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[讨论] 【苏州】美资500强工业控制集团找寻手机基带设计高级工程师

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发表于 2010-4-7 10:01:18 | 显示全部楼层 |阅读模式
POSITION SUMMARY
Responsible for design and development and support of Electrical / Electronics systems for mobile computers and peripherals. Will assist with managing EOL components, triage of field issues, and design validation.

PRINCIPAL RESPONSIBILITIES
Area of Responsibility[/COLOR]
1. Digital electronics design               
Design and development of schematics for electronic assemblies
Performs cost, performance, and energy efficiency analysis mobile computer systems
Ensures design compliance with global HSM architecture plan.
2. Design validation and testing               
Performs design val
idation for internal and ODM designs.
Develops, executes, and documents DVT (Design Validation Testing) test plans.
Develops, executes, and documents EVT (Engineering Validation Testing) test plans
Performs schematic architectural review with design partners.

3.Triage of customer / manufacturing issues               
Provides level III support for customer field issues.
Works closely with BSP developers to triage issues and develop corrective action plan.
Works directly with manufacturing team to resolve electronic assemble / system design issues.

4.Manages EOL components               
Works with sourcing to ensure compliance with HSM AVL component selection process
Works with manufacturing and quality teams to test and qualify EOL replacement components
             
KNOWLEDGE, SKILLS AND ABILITIES [/COLOR]
Education level and/or relevant experience(s)
Bachelor of Science in Electrical Engineering or Computer Engineering is required.
2-5 years high speed digital design experience is required.
Prefer design experience in portable battery powered devices.
Design experience with RF/ Telephony systems is beneficial.

Knowledge and skills (general and technical)[/COLOR]
Experience with Orcad® [/COLOR]schematic capture tools is very desirable.
Strong analytical circuit analysis and debug skills are required.
Proven experience at trouble shooting field issues is required.
Proven DFMEA skills are desirable.

Other requirements (licenses, certifications, specialized training, physical or mental abilities required)[/COLOR]
Ability to read and write English is highly desireable.


补充几点:
工作地点:苏州工业园区
薪资待遇:1年13薪+2-3个月的绩效奖金+车贴+苏州工业区标准的四金福利(国内最高)+额外医疗保险
注意事项:英文可以做技术口头交流,面试中会有美国总部的英文电话面试环节
发展目标:目前是一个全新的团队,这个BU将会发展新一代智能手机平台下手持条形码扫描设备系统,如果应聘者除了熟悉基本的数字电路设计之外,还熟悉手机电源管理电路以及RF信号设计的话,薪资还有一定程度提高。

本人联系方式如下:
电子邮件:bill@21cnmanager.com
QQ:5667805
msn: jialei.liu@hotmail.com
Gtalk: jialei.liu@gmail.com
 楼主| 发表于 2010-4-7 17:12:12 | 显示全部楼层
顶顶才健康~~[em06]
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 楼主| 发表于 2010-4-8 17:06:52 | 显示全部楼层
一日一顶啊~~现在收到几份不错简历了,但是岗位数量众多,欢迎大家继续联系本人呀~~~[em08]
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 楼主| 发表于 2010-5-6 10:47:26 | 显示全部楼层
每日一顶!
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发表于 2010-5-28 19:57:13 | 显示全部楼层
3年手机基带经验 欧洲知名手机研发,英语没问题 能给多少米啊 呵呵[em01]
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