skyworks关于PA布线与SMT注意事项(有很好的参考价值)

x_jwen

内容不错呀，与一定参考价值.
Skyworks' Multichip Module-Laminate (MCM-L) package is a
system solution that combines both active and passive functions
on a module. MCM-L technology has been used in most of
Skyworks’ Power Amplifier (PA) modules and related applications.
The PA module usually consumes the highest level of current in
the entire mobile terminal system (handset), which results in high
heat dissipation and the severest thermal-mechanical stress
conditions for the package. Special attention to Printed Circuit
Board (PCB) design and the assembly of PA modules onto the
mobile terminal is extremely critical to achieving optimal heat
dissipation, stress condition, and operating reliability. This
Application Note provides thermal and mechanical background
information, specific guidelines for PCB layout design, Surface
Mount Technology (SMT) assembly processes, and other related
issues for effectively mounting Skyworks MCM-L packages.
【文件名】:06110@52RD_sky77329-2.rar
【简　介】:
【目　录】:
【格　式】:rar
【大　小】:4037K
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[此贴子已经被作者于2006-1-10 17:04:46编辑过]

rld

<P>PCB Design and SMT Assembly / Rework</P><P>俺已经在skyworks主页上下载了</P>

x_jwen

<DIV class=quote><B>以下是引用<I>rld</I>在2006-1-10 16:59:31的发言：</B>

<P>PCB Design and SMT Assembly / Rework</P>
<P>俺已经在skyworks主页上下载了</P></DIV>


那我就免费好了,
[em05][em05]

ADS2005A

哈哈，原来是我们公司的东东啊