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[讨论] USB3.0规范(E文版的)

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发表于 2009-12-8 11:49:46 | 显示全部楼层 |阅读模式
USB3.0规范(E文版的)
Universal Serial Bus 3.0 Specification

【文件名】:09128@52RD_USB3.0规范(英文版).pdf
【格 式】:pdf
【大 小】:3924K
【简 介】:
【目 录】:
Contents
1 Introduction ................................................................................................. 1-1
1.1 Motivation .................................................................................................................1-1
1.2 Objective of the Specification ...................................................................................1-2
1.3 Scope of the Document............................................................................................1-2
1.4 USB Product Compliance.........................................................................................1-2
1.5 Document Organization............................................................................................1-3
1.6 Design Goals............................................................................................................1-3
1.7 Related Documents..................................................................................................1-3
2 Terms and Abbreviations ........................................................................... 2-1
3 USB 3.0 Architectural Overview................................................................. 3-1
3.1 USB 3.0 System Description ....................................................................................3-1
3.1.1 USB 3.0 Physical Interface.....................................................................3-2
3.1.1.1 USB 3.0 Mechanical........................................................3-2
3.1.2 USB 3.0 Power .......................................................................................3-3
3.1.3 USB 3.0 System Configuration...............................................................3-3
3.1.4 USB 3.0 Architecture Summary..............................................................3-3
3.2 SuperSpeed Architecture .........................................................................................3-4
3.2.1 Physical Layer ........................................................................................3-5
3.2.2 Link Layer ...............................................................................................3-6
3.2.3 Protocol Layer.........................................................................................3-7
3.2.4 Robustness.............................................................................................3-8
3.2.4.1 Error Detection ................................................................3-8
3.2.4.2 Error Handling .................................................................3-9
3.2.5 SuperSpeed Power Management...........................................................3-9
3.2.6 Devices.................................................................................................3-10
3.2.6.1 Peripheral Devices ........................................................3-10
3.2.6.2 Hubs..............................................................................3-11
3.2.7 Hosts ....................................................................................................3-12
3.2.8 Data Flow Models.................................................................................3-12
4. SuperSpeed Data Flow Model.................................................................... 4-1
4.1 Implementer Viewpoints ...........................................................................................4-1
4.2 SuperSpeed Communication Flow...........................................................................4-1
4.2.1 Pipes.......................................................................................................4-2
4.3 SuperSpeed Protocol Overview ...............................................................................4-2
4.3.1 Differences from USB 2.0.......................................................................4-2
4.3.1.1 Comparing USB 2.0 and SuperSpeed Transactions.......4-3
4.3.1.2 Introduction to SuperSpeed Packets...............................4-4
4.4 Generalized Transfer Description.............................................................................4-4
4.4.1 Data Bursting..........................................................................................4-5
4.4.2 IN Transfers............................................................................................4-5
4.4.3 OUT Transfers........................................................................................4-6
4.4.4 Power Management and Performance...................................................4-7
4.4.5 Control Transfers....................................................................................4-8
4.4.5.1 Control Transfer Packet Size ..........................................4-8
4.4.5.2 Control Transfer Bandwidth Requirements .....................4-8
4.4.5.3 Control Transfer Data Sequences...................................4-9
4.4.6 Bulk Transfers.........................................................................................4-9
4.4.6.1 Bulk Transfer Data Packet Size ......................................4-9
4.4.6.2 Bulk Transfer Bandwidth Requirements........................4-10
4.4.6.3 Bulk Transfer Data Sequences .....................................4-10
4.4.6.4 Bulk Streams.................................................................4-11
4.4.7 Interrupt Transfers ................................................................................4-12
4.4.7.1 Interrupt Transfer Packet Size ......................................4-13
4.4.7.2 Interrupt Transfer Bandwidth Requirements .................4-13
4.4.7.3 Interrupt Transfer Data Sequences...............................4-14
4.4.8 Isochronous Transfers..........................................................................4-14
4.4.8.1 Isochronous Transfer Packet Size ................................4-15
4.4.8.2 Isochronous Transfer Bandwidth Requirements ...........4-15
4.4.8.3 Isochronous Transfer Data Sequences.........................4-16
4.4.9 Device Notifications ..............................................................................4-16
4.4.10 Reliability ..............................................................................................4-16
4.4.10.1 Physical Layer...............................................................4-16
4.4.10.2 Link Layer......................................................................4-16
4.4.10.3 Protocol Layer ...............................................................4-17
4.4.11 Efficiency ..............................................................................................4-17
5 Mechanical ................................................................................................... 5-1
5.1 Objective ..................................................................................................................5-1
5.2 Significant Features..................................................................................................5-1
5.2.1 Connectors .............................................................................................5-1
5.2.1.1 USB 3.0 Standard-A Connector ......................................5-2
5.2.1.2 USB 3.0 Standard-B Connector ......................................5-2
5.2.1.3 USB 3.0 Powered-B Connector ......................................5-2
5.2.1.4 USB 3.0 Micro-B Connector............................................5-2
5.2.1.5 USB 3.0 Micro-AB and USB 3.0 Micro-A Connectors.....5-3
5.2.2 Compliant Cable Assemblies..................................................................5-3
5.2.3 Raw Cables ............................................................................................5-3
5.3 Connector Mating Interfaces ....................................................................................5-4
5.3.1 USB 3.0 Standard-A Connector..............................................................5-4
5.3.1.1 Interface Definition ..........................................................5-4
5.3.1.2 Pin Assignments and Description .................................5-14
5.3.1.3 USB 3.0 Standard-A Connector Color Coding ..............5-14
5.3.2 USB 3.0 Standard-B Connector............................................................5-15
5.3.2.1 Interface Definition ........................................................5-15
5.3.2.2 Pin Assignments and Description .................................5-20
5.3.3 USB 3.0 Powered-B Connector............................................................5-20
5.3.3.1 Interface Definition ........................................................5-20
5.3.3.2 Pin Assignments and Descriptions................................5-25
5.3.4 USB 3.0 Micro Connector Family .........................................................5-25
5.3.4.1 Interfaces Definition ......................................................5-25
5.3.4.2 Pin Assignments and Description .................................5-33
5.4 Cable Construction and Wire Assignments............................................................5-35
5.4.1 Cable Construction ...............................................................................5-35
5.4.2 Wire Assignments.................................................................................5-36
5.4.3 Wire Gauges and Cable Diameters ......................................................5-36
5.5 Cable Assemblies...................................................................................................5-37
5.5.1 USB 3.0 Standard-A to USB 3.0 Standard-B Cable Assembly.............5-37
5.5.2 USB 3.0 Standard-A to USB 3.0 Standard-A Cable Assembly.............5-38
5.5.3 USB 3.0 Standard-A to USB 3.0 Micro-B Cable Assembly ..................5-39
5.5.4 USB 3.0 Micro-A to USB 3.0 Micro-B Cable Assembly ........................5-41
5.5.5 USB 3.0 Micro-A to USB 3.0 Standard-B Cable Assembly ..................5-43
5.5.6 USB 3.0 Icon Location..........................................................................5-44
5.5.7 Cable Assembly Length........................................................................5-45
5.6 Electrical Requirements .........................................................................................5-46
5.6.1 SuperSpeed Electrical Requirements...................................................5-46
5.6.1.1 Raw Cable.....................................................................5-46
5.6.1.1.1 Characteristic Impedance.........................................5-46
5.6.1.1.2 Intra-Pair Skew.........................................................5-46
5.6.1.1.3 Differential Insertion Loss.........................................5-47
5.6.1.2 Mated Connector...........................................................5-47
5.6.1.3 Mated Cable Assemblies ..............................................5-48
5.6.1.3.1 Differential Insertion Loss (EIA-360-101) .................5-49
5.6.1.3.2 Differential Near-End Crosstalk between
SuperSpeed Pairs (EIA-360-90)........................5-50
5.6.1.3.3 Differential Crosstalk between D+/D- and
SuperSpeed Pairs (EIA-360-90)........................5-51
5.6.1.3.4 Differential-to-Common-Mode Conversion...............5-52
5.6.2 DC Electrical Requirements..................................................................5-52
5.6.2.1 Low Level Contact Resistance (EIA 364-23B) ..............5-52
5.6.2.2 Dielectric Strength (EIA 364-20) ...................................5-52
5.6.2.3 Insulation Resistance (EIA 364-21)...............................5-53
5.6.2.4 Contact Current Rating (EIA 364-70, Method 2) ...........5-53
5.7 Mechanical and Environmental Requirements.......................................................5-53
5.7.1 Mechanical Requirements ....................................................................5-53
5.7.1.1 Insertion Force (EIA 364-13).........................................5-53
5.7.1.2 Extraction Force (EIA 364-13).......................................5-53
5.7.1.3 Durability or Insertion/Extraction Cycles (EIA 364-09) ..5-53
5.7.1.4 Cable Flexing (EIA 364-41, Condition I)........................5-54
5.7.1.5 Cable Pull-Out (EIA 364-38, Condition A).....................5-54
5.7.1.6 Peel Strength (USB 3.0 Micro Connector
Family Only) ..................................................................5-54
5.7.1.7 4-Axes Continuity Test (USB 3.0 Micro Connector
Family Only) ..................................................................5-54
5.7.1.8 Wrenching Strength (Reference, USB 3.0 Micro
Connector Family Only) ................................................5-56
5.7.1.9 Lead Co-Planarity .........................................................5-56
5.7.1.10 Solderability...................................................................5-56
5.7.1.11 Restriction of Hazardous Substances (RoHS)






