EMC Design for Notebook Applications

youshenglin

【文件名】:06716@52RD_EMC Design for Notebook Applications.pdf
【格　式】:pdf
【大　小】:299K
【简　介】:
【目　录】:



1. INTRODUCTION..............................................................................................................................4
2. MECHANICAL CONSTRUCTION...................................................................................................4
2.1. USING CONDUCTIVE PLASTICS AND COATED PLASTICS......................................................................4
2.2. METAL CHASSIS ..............................................................................................................................6
2.3. APERTURES....................................................................................................................................8
2.4. HINGES (NOTEBOOK PC APPLICATIONS)...........................................................................................9
2.5. SIGNAL CABLES............................................................................................................................10
2.6. CONTACT POINTS ..........................................................................................................................13
2.7. SUMMARY....................................................................................................................................16
3. GENERAL ELECTRICAL CONSIDERATIONS...........................................................................18
3.1. CAPACITIVE DECOUPLING ..............................................................................................................18
3.2. GROUND PLANES..........................................................................................................................19
3.2.1. PCB Layout, Ground Planes and ESD ...................................................................................21
3.3. POWER PLANES AND POWER LINES.................................................................................................22
3.4. FILTERING....................................................................................................................................23
3.5. FERRITES .....................................................................................................................................26
3.6. SUMMARY....................................................................................................................................27
4. PanelLinkTM APPLICATION CONSIDERATIONS .....................................................................28
4.1. CAPACITIVE DECOUPLING ..............................................................................................................28
4.2. PARALLEL DATA LINE LOADING.....................................................................................................29
4.3. POWER DISTRIBUTION AND GROUND PLANES..................................................................................30
4.4. SIGNAL CABLE CONFIGURATION ....................................................................................................31
4.5. FILTERING....................................................................................................................................33
4.6. ESD PROTECTION .........................................................................................................................33
4.7. SUMMARY....................................................................................................................................34
5. EMI TROUBLESHOOTING TIPS AND CONCLUSIONS............................................................35

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