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[讨论] 通信产品可靠性评估

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发表于 2009-11-1 21:55:51 | 显示全部楼层 |阅读模式
【文件名】:09111@52RD_Reliability Assessment of Telecommunications Equipment.pdf
【格 式】:pdf
【大 小】:1133K
【简 介】:主要讲解通信产品可靠性评估
【目 录】:ABSTRACT.....................................................................................................................iii
PREFACE .........................................................................................................................v
CONTENTS....................................................................................................................vii
LIST OF SYMBOLS .......................................................................................................xi
ABBREVIATIONS........................................................................................................xiv
1 INTRODUCTION ....................................................................................................1
2 COMPONENT LEVEL RELIABILITY ANALYSIS ............................................. 4
2.1 The Definition of Reliability.................................................................................... 4
2.2 Empirical Models..................................................................................................... 4
2.3 Physical Models ....................................................................................................... 5
2.4 Development in Component Reliability................................................................... 6
2.5 Reliability Information............................................................................................. 7
2.6 Component Level Reliability Analysis in This Thesis........................................... 12
3 THE EFFECT OF CONSTANT TEMPERATURE............................................... 14
3.1 Introduction............................................................................................................ 14
3.2 Background ............................................................................................................ 14
3.3 The Effect of Derating on Lifetime........................................................................ 15
3.4 Parametric Study.................................................................................................... 17
3.5 The Need for a New Derating Procedure............................................................... 21
3.6 The New Derating Procedure................................................................................. 22
3.6.1 General........................................................................................................................22
3.6.2 Setting the reliability target.........................................................................................23
3.6.3 Obtaining the temperature to fulfill the requirement..................................................23
3.6.4 Obtaining uncertainty values and taking into account their effect.............................24
3.7 Conclusions............................................................................................................ 30
4 COMMENTARY ON THE IPC SURFACE MOUNT ATTACHMENT
RELIABILITY GUIDELINES............................................................................... 32
4.1 Introduction............................................................................................................ 32
4.2 Background ............................................................................................................ 32
4.3 Engelmaier’s Model............................................................................................... 33
4.4 The Methodology for Creating Reliability Requirements...................................... 35
4.4.1 Use environment..........................................................................................................36
4.4.2 Test environment.........................................................................................................37
4.4.3 Assumptions within the requirements.........................................................................40
4.4.4 The Failure-Free Cycles Criterion ..............................................................................43
4.5 The Applicability of the Guidelines....................................................................... 44
4.6 Discussion .............................................................................................................. 46
5 ANALYSIS OF CERAMIC LEADLESS COMPONENTS .................................. 48
5.1 Introduction............................................................................................................ 48
5.2 Background ............................................................................................................ 48
5.3 Test Setup............................................................................................................... 49
5.4 Test Vehicles.......................................................................................................... 50
5.5 Test Results ............................................................................................................ 51
5.6 Statistical Analysis of the Results .......................................................................... 51
5.7 Finite Element Analysis ......................................................................................... 55
5.8 Interpretation Tool ................................................................................................. 57
viii
5.9 Interpretation of the Test Results........................................................................... 60
5.10 The Effect of Mixed Field Environments .............................................................. 61
5.10.1Background.................................................................................................................61
5.10.2Mixture-of-Distributions Concept ..............................................................................62
5.10.3Mixed Environment Analysis .....................................................................................63
5.10.4The Effect of Mixed Environments in Case of Random Failures..............................67
5.11 Conclusions............................................................................................................ 70
6 COMPARISON OF ANALYTICAL AND SIMULATION BASED RELIABILITY
PREDICTION METHODS .................................................................................... 72
6.1 Introduction............................................................................................................ 72
6.2 Error Sources ......................................................................................................... 72
6.3 Comparison Between Test Performance Predictions............................................. 75
6.3.1 Introduction .................................................................................................................75
6.3.2 Vendor Related Performance Deviations ...................................................................75
6.3.3 Test Performance Predictions of Some Ceramic Components ..................................81
6.4 Benchmark of Field Reliability Predictions........................................................... 83
6.4.1 Introduction .................................................................................................................83
6.4.2 Comparison of Field Lifetime Predictions .................................................................84
6.4.3 Calibration of FEA......................................................................................................85
6.4.4 The Calibration of Engelmaier’s Model .....................................................................88
6.5 Parameter Sensitivity ............................................................................................. 90
6.5.1 General........................................................................................................................90
6.5.2 Parameter Sensitivity...................................................................................................90
6.6 Lifetime Predictions with Error Margin Estimates................................................ 93
6.7 Discussion.............................................................................................................. 96
7 APPROXIMATE HAZARD RATE SELECTION FOR SYSTEM LEVEL
RELIABILITY CONSIDERATIONS.................................................................... 99
7.1 Introduction............................................................................................................ 99
7.2 Some Constant Hazard Rate Approximations of the Weibull Distribution ......... 101
7.3 Resulting Functions and Hazard Rates ................................................................ 106
7.4 Properties of Different Options............................................................................ 110
7.5 Comparison of the Selected Options.................................................................... 113
7.6 Selection of Time Intervals.................................................................................. 114
7.7 Discussion............................................................................................................ 114
7.7.1 The motivation for selecting 2-parameter Weibull distribution...............................114
7.7.2 Constant failure rate and its origin in the field failure data......................................118
7.8 Conclusions.......................................................................................................... 118
8 THE EFFECT OF THE INTRODUCTION OF HIGH-RISK ELECTRONIC
COMPONENTS INTO 3RD GENERATION TELECOMMUNICATIONS
SYSTEMS............................................................................................................. 120
8.1 Terminology ........................................................................................................ 120
8.2 Introduction.......................................................................................................... 120
8.3 Background.......................................................................................................... 121
8.4 Component Level Reliability Assessment ........................................................... 123
8.5 Test Results and Their Interpretation................................................................... 124
8.6 Network Element Dependability ......................................................................... 126
8.6.1 General.......................................................................................................................126
8.6.2 Non-Repairable NE ...................................................................................................127
8.6.3 Repairable NE ...........................................................................................................130
8.7 Dependability of the 3GPP Network System....................................................... 137
8.7.1 Network Architecture................................................................................................137
8.7.2 Availability Analysis of the 3rd Generation Network..............................................139
ix
8.7.3 Analysis Results ........................................................................................................141
8.8 Discussion ............................................................................................................ 144
9 SUMMARY OF THE THESIS ............................................................................ 150
APPENDICES............................................................................................................... 153
REFERENCES..............................................................................................................


发表于 2010-4-27 16:25:36 | 显示全部楼层
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