找回密码
 注册
搜索
查看: 712|回复: 3

[资料] SanDisk TransFlash Memory Module 结构规范(5.1节,免费)

[复制链接]
发表于 2008-4-30 12:39:26 | 显示全部楼层 |阅读模式
【文件名】:08430@52RD_SanDisk TransFlash Memory Module 结构规范[1].0.pdf
【格 式】:pdf
【大 小】:1207K
【简 介】:
【目 录】:1. Introduction...................................................................................................1-1
1.1  General Description................................................................................1-1
1.2  Concept...................................................................................................1-1

2. Electrical Specification.................................................................................2-1
2.1  Pins and Registers...................................................................................2-1

3. Mechanical Specifications.............................................................................3-1
3.1  Overview................................................................................................3-1
3.2  TransFlash Memory Module Package....................................................3-1
3.3  Electrical Static Discharge Requirement................................................3-2
3.4  External Signal Contacts.........................................................................3-3
3.5  Mechanical Form Factor.........................................................................3-3

4. TransFlash Memory Module Connector........................................................4-1
4.1  Overview................................................................................................4-1
4.2  Mechanical Description..........................................................................4-1
4.3  Module Detection Switch.......................................................................4-2
4.4  Connector Reliability..............................................................................4-3

5. TransFlash Mechanical Test Method.............................................................5-1
5.1  Module Warpage Test Fixture.................................................................5-1
5.2  Bend Test Method...................................................................................5-1
5.3  Torque Test Method................................................................................5-2
5.4  ESD Test Method....................................................................................5-2

6. TransFlash Adapter Specification..................................................................6-1
5.1  TransFlash to SD/MultiMediaCard.........................................................6-1


Appendix A  Ordering Information...............................................................A-1
Appendix B  SanDisk Worldwide Sales Offices...........................................B-1
Appendix C  Disclaimer of Liability............................................................C-1


发表于 2009-8-14 11:23:50 | 显示全部楼层
好东西,正需要,谢了
点评回复

使用道具 举报

发表于 2010-10-12 20:33:45 | 显示全部楼层
no bad~~![em08][em08]
点评回复

使用道具 举报

发表于 2011-6-1 16:35:05 | 显示全部楼层
thank you!
点评回复

使用道具 举报

高级模式
B Color Image Link Quote Code Smilies

本版积分规则

Archiver|手机版|小黑屋|52RD我爱研发网 ( 沪ICP备2022007804号-2 )

GMT+8, 2024-11-25 23:20 , Processed in 0.051921 second(s), 19 queries , Gzip On.

Powered by Discuz! X3.5

© 2001-2023 Discuz! Team.

快速回复 返回顶部 返回列表