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[讨论] 手机镜头组装相关技术资料

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发表于 2007-10-26 17:36:24 | 显示全部楼层 |阅读模式
以下内容有那位英文高手帮忙翻译一下吗?这资料对我魏重要,小弟英文水平有限,在此谢过了.
E-mail:johny78@21cn.com


Summary of manufacturing requirements
6555 fixed focus VGA module with
JBC lens chip

1) Executive summary:
This document summarizes the basic requirements for manufacturing of the 6555 fixed focus reflow able VGA camera module based on a JBC supplied lens chip.  The primary basis for this are the JBC specifications: EO_033_Lens_Req_Spec_VS6555_VGA_2.2_no_focus_AE, 8024923_A and 7593297 RevA . Those specifications have originally been defined for a traditional adjustable focus module with mount and barrel. Therefore as applicable, adaptations have to be made with respect to the present single part fixed focus design.
2) Overview:
The fixed focus VGA module essentially consists of a single part mount moulded of LCP with a glued-in lens chip supplied by JBC.
Fig. 2.1.schematically shows the mount with outer dimensions of  4.5x4.5x2.075mm3. This single part mount has to be moulded from DuPont Zenite 5130L BK  LCP.  As shown in Fig. 2.2. The outer part of the top surface, side walls and bottom feet are to be metallized with an EMI shielding consisting of at least 1μm Cu covered by 0.1 μm stainless steel.
A cross section of the JBC supplied lens chip with dimensions of 3.5x3.5x1.2 mm3 is schematically shown fin Fig. 2.2. This lens chip is to be glued into the mount forming the fully functional optical module. After visual inspection and verification of optical performance, this part is to be sent in reel tape to the customer.

Fig. 2.1: Scheme of LCP mount top view (left) and bottom view (right). Outer dimensions: 4.5x4.5x2.075mm3

Fig. 2.2: Single piece mount: Schematic view of EMI shielding plated areas. Left: Bottom view with lens, right top view.

Fig. 2.3:  Scheme of cross section for the JBC VGA lens chip with dimension of 3.5x3.5x1.2 mm3.

The JBC contract manufacturing partner is expected to deliver the following items for volume production of the module:
a) Manufacturing of N-cavity (N=4, 8, t.b.a.) mould tools which are capable of producing the LCP mount parts in specified quality, dimension and tolerances. Upon agreement, the mould tools can be supplied by JBC from a qualified, external supplier.
b) Moulding of LCP parts in specified quality, dimension and tolerances.
c) Metal plating for EMI shielding of the moulded mount. Upon agreement, this process can be outsourced to an external, JBC approved supplier.
d) Visual inspection, screening and pick-up of JBC supplied lens chip from UV releasing tape frame
e) Gluing of lens chip into module.
f) 100% optical testing and screening of MTF and BFL of the completed module
g) 100% visual OQC for the finished goods
h) Packing in reel tape, strictly sorted by mould tool and cavity, sealing in agreed upon shipping containers.
i) Generation and supply of all required shipping documents and data.
General:
j) Monitoring, statistical process control and regular reporting of critical process parameters through the complete manufacturing process.
k) Quarterly conduction and reporting of a reliability monitoring program.
3)Mould tool
The N-cavity (N=4, 8, t.b.a.) mould tool has to be capable of producing the LCP mount parts in specified quality, dimension and tolerances. Each cavity has to show a labelling scheme provided by JBC to ensure full traceability of parts. The mould tool has to show a life time of at least 1Mio shots. Upon agreement, the mould tools can be supplied by JBC from a qualified, external supplier.
For any new mould tool, a complete dimensional report, a list of cpk values for critical dimensions and evaluation parts have to be supplied for a representative quantity of devices. Release into production is only accepted for JBC/ST approved tools.

