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Upload the attached AP module total solution for your evaluation and studying, this can support you for easy/flexible design and time to market(production MP within 3 month)...
If you are interested about this, please send mail to tiborlee@jorjin.com.tw or call 13732663036 and we will link with you for releasing the further documents and arrange the live demo to your team then evaluate supporting.
[Overview of Solution]
Jorjin AP module is a powerful processor-on-module with integrated power managment and audio codec. The AP module contains an ARM Cortex A8 up to 1GHz, a powerful TI C64x+DSP, and POWERVR SGX graphic accelerator, along with the TI TPS65950 (Power Manager with Audio codec).
Jorjin wireless connectivity solutions are SiP (system in package) modules optimized for handsets, embedded systems and portable devices. This product line utilizes the most advanced WiFi and BT coexistence interoperability and power saving technologies from TI.
[Features]
AP module
Dimension: 29.5mm x 22.0mm x 2.8mm
*Easy to Assemble 1.0mm pitch LGA
*Faster time to market and reduced PCB cost
*Android 2.3 & Linux board support package
*Memory: 512MB (4Gb) NAND Flash, 256MB (2Gb) LP-DDR (can be customized
Wireless Connectivity
*WLAN, BT and FM (and GPS) on a SiP module
*LGA 96 pin package
*Internal support for WLAN and BT Coexistence (bandwidth and antenna sharing)
[System/others]
AP module (DM3730 / AM3715 @ 1GHz)
*4Gb NAND Flash/ 4Gb LP-DDR
*4Gb NAND Flash/ 2Gb LP-DDR
*1Gb NAND Flash/ 512M LP-DDR
Wireless Connectivity
*WG7310-0A (WLAN 802.11b/g/n, BT, FM)
*WG7350-00 (WLAN 802.11a/b/g/n, BT, FM)
If need further info about this AP with wireless total solution, please mail to :tiborlee@jorjin.com.tw or call 13732663036, thanks!
▽恅璃靡▼:12923@52RD_DM37xx series AP Module bief.pdf
▽跡﹛宒▼:pdf
▽湮﹛苤▼:1029K
▽潠﹛賡▼:
▽醴﹛翹▼:
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