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ASM Pacific Technology Ltd. is the world's largest assembly and packaging equipment supplier for the semiconductor industry. Listed in Hong Kong since 1989 (0522.hk), ASM Pacific Technology Ltd. is 54% owned by ASM International N.V., a NASDAQ listed supplier of wafer processing equipment(asmi). ASM Pacific Technology Ltd. with headquarters in Hong Kong has operations in Shenzhen, China, Singapore and Malaysia. We are a leading supplier of a full line of assembly and packaging equipment and process solutions for the semiconductor, photonics and optoelectronics industries. Our financial strength and R&D resources allow us to provide customers with total solutions, process innovation, package development and factory automation.
At moment, ASMPT has two R&D centers in Hong Kong and Singapore. As the steady growth of its business and the swift progress of semiconductor industries in Mainland China, ASM decided to set up its third R&D center in China. Like other R&D centers of ASM, ASM Chengdu R&D center will mainly in the research and development on the core technologies related with semiconductor packaging equipment.
For details of company profile and its products, please visit our website: www.asmpacific.com
Interested applicants should send their CV both in English and Chinese to Mr. He Sheng at she@asmpt.com, with indication to which position interested
Job title: Senior Electronic Engineer/Electronic Engineer
Work place: ASM Technology China in Chengdu.
Job Scope: Research and development on power laser application in semiconductor packaging equipment.
Job requirement:
1. MSc, PhD in Physics, engineer physics and EE with thesis on optoelectronics and laser physics
2. 3-5 years experience in laser head design for high power diode-pumped Q-switch solid-state laser with UV (266 nm and 355 nm) output.
3. Familiar with
- stable laser cavity design by using software tool
- various optical pumped geometry on gain medium such as Nd: YAG, Nd:YVO4 and Nd:YLF,
- use of non-linear crystal such as KTP for harmonic generation, frequency sum and frequency mixing, intra-cavity frequency doubling
- Q-switching and mode locking techniques and
- laser pulse compression technique.
4. Experience in
- characterization of high power laser beam (both cw and pulse mode),
- measurement of M^2 and beam divergence angle.
- pulse duration of very short pulse
5. Experience in the design of diode-pumped solid-state laser power supplies is a plus. |
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