发表于 2010-5-26 13:44:09 | 显示全部楼层
谢谢分享
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发表于 2010-7-28 22:31:50 | 显示全部楼层
支持免费
本文来自:我爱研发网(52RD.com) - R&D大本营
详细出处:http://www.52rd.com/bbs/Detail_RD.BBS_174800_38_1_1.html
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发表于 2014-8-3 12:44:02 | 显示全部楼层
THANKS
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发表于 2014-8-3 19:42:35 来自手机 | 显示全部楼层
好好好来自: Android客户端
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发表于 2014-8-7 22:27:52 来自手机 | 显示全部楼层
收藏。来自: Android客户端
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发表于 2014-8-12 21:28:29 来自手机 | 显示全部楼层
哈哈。来自: Android客户端
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发表于 2014-12-9 10:54:42 | 显示全部楼层
不错
怎么下载?
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发表于 2014-12-23 11:28:58 | 显示全部楼层
怎么下载
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发表于 2016-8-26 14:25:20 | 显示全部楼层
[em01]
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发表于 2016-12-28 17:09:22 | 显示全部楼层
楼主人好
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发表于 2016-12-28 17:32:07 | 显示全部楼层
请问 为什么我看不到从哪里下载,如果您能看到,麻烦帮忙再发一次文档,谢谢
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发表于 2017-2-9 11:20:43 | 显示全部楼层
[em01]  好东西,
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