MSM7225™ Mobile Station Modem153页大小7.26MB资料全

voir2008

1Overview
1.1Scope and intended audience...............................................................................12
1.2Application description........................................................................................12
1.2.1MSM7225 device general features......................................................17
1.3MSM7225 device features....................................................................................18
1.3.1HSUPA features...................................................................................19
1.3.2HSDPA features...................................................................................19
1.3.3WCDMA R99 features........................................................................20
1.3.4GSM/GPRS features............................................................................21
1.3.5GPRS features......................................................................................21
1.3.6EDGE features ....................................................................................21
1.3.7MSM7225 audio processing features...................................................22
1.3.8MSM7225 microprocessor subsystem.................................................22
1.3.9Supported interface features.................................................................23
1.3.10Supported multimedia features............................................................23
2Pin Descriptions
2.1I/O description parameters...................................................................................26
3Electrical Specifications
3.1DC electrical specifications..................................................................................53
3.1.1Absolute maximum ratings..................................................................53
3.1.2Recommended operating conditions....................................................54
3.1.3DC characteristics................................................................................55
3.1.4Power consumption characteristics......................................................57
3.1.5Power sequencing................................................................................57
3.2Timing characteristics..........................................................................................59
3.2.1Timing diagrams..................................................................................59
3.2.2Rise and fall time.................................................................................60
3.2.3Clocks..................................................................................................62
3.2.4EBI Bus................................................................................................63
3.2.5Auxiliary interface...............................................................................83
3.3Mixed-signal characteristics.................................................................................88
3.3.1HKADC specifications........................................................................88
3.3.2Touch screen ADC specifications........................................................89
3.3.3PCM interface......................................................................................89
3.3.4I2S/stereo DAC interface specification................................................93
3.3.5Codec specifications............................................................................95
3.3.6Sleep clock.........................................................................................133
4Mechanical Specifications
4.1Device physical dimensions...............................................................................134
4.2Part marking.......................................................................................................136
4.3Device ordering information..............................................................................137
4.4Device moisture sensitivity level (MSL)............................................................138
4.5Device thermal characteristics............................................................................139
5PCB Mounting Guidelines
5.1Land pad and stencil design...............................................................................141
5.2SMT development and characterization.............................................................141
5.3SMT peak package body temperature................................................................142
5.4SMT process verification...................................................................................143
5.5Storage conditions, unpacking, and handling.....................................................143
5.5.1Storage conditions..............................................................................143
5.5.2Out-of-bag duration...........................................................................143
5.5.3Baking................................................................................................143
5.5.4Electrostatic discharge.......................................................................144
6Packing Methods and Materials
6.1Tape and reel information...................................................................................145
6.2Barcode label......................................................................................................146
6.3Packing for shipment..........................................................................................147
6.3.1Moisture barrier bag with caution label.............................................147
6.3.2Desiccant............................................................................................149
6.3.3Humidity indicator card.....................................................................149
6.4Intermediate box.................................................................................................151
7Part Reliability Test Specification
7.1Reliability qualifications summary....................................................................152
7.2Qualification sample description........................................................................153

【文件名】:13311@52RD_MSM7225 Mobile Station Modem.rar
【格　式】:rar
【大　小】:2420K
【简　介】:
【目　录】:

j_yun2069

太感谢了，我很想学习呐[em01]

SWT80001

[em01]这个有介绍脚位额度定义吗

JSmilkyway

好贵啊。。。攒钱。。。。

cnjenkins

刚好需要谢谢了

nodds

这个是好东西