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以下是引用titantitan在2006-4-13 21:26:00的发言: 这个必须顶!!!!! 【文件名】:06413@52RD_Modern Receiver Front-End.pdf 【格 式】:pdf 【大 小】:3599K 【简 介】:另一本关于接收机前端设计的经典好书,此书在接收机系统架构和指标分解方面讲解非常透彻全面。然后从芯片设计到layout都深入较深入,对做接收机前端设计的人应该很有参考价值。[ 【目 录】: 1 INTRODUCTION 1[52RD.com] 1.1 Current State of the Art 3[52RD.com] 2 RECEIVER SYSTEM DESIGN 7[52RD.com] 2.1 Frequency Planning 7[52RD.com] 2.1.1 Blockers 8[52RD.com] 2.1.2 Spurs and Desensing 10[52RD.com] 2.1.3 Transmitter Leakage 10[52RD.com] 2.1.4 LO Leakage and Interference 11[52RD.com] 2.1.5 Image 13[52RD.com] 2.1.6 Half IF 13[52RD.com] 2.2 Link Budget Analysis 14[52RD.com] 2.2.1 Linearity 15[52RD.com] 2.2.2 Noise 16[52RD.com] 2.2.3 Signal-to-Noise Ratio 19[52RD.com] 2.2.4 Receiver Gain 20[52RD.com] 2.3 Propagation Effects 21[52RD.com] 2.3.1 Path Loss 22[52RD.com] 2.3.2 Multipath and Fading 23[52RD.com] 2.3.3 Equalization 24[52RD.com] 2.3.4 Diversity 24[52RD.com] 2.3.5 Coding 24[52RD.com] 2.4 Interface Planning 25[52RD.com] 2.5 Conclusion 25[52RD.com] 3 REVIEW OF RECEIVER ARCHITECTURES 27[52RD.com] 3.1 Heterodyne Receivers 28[52RD.com] 3.2 Image Reject Receivers 30[52RD.com] 3.2.1 Hartley Architecture 31[52RD.com] 3.2.2 Weaver Architecture 32[52RD.com] 3.3 Zero IF Receivers 32[52RD.com] 3.4 Low IF Receivers 34[52RD.com] 3.5 Issues in Direct Conversion Receivers 34[52RD.com] 3.5.1 Noise 38[52RD.com] 3.5.2 LO Leakage and Radiation 38[52RD.com] 3.5.3 Phase and Amplitude Imbalance 38[52RD.com] 3.5.4 DC Offset 39[52RD.com] 3.5.5 Intermodulations 41[52RD.com] 3.6 Architecture Comparison and Trade-off 43[52RD.com] 3.7 Conclusion 43[52RD.com] 4 SILICON-BASED RECEIVER DESIGN 47[52RD.com] 4.1 Receiver Architecture and Design 48[52RD.com] 4.1.1 System Description and Calculations 48[52RD.com] 4.1.2 Basics of OFDM 48[52RD.com] 4.1.3 System Architectures 50[52RD.com] 4.1.4 System Calculations 52[52RD.com] 4.2 Circuit Design 54[52RD.com] 4.2.1 SiGe BiCMOS Process Technology 54[52RD.com] 4.2.2 LNA 55[52RD.com] 4.2.3 Mixer 57[52RD.com] 4.2.4 Frequency Divider 61[52RD.com] 4.3 Receiver Design Steps 61[52RD.com] 4.3.1 Design and Integration of Building Blocks 62[52RD.com] 4.3.2 DC Conditions 62[52RD.com] 4.3.3 Scattering Parameters 62[52RD.com] 4.3.4 Small-Signal Performance 63[52RD.com] 4.3.5 Transient Performance 64[52RD.com] 4.3.6 Noise Performance 64[52RD.com] 4.3.7 Linearity Performance 65[52RD.com] 4.3.8 Parasitic Effects 68[52RD.com] 4.3.9 Process Variation 68[52RD.com] 4.3.10 50-[ and Non-50-[ Receivers 68[52RD.com] 4.4 Layout Considerations[52RD.com] 4.5 Characterization of Receiver Front-Ends 70[52RD.com] 4.5.1 DC Test 71[52RD.com] 4.5.2 Functionality Test 71[52RD.com] 4.5.3 S-Parameter Test 71[52RD.com] 4.5.4 Conversion Gain Test 73[52RD.com] 4.5.5 Linearity Test 74[52RD.com] 4.5.6 Noise Figure Test 74[52RD.com] 4.5.7 I/Q Imbalance 74[52RD.com] 4.5.8 DC Offset 74[52RD.com] 4.6 Measurement Results and Discussions 76[52RD.com] 4.6.1 Close Examination of Noise Figure and I/Q Imbalance 79[52RD.com] 4.6.2 Comments on I/Q Imbalance 79[52RD.com] 4.7 Conclusion 80[52RD.com] 5 SUBHARMONIC RECEIVER DESIGNS 83[52RD.com] 5.1 Illustration of Subharmonic Techniques 84[52RD.com] 5.2 Mixing Using Antisymmetric I–V Characteristics 85[52RD.com] 5.3 Impact of Mismatch Effects 89[52RD.com] 5.4 DC Offset