4) Moulding of mounts
Mounts have to be produced according to the above specification documents. As plastic material, liquid crystal polymer: DuPont Zenite 5130L BK is to be used. Only parts from ST approved mould tools and cavities are to be released for production. Parts from different tools and cavities are strictly to be separated.
A solid level of quality control has to be implemented for production of above parts. For each batch of parts an each cavity, quality data (mean, std. Dev., and Cpk) on the t.b.a critical dimensions and supplemental characterization tests have to be supplied for a representative quantity of devices. The sampling rate will be defined based on experience gained from production data. All measurement equipment has to be calibrated and has to show capable R&R.
The surface quality has to conform to the ST demerit system, described e.g. in ST Spec 7593297 Rev A. Moulded parts have to be free of flash. On the mount surface, there may not be any features or fibers which might break off and could fall onto the CMOS sensor chip. All part have to undergo an extensive cleaning before used for assembly.
5) Plating of mounts
The outer surfaces sketched in Fig. 5.1 of the mounts must be plated with an EMI shielding consisting of at least 1μm Cu covered by 0.1 μm stainless steel. Most important is that the plating is capable to withstand the reflow conditions of heating to  3x260C for 30s without any change. Upon agreement, this process can be outsourced to an external, JBC approved supplier.  All relevant details are described in ST Spec 7593297 Rev A.
With each plating batch, process information, including the resistance measured on a representative number of samples, as well as layer thickness measured on a witness sample is to be supplied. The adhesion of plating after the reflow process is to be verified on a regular basis. The frequency and method is to be agreed upon with JBC.

Fig. 5.1: Mount areas to be plated with EMI shielding
6) Delivery of JBC lens chip
JBC will supply diced lens chips on UV releasing tape frame together with relevant process data. The manufacturing partner will have pick-up these chips from tape and has to do a 100% visual inspection according to agree upon criteria and screening from both lens sides before assembly.
7) Assembly of JBC lens chip
General
Module assembly, testing and packaging for shipment has to be done in clean room environment. Clean room conditions and practice, including dressing of operators has to be in such way that a critical particle size below 5μm is guaranteed.
Assembly of module
The JBC lens chip is to be glued into the barrel using the thermal curing ThreeBond 2234E epoxy (Curing conditions: 150oC, 30minutes). Fig. 7.1 schematically shows the gluing areas. For redundancy, both glue pockets in the barrel have to be used for attaching the lens chip. Gluing has to be performed in such way, that:
? There is no tilt of the lens chip in the barrel.
? The lens chip is precisely pressed onto the 4 Lens reference pads on the bottom of the barrel.
? There is no spilling of glue into more than 50% of the inner area indicated in Fig. 7.1

Fig. 7.1: Scheme of glue application for lens chip fixing in module. Glue has to be applied in both pockets. No flow of glue into 50% of inner area is allowed.
Push out force for the glued-in lens chips have to be assessed on a meaningful population for every lot. A minimum push-out force of 500gf has to be guaranteed. The sampling rate will be defined by JBC based on experience gained from production data. The quality data of push-out force has to be supplied with every lot.
8) Testing of module
The completely assembled module has to be 100% tested for MTF and screened for optical performance. A gauge R&R of the measurement equipment has to be performed in order to demonstrate satisfactory measurement system performance. A cross calibration to the ST and JBC MTF testers has to be performed for production all MTF test equipment.
As shown in Fig. 8.1, the focus plane for this module will be about 190μm from the bottom inside the module. Since there is no focusable part, therefore the MTF tester has to be capable of measuring in such a configuration.
As described in above Specifications, a 100% quality check and screen has to be performed for:
? MTF on 9 defined lens positions
? EFL or BFL
Sampling data per batch on a representative population have to be collected for the other optical parameters as defined in ST Spec: EO_033_Lens_Req_Spec_VS6555_VGA_2.2_no_focus_AE.
The sampling rate will be defined by JBC based on experience gained from production data. The complete set of optical measurement data and a statistics summary has to be supplied for each batch of modules delivered.


