NOKIA手机-生产工艺文件

XQP

NOKIA手机-生产工艺文件
【文件名】:07117@52RD_NOKIA手机-生产工艺文件.rar
【格　式】:rar
【大　小】:60K
【简　介】:
【目　录】:



Contents
1.     SHIPPING, STORAGE and PRODUCTION ENVIRONMENT..................................................... 2
1.1      General shipping and storage conditions................................................................................... 2
1.2      Storage and handling conditions for solder paste...................................................................... 2
1.3      Storage conditions for underfill epoxy materials........................................................................ 3
1.4      Storage and handling conditions for printed wiring boards [PWBs]........................................... 4
1.5      Shelf life time for different component categories.................................................................... 5
1.6      Drying (baking) moisture sensitive devices............................................................................... 6
2.     PASTE SPECIFICATIONS.............................................................................................................. 7
3.     STENCIL PRINTING PROCESS SPECIFICATIONS.................................................................... 8
3.1      Squeegee................................................................................................................................... 8
3.2      Stencil......................................................................................................................................... 8
3.3      Support tables............................................................................................................................ 9
3.4      Printing process parameters (stencil printing).......................................................................... 10
4.     Statistical Printing Process Control, SPPC........................................................... 11
4.1      Alarm and control limit settings................................................................................................ 11
4.2      Actions when the machine alarms........................................................................................... 12
4.3      Handling of statistical process information.............................................................................. 12
5.     AUTOMATED OPTICAL INSPECTION, AOI............................................................................... 12
5.1      Location of the machine in the production line........................................................................ 12
5.2      Utilisation of inspection results................................................................................................. 12
5.3      Component and paste alarm limits.......................................................................................... 12
6.     Reflow soldering process specification................................................................ 13
6.1      Profile measurement equipment.............................................................................................. 13
6.2      Reflow profile measurement method...................................................................................... 13
6.3      Reflow profile specification...................................................................................................... 14
6.4      Recommended reflow oven settings....................................................................................... 15
7.     MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA.................................... 15
7.1      Manual and semi-automatic hot gas soldering and rework..................................................... 15
7.2      Manual soldering and rework using soldering iron................................................................... 16
7.3      CSP rework.............................................................................................................................. 16
7.4      Specifications for visual inspection; error criteria, faults classification and training material.. 17
8.     Underfill process................................................................................................................ 17
8.1      General..................................................................................................................................... 17
8.2      Dispencing pattern for CSP components................................................................................ 18
9.     PLACEMENT PROCESS SPECIFICATIONS.............................................................................. 19
9.1      Nozzles..................................................................................................................................... 19
9.2      Feeders.................................................................................................................................... 19
9.3      NC-Programs........................................................................................................................... 19
9.4      Part Data / Vision processing................................................................................................... 20
9.5      Placement process management data compatibility table...................................................... 20

didi_key

老兄不能太黑阿！
出来混迟早要还的!

zxuehui

下了。感觉不是很好。现上传各位XD参考一下
【文件名】:07117@52RD_NOKIA手机-生产工艺文件(1).rar
【格　式】:rar
【大　小】:60K
【简　介】:
【目　录】:

xqiang

下了。, 下了。

beker

3楼是个好人呐。Thank you  very much!!

sunny-007

支持免费，顶3楼！

cosychen

三楼朋友真是好人[em01]

carllee

亏死了,直接买了,全是英文的,翻译的很麻烦,还不如自己写呢,严重鄙视LZ

bravexxb

谢谢三楼,一楼楼主怎么想的,一下子就5个币值.

qsmax

thanks for free!

yorkzhang888

谢谢三楼楼主!顶!大家一起顶!

versace

无论如何，下载下来看看，学习一下

zfz110119

谢谢三楼   同时也对一楼的发出也表示谢意[em14]