Cancellation Mechanisms 92[52RD.com] 5.4.1 Intrinsic DC Offset Cancellation 92[52RD.com] 5.4.2 Extrinsic DC Offset Cancellation 93[52RD.com] 5.5 Experimental Verification of DC Offset 94[52RD.com] 5.6 Waveform Shaping Before Mixing 98[52RD.com] 5.6.1 Theory and Analysis 101[52RD.com] 5.6.2 Experimental Verification on GaAs MESFET APDP 102[52RD.com] 5.6.3 Implementation in Silicon 106[52RD.com] 5.7 Design Steps for APDP-Based Receivers 109[52RD.com] 5.8 Architectural Illustration 111[52RD.com] 5.9 Fully Monolithic Receiver Design Using Passive APDP Cores 112[52RD.com] 5.9.1 Integrated Direct Conversion Receiver MMIC’s 112[52RD.com] 5.9.2 Receiver Blocks 113[52RD.com] 5.9.3 Additional Receiver Blocks 121[52RD.com] 5.10 Reconfigurable Multiband Subharmonic Front-Ends 124[52RD.com] 5.11 Conclusion 125[52RD.com] 6 ACTIVE SUBHARMONIC RECEIVER DESIGNS 127[52RD.com] 6.1 Stacking of Switching Cores 128[52RD.com] 6.1.1 Description and Principles 128[52RD.com] 6.1.2 Subharmonic Receiver Architecture 131[52RD.com] 6.2 Parallel Transistor Stacks 132[52RD.com] 6.2.1 Active Mixer 132[52RD.com] 6.2.2 Receiver Architecture 134[52RD.com] 6.2.3 Extension to Passive Mixers 137[52RD.com] 6.3 Extension to Higher-Order LO Subharmonic[52RD.com] 6.4 Multiple Phase Signal Generation from Oscillators 139[52RD.com] 6.5 Future Direction and Conclusion 140[52RD.com] 7 DESIGN AND INTEGRATION OF PASSIVE COMPONENTS 143[52RD.com] 7.1 System on Package (SoP) 144[52RD.com] 7.1.1 Multilayer Bandpass Filter 146[52RD.com] 7.1.2 Multilayer Balun Structure 148[52RD.com] 7.1.3 Module-Integrable Antennaw 149[52RD.com] 7.1.4 Fully Integrated SoP Module 149[52RD.com] 7.2 On-Chip Inductors 152[52RD.com] 7.2.1 Inductor Modeling 153[52RD.com] 7.2.2 Inductor Parameters 157[52RD.com] 7.2.3 Application in Circuits 158[52RD.com] 7.3 Capacitors 159[52RD.com] 7.4 Differentially Driven Inductors 163[52RD.com] 7.5 Transformers 166[52RD.com] 7.5.1 Electrical Parameters 166[52RD.com] 7.5.2 Physical Construction 168[52RD.com] 7.5.3 Electrical Models 168[52RD.com] 7.5.4 Frequency Response of Transformers 172[52RD.com] 7.5.5 Step-Up/Step-Down Transformers and 176[52RD.com] Circuit Applications[52RD.com] 7.6 On-Chip Filters 177[52RD.com] 7.6.1 Filters Using Bond Wires 179[52RD.com] 7.6.2 Active Filters 179[52RD.com] 7.7 On-Wafer Antennas 185[52RD.com] 7.8 Wafer-Level Packaging 187[52RD.com] 7.9 Conclusion 188[52RD.com] 8 DESIGN FOR INTEGRATION 191[52RD.com] 8.1 System Design Considerations 191[52RD.com] 8.1.1 I/O Counts 191[52RD.com] 8.1.2 Cross-Talk 192[52RD.com] 8.1.3 Digital Circuitry Noise 193[52RD.com] 8.2 IC Floor Plan 193[52RD.com] 8.2.1 Signal Flow and Substrate Coupling 196[52RD.com] 8.2.2 Grounding 196[52RD.com] 8.2.3 Isolation 197[52RD.com] 8.3 Packaging Considerations 198[52RD.com] 8.3.1 Package Modeling 199[52RD.com] 8.3.2 Bonding Limitation 200[52RD.com] 8.4 Conclusion 200[52RD.com] 9 FUTURE TRENDS 203[52RD.com] 9.1 CMOS Cellphones[52RD.com] 9.2 Multiband, Multimode Wireless Solutions 204[52RD.com] 9.3 60 GHz Subsystems in Silicon! 205[52RD.com] 9.4 Interchip Communications 206[52RD.com] 9.5 Ultrawideband Communication Technology 210[52RD.com] 9.6 Diversity Techniques 211[52RD.com] 9.7 Conclusion[52RD.com] <p align=right><font color=red>+5 RD币</font></p>
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