AP module: Total solution with 1G MHz AP, 4G LPDDR, 4G FLASH, PMU, WIFI/BT/FM

Tiborlee · 发表于 2011-8-23 09:53:41

Upload the attached AP module total solution for your evaluation and studying, this can support you for easy/flexible design and time to market(production MP within 3 month)...
If you are interested about this, please send mail to tiborlee@jorjin.com.tw or call 13732663036 and we will link with you for releasing the further documents and arrange the live demo to your team then evaluate supporting.

[Overview of Solution]
Jorjin AP module is a powerful processor-on-module with integrated power managment and audio codec. The AP module contains an ARM Cortex A8 up to 1GHz, a powerful TI C64x+DSP, and POWERVR SGX graphic accelerator, along with the TI TPS65950 (Power Manager with Audio codec).
Jorjin wireless connectivity solutions are SiP (system in package) modules optimized for handsets, embedded systems and portable devices. This product line utilizes the most advanced WiFi and BT coexistence interoperability and power saving technologies from TI.

[Features]
AP module
Dimension: 29.5mm x 22.0mm x 2.8mm
*Easy to Assemble 1.0mm pitch LGA
*Faster time to market and reduced PCB cost
*Android 2.3 & Linux board support package
*Memory: 512MB (4Gb) NAND Flash, 256MB (2Gb) LP-DDR (can be customized

Wireless Connectivity
*WLAN, BT and FM (and GPS) on a SiP module
*LGA 96 pin package
*Internal support for WLAN and BT Coexistence (bandwidth and antenna sharing)

[System/others]
AP module (DM3730 / AM3715 @ 1GHz)
*4Gb NAND Flash/ 4Gb LP-DDR
*4Gb NAND Flash/ 2Gb LP-DDR
*1Gb NAND Flash/ 512M LP-DDR

Wireless Connectivity
*WG7310-0A (WLAN 802.11b/g/n, BT, FM)
*WG7350-00 (WLAN 802.11a/b/g/n, BT, FM)
*WG7500-00 (WLAN 802.11b/g/n, BT, FM, GPS)
*WG7550-00 (WLAN 802.11a/b/g/n, BT, FM, GPS)

[/UseMoney]
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Tiborlee · 发表于 2011-9-3 18:08:28

UP! UP!...[em01][em01][em01]

gjy938815 · 发表于 2011-10-21 12:04:39

资料不错啊，谢谢

Tiborlee · 发表于 2011-10-17 09:14:02

UP! UP!...[em01][em01][em01]

Tiborlee · 发表于 2011-11-6 17:02:13

UP! UP![em01][em01][em01][em01]

Tiborlee · 发表于 2011-11-17 22:46:31

If need further info about this AP with wireless total solution, please mail to :tiborlee@jorjin.com.tw or call 13732663036, thanks!

[em01][em01][em01][em01][em01]

conscience3249 · 发表于 2011-12-4 22:54:31

good~~~

Tiborlee · 发表于 2012-1-6 09:20:02

UP! UP!...[em01][em01][em01][em01]

powerpan · 发表于 2012-2-2 00:52:35

啥价格?

Tiborlee · 发表于 2012-3-5 00:33:42

UP! UP![em01][em01][em01]

Tiborlee · 发表于 2012-3-11 15:07:06

This 1GHz ARM+800MHz DSP Processor module with WIFI/BT/FM wireless module total solution can support you design/develop any kind of Pad, Mobile POS... very easily for time to market.

51mobile · 发表于 2012-3-8 20:59:37

有啥用呢

sympot · 发表于 2012-3-27 12:58:35

这是那家?

找  NAND 1G ,2G 4G,8G
  DDR  128*8, 256*8,128*16,256*16

EMMC

可以找我

蔡  13715253158

shinlly0755 · 发表于 2012-3-26 12:20:44

无线中继,应该会有市场的!
我们目前有一款65*45左右的
给大家参考
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lizaofei168 · 发表于 2012-3-22 22:15:02

