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TP3021Q Datasheet

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发表于 2009-3-6 16:30:48 | 显示全部楼层 |阅读模式
9mm*9mm的小模块,用起来很方便,内部集成晶振,外围器件少

【文件名】:0936@52RD_TP3021Q_Datasheet.rar
【格 式】:rar
【大 小】:841K
【简 介】:
【目 录】:







1. Overview .......................................................................................................................................................... 6
2. General descriptions ......................................................................................................................................... 6
2.1 Receiving frequency............................................................................................................................... 6
2.2 RF input impedance................................................................................................................................ 6
2.3 Power supply voltage .............................................................................................................................. 6
2.4 Internal clock frequency .......................................................................................................................... 7
2.5 Channel selection system......................................................................................................................... 7
2.6 Transport parameter................................................................................................................................ 7
2.7 Module outline........................................................................................................................................ 8
2.8 Pin description........................................................................................................................................ 9
2.9 Circuit block diagram........................................................................................................................... 10
3. Environmental conditions and test conditions................................................................................................. 11
3.1 Temperature and humidity..................................................................................................................... 11
4. Electrical characteristics ................................................................................................................................. 11
4.1 Absolute maximum ratings .................................................................................................................... 11
4.2 Recommended operation conditions...................................................................................................... 11
4.3 Electrical characteristics ........................................................................................................................ 12
4.3.1 Sensitivity (typical)..................................................................................................................... 12
4.3.2 Current consumption .................................................................................................................. 13
4.3.3 Input/Output characteristics........................................................................................................ 14
5. Application circuit (Example) ......................................................................................................................... 15
5.1 Host CPU/AP/CP has 2 SPI interfaces available (recommend) ............................................................ 15
5.2 Host CPU/AP/CP has only 1 SPI interfaces available........................................................................... 16
5.3 Host CPU/AP/CP has only 1 SPI interface and extra flash available.................................................... 17
5.4 Main Component List........................................................................................................................... 18
6. Information of recommended module land pattern ......................................................................................... 19
7. Instructions ..................................................................................................................................................... 20
7.1 Instructions for mounting a module....................................................................................................... 20
7.2 Cautions for the static electricity........................................................................................................... 20
7.3 Instructions in repair of the mounted board........................................................................................... 20
7.4 Instructions in washing the module ....................................................................................................... 20
7.5 The other instructions ............................................................................................................................ 20
8. Interface Modes .............................................................................................................................................. 21
8.1 SDIO Interface...................................................................................................................................... 21
8.1.1 SD bus feature ............................................................................................................................ 21
8.1.2 SD bus command format ............................................................................................................ 21
8.2 SPI Interface ......................................................................................................................................... 23
8.2.1 SPI bus feature........................................................................................................................... 23
8.2.2 SPI bus command and response format ...................................................................................... 24
8.2.3 Command implementation.......................................................................................................... 28
发表于 2009-3-17 15:09:12 | 显示全部楼层
泰合志恒的,SIP方案吗?
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发表于 2009-5-8 14:37:47 | 显示全部楼层
资料价格。唉[em03]
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发表于 2009-5-22 14:23:12 | 显示全部楼层
XIEXIE.......[em05]
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发表于 2009-5-29 13:27:37 | 显示全部楼层
谢谢楼主, 我顶[em01]
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发表于 2009-12-21 11:10:13 | 显示全部楼层
不错阿,谢谢楼主了,好好看看
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发表于 2009-12-22 09:52:03 | 显示全部楼层
好的~~~
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