关于各种封装缩写的详细说明

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关于各种封装缩写的详细说明
【文件名】:071116@52RD_关于封装中缩写的详细说明.pdf
【格　式】:pdf
【大　小】:512K
【简　介】:Descriptive Designation System
for Semiconductor-device Packages
【目　录】:Foreword ii
1 Scope 1
2 Terms and definitions 2
3 Descriptive designation system for semiconductor-device packages 3
3.1 General 3
3.2 Mandatory fields 5
3.2.1 Package-body material 5
3.2.2 Package-specific features 6
3.2.3 Basic package designator 7
3.3 Optional fields 8
3.3.1 Package differentiator 8
3.3.2 Terminal-count suffixes 9
3.3.3 Supplemental-information field 9
3.4 New descriptive codes 9
Annexes
A Derivation of basic package designators and common names (normative) 10
A.1 Package outline style codes 10
A.2 Terminal-position prefix 11
A.3 Lead-form (or terminal shape) suffix 12
B Nominal package dimensions for use in the detailed information field (informative) 14
C Application of the descriptive designation system (informative) 15
C.1 Objective of the descriptive designation system 15
C.2 Common names 15
D Package classification (informative) 21
D.1 Major classification 21
D.2 Intermediate classification 21
D.3 Minor classification 21
Figures
1 Descriptive designation system for semiconductor-device packages 4
A.1 Illustrations of lead-form (or terminal-shape) 13
C.1 Illustrations of basic package designators 18
Tables
1 Prefixes for predominant package-body material 5
2 Codes for package-specific features 6
3 Codes for seated height and terminal pitch combinations 7
4 Three-letter basic package designators 7
5 Package differentiator suffix codes 8
A.1 Two-letter package outline style codes 10
A.2 Prefixes for terminal position 11
A.3 Suffixes for lead form (or terminal shape) 12
B.1 Nominal package dimensions 14
C.1 Descriptive designation system applications 15
D.1 Semiconductor-device package classifications 22