Hynix总代理章生 13924645577 MSN: fei-zhang@hotmail.com QQ:554166435
Mobile SDRAM - 2Gb
Part No. Org. Vol. Speed Power PKG
H55S2G22AFR x32 1.8V 60/75/A3 Low Power 90 FBGA
H55S2G62AFR x16 1.8V 60/75/A3 Low Power 54 FBGA
Mobile SDRAM - 1Gb
Part No. Org. Vol. Speed Power PKG
H55S1G22AFR x32 1.8V 60/75/A3 Low Power 90 FBGA
H55S1G22BFR x32 1.8V 60/75/A3 Low Power 90 FBGA
H55S1G62AFR x16 1.8V 60/75/A3 Low Power 54 FBGA
H55S1G62BFR x16 1.8V 60/75/A3 Low Power 54 FBGA
Mobile SDRAM - 512Mb
Part No. Org. Vol. Speed Power PKG
H55S5122DFR x32 1.8V 60/75/A3 Low Power 90 FBGA
H55S5122EFR x32 1.8V 60/75/A3 Low Power 90 FBGA
H55S5162DFR x16 1.8V 60/75/A3 Low Power 54 FBGA
H55S5162EFR x16 1.8V 60/75/A3 Low Power 54 FBGA
Mobile SDRAM - 256Mb
Part No. Org. Vol. Speed Power PKG
H55S2562NFR x16 1.8V 60/75/A3 Low Power 54 FBGA
H55S2622NFR x32 1.8V 60/75/A3 Low Power 90 FBGA
Mobile DDR - 2Gb
Part No. Org. Vol. Speed Power PKG
H5MS2G22AFR x32 1.8V E3/Q3/J3 Low Power 90 FBGA
H5MS2G22MFR x32 1.8V EB/Q3/J3 Low Power 90 FBGA
H5MS2G62AFR x16 1.8V E3/Q3/J3 Low Power 60 FBGA
H5MS2G62MFR x16 1.8V EB/Q3/J3 Low Power 60 FBGA
Mobile DDR - 1Gb
Part No. Org. Vol. Speed Power PKG
H5MS1G22AFR x32 1.8V E3/J3 Low Power 90 FBGA
H5MS1G22BFR x32 1.8V E3/J3/K3/L3 Low Power 90 FBGA
H5MS1G62AFR x16 1.8V E3/J3 Low Power 60 FBGA
H5MS1G62BFR x16 1.8V E3/J3/K3/L3 Low Power 60 FBGA
Mobile DDR - 512Mb
Part No. Org. Vol. Speed Power PKG
H5MS5122DFR x32 1.8V E3/J3/K3/L3 Low Power 90 FBGA
H5MS5122EFR x32 1.8V E3/J3/K3/L3 Low Power 90 FBGA
H5MS5162DFR x16 1.8V E3/J3/K3/L3 Low Power 60 FBGA
H5MS5162EFR x16 1.8V E3/J3/K3/L3 Low Power 60 FBGA
Mobile DDR - 256Mb
Part No. Org. Vol. Speed Power PKG
H5MS2562NFR x16 1.8V E3/J3/K3/L3 Low Power 60 FBGA
H5MS2622NFR x32 1.8V E3/J3/K3/L3 Low Power 90 FBGA
Mobile DDR2 - 4Gb
Part No. Org. Vol. Speed Power PKG
H9TCNNN4KDMPRR x32 1.8V-1.2V-1.2V Y / D Low Power 168

Mobile DDR2 - 8Gb
Part No. Org. Vol. Speed Power PKG
H8TKNNN8PDMPRR x32 1.8V-1.2V-1.2V Y / D Low Power 168
Hynix eMMC(eNAND)
Part Number Density Tech PKG Size Spec
H26M31001FPR 4GB 26nm 11.5X13X0.8 MMC4.41
H26M42001FMR 8GB 26nm 11.5X13X1.0 MMC4.41
H26M54001DQR 16GB 26nm 12X16X1.0 MMC4.41
H26M52002CKR 16GB 32nm 14X18X1.2 MMC4.41
H26M64002BNR 32GB 32nm 14X18X1.4 MMC4.41
H26M68001CFR 32GB 26nm 12X16X1.2 MMC4.41
H26M78002ANR 64GB 26nm 14X18X1.4 MMC4.41

manuel_1 · 发表于 2012-8-20 11:57:12

你说的4G，是4Gbit ,还是4Gbyte,这一点要搞清楚。

szhtcomm · 发表于 2012-9-18 18:30:08

不知道有没有用处。

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[资料] AP module: Total solution with 1G MHz AP, 4G LPDDR, 4G FLASH, PMU, WIFI/BT/FM

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