Fig. 8.1: JBC VGA lens chip in fixed focus module. The focal plane of the lens will be ~190μm from the bottom inside the module.
9) Final visual inspection
The produced modules are subject to a 100% final visual inspection and screen. The plastic parts have to be inspected and screened for any kind of mechanical damage as specified in above specifications.
In addition, under at least 100x magnification, all parts must be free of any foreign material or material which could fall-off during further processing. This included fibers, flashed LCP material and possible glass particles from the lens chip.
The lens chip is to be inspected according to ISO10110-7:5/1x0.06.
All visual rejects have to be removed from the production lot and may not be shipped to customer.
10)  Shipping of parts
Good, finished parts are to be shipped on reel tape, loaded and sealed under clean room conditions. Tape and reel have to be approved by ST before use. Lots packed on reel have to be separated by mould tool and cavity.
Along with every shipment, the complete set of above specified quality data as well as a certificate of conformance has to be supplied.
11)  Reliability requirements
Before final product release, the module has to pass an extensive reliability qualification test described in ST Spec:
EO_033_Lens_Req_Spec_VS6555_VGA_2.2_no_focus_AE. The manufacturing partner has to set-up a regular reliability monitoring program to monitor the critical reliability parameters during ongoing production. The detailed list of reliability tests, frequency and number of devices has to be agreed upon.
发表于 2007-10-30 19:44:03 | 显示全部楼层
太长了 就算是中文估计有耐心看的人不多, 呵呵,找个现实中的朋友请教一下吧
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发表于 2007-10-30 19:48:23 | 显示全部楼层
我也正在用ST的Sensor,VGA的(好像ST就那么一颗,呵呵)有空交流。
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发表于 2007-12-15 10:29:13 | 显示全部楼层
生产要求的摘要
6555 固定的VGA 模件焦点用
JBC 透镜片
1) 执行摘要:
这资料总结固定的6555年代的生产的基本要求集中reflow基于提供透镜片的一JBC的能干VGA 照像机模件。   为这的主要基础是JBC 说明: EO _ 033 _ 透镜 _ Req _ Spec _ VS6555 _ VGA _ 2.2 _ 不 _ 集中 _ 自动电气公司,8024923 _ 一和7593297 RevA。  那些说明最初已经被为一个传统的可调整的焦点模件用底座和桶确定。  因此当时适用,适应必须被挣关于确定的这目前单个部分集中设计。
2) 概述:
固定集中VGA 模件基本上由组成,单个部分爬上发霉LCP与一起一用胶粘合在透镜片以JBC 提供。  
