BGA焊盘设计与布线应用指南

hisunzh

【文件名】:08111@52RD_BGA焊盘设计与布线应用指南.rar
【格　式】:rar
【大　小】:30K
【简　介】:intel公司的BGA焊盘的设计方法以及布线时的注意事项
【目　录】:Maintaining proper control of moisture uptake in components is critical to the prevention
of "popcorning" of the package body or encapsulation material. BGA components, before shipping,
are baked dry and enclosed in a sealed desiccant bag with a desiccant pouch and a humidity indicator
card. Most BGA components are classified as a level 3 or level 4 for moisture sensitivity as per the
IPC/JEDEC Spec J-STD-020, “Moisture/Reflow Sensitivity Calculation of Plastic Surface Mount
Devices.”