
7.2.2 Electromagnetic compatibility........................................................7-3
7.2.3 ETSI/NEBS requirements..............................................................7-3
7.2.3.1 NEBS–USA ...................................................................7-3
7.2.3.2 ETSI–Europe.................................................................7-4
7.2.3.3 Additional customer-specific recommendations ............7-4
7.3 Documentation ...........................................................................................7-4
7.4 Grounding and bonding..............................................................................7-5
7.5 Ecology standards......................................................................................7-5
7.6 Reliability/MTBF standards ........................................................................7-5
7.7 Cross reference list ....................................................................................7-6
8 Zone 2 electrical design guidelines...................................................................8-1
8.1 Overview ....................................................................................................8-1
8.2 Backplane design guidelines......................................................................8-1
8.2.1 Signaling rates...............................................................................8-2
8.2.2 Backplane materials ......................................................................8-2
8.2.3 ZD Connector routing considerations and feature sizes ...............8-2
8.2.4 Base and Fabric Interface Backplane design guidelines...............8-3
8.2.4.1 Trace length matching, trace widths and spacing .........8-4
8.2.4.2 Crosstalk Isolation .........................................................8-6
8.2.4.3 Insertion loss .................................................................8-6
8.2.5 Synchronization Clock Interface Backplane design guidelines .....8-9
8.2.5.1 MLVDS bused clock implementation.............................8-9
8.2.5.2 Characteristic impedance ............................................8-10
8.2.5.3 Trace length matching, trace widths and spacing .......8-10
8.2.5.4 Crosstalk Isolation .......................................................8-11
8.2.5.5 Termination..................................................................8-12
8.2.6 Update Channel Backplane electrical specifications...................8-12
8.3 Board design guidelines ...........................................................................8-12
AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004 ix
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Contents
8.3.1 Board materials ...........................................................................8-12
8.3.2 ZD connector routing conditions..................................................8-13
8.3.3 Base and Fabric Interface Board guidelines................................8-13
8.3.3.1 Loose coupling vs. tight coupling in differential pairs ..8-13
8.3.4 Update Channel Board design guidelines ...................................8-15
9 Revision history ..................................................................................................9-1
A Differential Fabric Connector............................................................................ A-1
A.1 General data.............................................................................................. A-1
A.1.1 Objective of this document ........................................................... A-1
A.1.2 Scope ........................................................................................... A-1
A.1.3 Intended method of mounting....................................................... A-1
A.1.4 Ratings and characteristics .......................................................... A-1
A.1.5 Normative references ................................................................... A-2
A.1.6 Markings....................................................................................... A-3
A.1.7 Type designation .......................................................................... A-3
A.2 Technical information ................................................................................ A-4
A.2.1 Definitions..................................................................................... A-4
A.2.1.1 Contacts and terminations............................................ A-4
A.2.1.2 Complete connectors (pairs) ........................................ A-5
A.3 Dimensional information............................................................................ A-6
A.3.1 General isometric view and common features ............................. A-6
A.3.2 Engagement information .............................................................. A-6
A.3.2.1 Electrical engagement length ....................................... A-6
A.3.2.2 First contact point ......................................................... A-7
A.3.2.3 Perpendicular to engagement direction........................ A-7
A.3.2.4 Inclination ..................................................................... A-7
A.3.3 Backplane connectors .................................................................. A-8
A.3.3.1 Dimensions................................................................... A-8
A.3.3.2 Contacts ....................................................................... A-8
A.3.3.3 Contact tip geometry .................................................... A-9
A.3.3.4 Terminations................................................................. A-9
A.3.4 Front Board Connectors ............................................................. A-10
A.3.4.1 Dimensions................................................................. A-10
A.3.4.2 Terminations............................................................... A-10
A.3.5 Mounting information for Backplane connectors ........................ A-10
A.3.5.1 Hole pattern on Backplanes ....................................... A-11
A.3.5.2 Backplane contact positional requirements ................ A-11
A.3.5.3 True position of male contacts.................................... A-11
A.3.6 Mounting information for Front Board connectors ...................... A-12
A.4 Characteristics......................................................................................... A-13
A.4.1 Climatic category ........................................................................ A-13
A.4.1.1 Climatic category test batch P: initial examination ..... A-13
A.4.1.2 Climatic category test batch A: mechanical tests ....... A-13
A.4.1.3 Climatic category test batch B: harsh environments .. A-16
A.4.1.4 Climatic category test batch C: damp heat................. A-17
A.4.1.5 Climatic category test batch D: extended environmental
tests ............................................................................ A-17
A.4.1.6 Climatic category test batch E: extended environmental
tests ............................................................................ A-18
A.4.2 Electrical characteristics ............................................................. A-18
x AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
Contents
A.4.2.1 Impedance.................................................................. A-18
A.4.2.2 Crosstalk..................................................................... A-18
A.4.2.3 Propagation Delay ...................................................... A-19
A.4.2.4 Insertion Loss ............................................................. A-19
B Power connector................................................................................................ B-1
B.1 General data.............................................................................................. B-1
B.1.1 Recommended method of mounting ............................................ B-1
B.1.2 Ratings and characteristics .......................................................... B-1
B.1.3 Normative references ................................................................... B-2
B.1.4 Marking......................................................................................... B-3
B.1.5 Type designation .......................................................................... B-3
B.1.6 Ordering information..................................................................... B-3
B.2 Technical information ................................................................................ B-5
B.2.1 Definitions..................................................................................... B-5
B.2.1.1 Contacts and terminations............................................ B-5
B.2.2 Information on application ............................................................ B-5
B.2.2.1 Connector stacking....................................................... B-5
B.2.2.2 Backplane connectors .................................................. B-5
B.2.2.3 Front Board connectors ................................................ B-5
B.2.2.4 Information on contact terminations ............................. B-5
B.2.3 Contact arrangements..................................................................

【文件名】:0685@52RD_ATCA Base Specification.part1(1).rar
【格　式】:rar
【大　小】:3584K
【简　介】:Introduction and
Advanced® 3.0 Release 2.0
PICMG® Base Specification
Member Review Draft D1.90
September 28, 2004
【目　录】:

lovelxl

请问兄弟是搞ATCA的吗？我最近也是搞，能交流一下吗？我的email:quguoyuan@hotmail.com