图  2.1.用示意图有4.5x 4.5x 2.075mm 3的外部尺寸显示底座。  这单个部分爬上必须从杜邦Zenite 5130 L LCP号书那里发霉。   如图中所示  2.2. 上表面的外部部分, 侧壁和底部脚将成为与保护由0.1祄不锈钢盖住的至少1祄铜组成的EMI 的metallized。  [52RD. com ]
一JBC的横剖面供应透镜片3.5x 3.5x 1.2 mm3的尺寸被用示意图显示鳍状物图  2.2. 这透镜片将被用胶粘合进底座形成完全起作用的视觉的模件。  在光学性能的目测和证实之后,这部分是成为用户的被递交的线轴带子。 [52RD. com ]
[52RD. com ]
图  2.1:LCP的计划安装顶视图(左)  以及仰视图(右边) .  外部尺寸: 4.5x 4.5x 2.075mm 3 [52RD. com ]
[52RD. com ]
图  2.2:单个的片底座: EMI 的图解的意见保护镀的地区。  离开: 有透镜的仰视图, 正确的顶视图。 [52RD. com ]
[52RD. com ]
图  2.3:为JBC VGA 透镜片与3.5x 3.5x 1.2 mm3的尺寸一起计划横断面。 [52RD. com ]
[52RD. com ]
JBC签订生产合伙人预计交付给卷模件的生产的下列项目: [52RD. com ]
a) N 洞(N = 4,8,t.b.a.)的生产  能生产LCP的模型工具把部分安装在指定的质量,尺寸和容忍方面。  在协议上,从一位合格,外部供应者JBC可以提供模型工具。 [52RD. com ]
b) 在指定的质量,尺寸和容忍方面的LCP部分的模型。 [52RD. com ]
c) 塑造的保护安装的为EMI 绘制的地图的金属。  在协议上,这过程可以被转包业务对一外部,JBC赞成供应者。 [52RD. com ]
d) 目测,检查和载人的提供透镜的JBC从紫外线切下来释放带子框架 [52RD. com ]
e) 透镜片的用胶粘合到模件。 [52RD. com ]
f) 被完成的模件的MTF 和BFL的100%的视觉的测试和筛选 [52RD. com ]
g) 制成品的100%的视觉OQC [52RD. com ]
h) 装进线轴带子,严格通过模型工具和洞分类,焊接同意的船运集装箱。 [52RD. com ]
i) 全部的产生和供应需要船运单据和数据。 [52RD. com ]
一般: [52RD. com ]
j) 通过完全的生产过程关键的过程参数的报告的监控,统计过程控制和常规顾客。 [52RD. com ]
k) 季度传导和一个可靠性监视器程序的报告。 [52RD. com ]
3)模型工具 [52RD. com ]
N 洞(N = 4,8,t.b.a.)  模型工具必须能生产LCP把部分骑在马上在指定的质量,尺寸和容忍。  每个洞必须显示一个标明计划由JBC提供保证部分的充分的traceability。  这模型工具必须生活时间显示至少1Mio 射击。  在协议上,从一位合格,外部供应者JBC可以提供模型工具。 [52RD. com ]
对于任何新模型工具来说, 一份完整的维的报告,临界尺寸和评估部分的一个cpk价值的目录必须满足设备的代表性的数量。  进生产释放只被接受适合赞成的JBC/ST 工具。 [52RD. com ]
[52RD. com ]
4) 底座的模型 [52RD. com ]
底座必须被根据上述说明资料生产。  作为塑料,液晶聚合物: 杜邦Zenite 5130 L 书将被使用。  只与将被适合生产释放分开圣赞成模型工具和洞。  与不同的工具分开,洞将严格被分开。 [52RD. com ]
高于部分质量管理的固体的水平必须被用于生产实现。  一个每个洞的对于每批部分来说,质量数据(意味着,标准。  Dev. 和Cpk)  在t.b.a临界尺寸和附加的描述试验上必须满足设备的代表性的数量。  取样率将被基于从生产数据获得的经验确定。  全部测量设备必须被校验,必须显示有能力的R&R。 [52RD. com ]
表面质量必须与圣过失系统相符,例如描述  在圣Spec里7593297旋转A。  塑造的部分必须没有闪光。  在底座表面上,可能没有可以停止和能下降到CMOS 传感器芯片上的任何特征或者纤维。  在用于会议之前,全部部分必须经历一广大的清洁。 [52RD. com ]
5) 底座的绘制的地图 [52RD. com ]
外表面在图里被素描  底座中的5.1个必须被保护由0.1祄不锈钢盖住的至少1祄铜组成的EMI 镀。  非常重要的是绘制的地图有能力对3x 260C 禁得住加热的reflow 条件30年代没有任何变化。  在协议上,这过程可以被转包业务对一外部,JBC赞成供应者。   全部相关的细节被用圣Spec 描述为7593297旋转A。  [52RD. com ]
由于每一个绘制批,被处理的信息的地图, 包括抵抗在一个代表性的样品号上测量,和在一个证人样品身上测量的铺设者厚度将被提供。  绘制reflow 过程定期证实的地图的粘着。  频率和方法是与JBC达成协议。 [52RD. com ]
[52RD. com ]
图  5.1:爬上地区与保护的EMI 被镀 [52RD. com ]
6) JBC 透镜片的交付 [52RD. com ]
JBC 将提供切成小方块的透镜片在紫外线上释放带子框架以及相关的分理数据。  生产的合伙人将有来自带子的载人这些片, 必须根据同意标准和在装配之前从两透镜边筛选做100%的目测。 [52RD. com ]
