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发表于 2007-3-13 11:30:00
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我把这个听着写下来了，无奈英语水平有限，里面很多词都没写出来，麻烦哪位好心人帮帮忙，帮忙校对一下，感激不尽~！！！
In 1937, the Atlantic crossing of the airship Hindenburg ended in disaster,
While docking in Lakehurst New Jersey, the 200,000 cubic meter’s Hydrogen gas is explosively caught on fire. Well the officially confirm to this day, the cause was a well-known physical phenomenon. The spontaneous discharge of static-electricity, this phenomenon comes about quite simply, if two initially neutral objects come in to contact , there is a charge transfer, which then remain up to there separated, distributing itself of the entire surface, on contact without a conductive object so grounding, the charge suddenly escapes, and can possibly arc over shortly before contact. In the Hindenburg case’s bug presumably ignited highly explosive gas.
Back to the present, in the ages of micro-electronic, failures in to fearance caused by static discharge of gain dramatically insignificance, because of the constant decreasing geometry coupled with the increasing ? , micro-electronic components become more and more sensitive to this discharge.
The official designation for this phenomenon is ESD Electro-Static Discharge, it’s the turn will be using from now on.
Because we believe the primary highly integrated IC endangered, we often look over the fact, the simple components like up to electronic devices or dial, so even power semi-conductor can be destroyed by ESD.
The four we began explanting ESD protect measures, we had planted a failures, this is an unacceptable situation when constantan components are being used. Reliably ESD protection is only possible when everybody involve knows where is the causes and facts located. In production practice, this means protected measures from wafer production, all the way to back end in components testing, from development desamply to the delivery of the finish pieces of equipment.
Charges are generated in circulate everywhere; we all know this famous crackling sound when we take off a sweater. A few example should sensitized to a number of charges might come about everyday. By the way, we can only feel this charge from voltages about 3000. Sometimes we don’t even notice when the charge generated, or in the proprietary material like these non-conductor shipping tubes are used. Even the Electro-Static field of an unreleased monitor can lead to and can control ESD stresses. To clarify this point one finally example, when we touch an electrical circuit with our bare fingers, the result has the same energy density of lightning bolt slamming into a tree. The damage to a component is quite similar, charge connections, burnt and broken surfaces and even the ruinous? explosions.
The objective is to avoid ESD failures from wafer production all the way to delivery to the customer.
The most important fact here is our awareness are heighten sensitivity to ESD events. Follow by socoden ternal protection, this is ESD hardening of the components through design procedures in pacific ESD tests. As well as the external protection to reduce ESD stresses organized by Infineon SEP.
The basic progaty involves handling the components in the especially equipped ESD protected area, EPA for short, this is clearly identify the may only be entered by properly equipped trained personnel. The EPA is based on the fundamental principle of only allowing charges to dissipative on the control circumstances to avoid potential differences, as earlier the planning in construction stage, we have to see the floor was grounded and was made of dissipative material. The shelves in work surfaces have to find ground strangers to make sure the charges were not dissipate either too quickly or too slowly. Moveable storage equipment is also fitted with the ground able wheels; the same principle applies to chair wheels. The cover of the posture are also made of dissipate materials. The use of highly chargeable insolated materials especially in clean rooms is often unavoidable for process reasons, they can be neutralize not by grounding but rather only through the use of an ?. One highly sensitive vary differences is mask technology. Through all the production of semi-conductors, there any number of procedures which might result in ESD damage, such as, testing ICs while steeling the wafer stage, bonding the connecting wires, tram and form or checking the components with attachable electros.
Now let’s turn to the main problem, the people who work here. EPAs may only be entered with dissipative release ESD footwear, it is also important to keep the coat constantly fastened. Static charges also have a helpful sad fact, they can be locked in or shielded, if the coat unfastens the electro-static filled someone’s personal clothing might exert the wracked influence in the components. In special cases, instructions may be given to ware dissipative finger cuts or gloves. A reliable item here however wrist straps which should always be tested before the entering the labelled EPA. As sure the ground resistance of the footwear. A heal strap like this one is available for visitors. Of course we sometimes have problems about observing these regulations, but daily routine, causes even most reliable individuals to forget occasional test procedure. To prevent carelessness from gaining apprehend the specially enlarge plans, the gate only opens after the test all been past. When handling components even in the laboratories, some fundamental rules should be strictly observed. For example auto packing should be torn open out side the EPA. Until the ESD label is visible. Connect the wrist strap, then cut open the sealing material do not tear it open. Only approved and properly label packing and filling material may be used in the EPA. In other words no highly chargeable materials like starel foam. Components being unpacked should only come into contact with dissipate materials to avoid hard discharges. If you think this is ? you are wrong, Remember friction, which this experiment demonstrates, can come about it any time during a fully automated manufacturing process, this is why only suitable packing should be use tear as well, in production we have to use define dissipation ? material to keep ESD under control right down the line. Even so a components charge by unpacking are sliding a long material track might discharge on contact with the metal machine barge. This is one ? assembly equipment uses pick and place principle, Virtually without sliding. The sky rocketing development manufacturing technologies call for ongoing research testing. Because practicable solutions can only be found and balance potentials inside in EPA. This is why Infineon technologies ESD laboratory is optimizing the resistance of work surfaces, tools, machinery and packing materials, the widest for id materials in ships subject ongoing testing,? precise results call for high precision, and devotion of great deal of time to the measuring process. Several and environmental factors such as humidity of the selection of test methods also have an effect on results. Instantly, should components need to be shape for ? ,they should of cause also be provided with ESD protective packing, so the no damage cost on root , can excusably actual failure to be tested. This is the only way a process ? will be possible. Through going ESD protection can only be practise with the actor participation of everyone involve. Daily routine often **, this is why ESD awareness of full knowledge physical causes *crucial. Moreover, every ESD staff members responsible for testing his grounding aids such as Wrist Straps and footwear. In addition to the Infineon ESD slocally representative. In Infineon technology also have ? core to prevent ESD damage. Customers and other companies are also able to take advantages of this know-how and technical support.
All Infineon staff members can access ESD online training program on the internet, with the latest test result from the ESD laboratory are also made available worldwide. * prove that failures decreased after ESD training, ESD protect measures.
The minimizations of dimensions in micro-electronics are stably on the move. This means ESD sensitivity were keep rising. Despite protect measures inside the devices, this why the future development of ESD protect measures are Infineon technologies will always be once ? progressing production technology.
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