7) JBC 透镜片的会议 [52RD. com ]
一般 [52RD. com ]
模件会议,为装船测试和包装必须被在干净的空间环境内做。  清洁空间条件和实践,操作者的包括酱必须用这样方式以致于在5祄下面的一个临界的粒子尺寸是有保证的。 [52RD. com ]
模件的会议 [52RD. com ]
JBC 透镜片将被用胶粘合成这个桶使用上升热气团治愈ThreeBond 2234E环氧的(治愈条件:150oC,30minutes) .  图  7.1 用示意图显示用胶粘合的地区。  对过剩来说,在这个桶里的两个胶口袋必须用于附上透镜片。  用胶粘合必须被用这样的方式,那执行: [52RD. com ]
?  没有透镜的倾斜加入这个桶。 [52RD. com ]
?  透镜片明确到4 透镜参考衬垫在桶的最后的上上压。 [52RD. com ]
?  不可能溅出胶进在图内表明的内部地区的50%的超出  7.1 [52RD. com ]
[52RD. com ]
图  7.1:胶透镜片的申请的计划在模件里修理。  胶必须被在两个口袋内使用。  没有胶的流到50%的内部地区被允许。 [52RD. com ]
出于力量推用胶粘合在透镜片必须适合每块场地被关于有意义人口评价。  一种最小出于推动的500gf的力量必须是有保证的。  基于从生产数据获得的经验 JBC 将确定取样率。  出于推动的力量的质量数据必须被每块场地提供。 [52RD. com ]
8) 模件的测试 [52RD. com ]
完全装配的模件必须是为MTF测试并且为视觉的性能筛选的100%。  为了证明令人满意的测量系统性能,一测量设备的计量器R&R 必须被进行。  对圣和JBC MTF 检测器的十字架校准必须被为产品执行全部MTF测试设备。 [52RD. com ]
如图中所示  8.1,这个模件的焦点飞机将是大约来自在模件里面的底部的190祄。  自从没有focusable部分, 因此MTF 检测器必须能在这样的一个构造里测量。 [52RD. com ]
如高于说明描述,一种100%的质量检查,屏幕必须被执行为: [52RD. com ]
?  在9上的MTF定义透镜为位置 [52RD. com ]
?  EFL或者BFL [52RD. com ]
样本数据每批关于一代表性人口必须适合其它光学参数收集当在圣Spec 确定时: EO _ 033 _ 透镜 _ Req _ Spec _ VS6555 _ VGA _ 2.2 _ 不 _ 集中 _ 自动电气公司。 [52RD. com ]
基于从生产数据获得的经验 JBC 将确定取样率。  成套光测量数据和一篇统计摘要必须满足交付的每批模件。 [52RD. com ]
[52RD. com ]
[52RD. com ]
图  8.1:JBC VGA 透镜加入固定的焦点模件。  透镜的焦面将是来自在模件里面的底部的190祄。 [52RD. com ]
9) 最后的目测 [52RD. com ]
被生产的模件受100%的最后的目测和屏幕影响。  在高于说明里,塑料部分必须被象指定的那样为任何种类机械损害检查并且筛选。  [52RD. com ]
另外,在至少100x 放大下,全部部分都一定没有能的任何杂质或者材料下滑在更进一步处理期间。  这包括纤维,闪烁LCP 材料和来自透镜缺口的可能的玻璃粒子。  [52RD. com ]
透镜片将被根据ISO10110-7:5/1x-0.06 检查。  [52RD. com ]
全部视觉次品必须从生产批除去并且可能不被装运给用户。 [52RD. com ]
10)  部分的装运 [52RD. com ]
好,成品将被在线轴带子上装运,在干净的空间条件下装并且密封。  录音和卷起必须被被在使用之前圣批准。  包装在线轴上的许多必须被模型工具和洞分开。  [52RD. com ]
跟一切装船一起,成套在上面确切说明质量数据和一份符合的证明书必须被提供。 [52RD. com ]
11)  可靠性要求 [52RD. com ]
在最后产品发布之前,模件必须通过一次广大的可靠性资格考试在起动器Spec 描述: [52RD. com ]
EO _ 033 _ 透镜 _ Req _ Spec _ VS6555 _ VGA _ 2.2 _ 不 _ 集中 _ 自动电气公司。  位生产的合伙人必须建立一正规可靠性监视器计划监控关键的可靠性参数在进行中生产期间。  可靠性的详细名单测试,频率和设备的数量必须被同意 [br]<p align=right><font color=red>+5 RD币</font></p>
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发表于 2007-12-15 16:07:21 | 显示全部楼层
强人-,-
翻译出来了。
我墨迹墨迹哦。我就不明白,中国这么多人,占世界人口比例那么大。干啥让外国人欺负成这样呢。学英语,学英语,还要地道的。chinese english怎么了。要是世界上的人都说chinese english我敢说世界上的英语就的咱们的语法最正确。
人多力量大,但是要同心协力,为啥改变的总是我们呢。为啥定标准的都是外国人呢。我就想不明白。
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