High-Speed.Signal.Propagation.Advanced.Black.Magic(硬件工程师的黑宝书）

sunoosun

对于致力于硬件设计的工程师 这本书是必备的黑宝书，看看目录就知道它的价值了。
   General Notation

   Chapter 1.  Fundamentals
     Section 1.1.  Impedance of Linear, Time-Invariant, Lumped-Element Circuits
     Section 1.2.  Power Ratios
     Section 1.3.  Rules of Scaling
     Section 1.4.  The Concept of Resonance
     Section 1.5.  Extra for Experts: Maximal Linear System Response to a Digital Input

   Chapter 2.  Transmission Line Parameters
     Section 2.1.  Telegrapher's Equations
     Section 2.2.  Derivation of Telegrapher's Equations
     Section 2.3.  Ideal Transmission Line
     Section 2.4.  DC Resistance
     Section 2.5.  DC Conductance
     Section 2.6.  Skin Effect
     Section 2.7.  Skin-Effect Inductance
     Section 2.8.  Modeling Internal Impedance
     Section 2.9.  Concentric-Ring Skin-Effect Model
     Section 2.10.  Proximity Effect
     Section 2.11.  Surface Roughness
     Section 2.12.  Dielectric Effects
     Section 2.13.  Impedance in Series with the Return Path
     Section 2.14.  Slow-Wave Mode On-Chip

   Chapter 3.  Performance Regions
     Section 3.1.  Signal Propagation Model
     Section 3.2.  Hierarchy of Regions
     Section 3.3.  Necessary Mathematics: Input Impedance and Transfer Function
     Section 3.4.  Lumped-Element Region
     Section 3.5.  RC Region
     Section 3.6.  LC Region (Constant-Loss Region)
     Section 3.7.  Skin-Effect Region
     Section 3.8.  Dielectric Loss Region
     Section 3.9.  Waveguide Dispersion Region
     Section 3.10.  Summary of Breakpoints Between Regions
     Section 3.11.  Equivalence Principle for Transmission Media
     Section 3.12.  Scaling Copper Transmission Media
     Section 3.13.  Scaling Multimode Fiber-Optic Cables
     Section 3.14.  Linear Equalization: Long Backplane Trace Example
     Section 3.15.  Adaptive Equalization: Accelerant Networks Transceiver

   Chapter 4.  Frequency-Domain Modeling
     Section 4.1.  Going Nonlinear
     Section 4.2.  Approximations to the Fourier Transform
     Section 4.3.  Discrete Time Mapping
     Section 4.4.  Other Limitations of the FFT
     Section 4.5.  Normalizing the Output of an FFT Routine
     Section 4.6.  Useful Fourier Transform-Pairs
     Section 4.7.  Effect of Inadequate Sampling Rate
     Section 4.8.  Implementation of Frequency-Domain Simulation
     Section 4.9.  Embellishments
     Section 4.10.  Checking the Output of Your FFT Routine

   Chapter 5.  Pcb (printed-circuit board) Traces
     Section 5.1.  Pcb Signal Propagation
     Section 5.2.  Limits to Attainable Distance
     Section 5.3.  Pcb Noise and Interference
     Section 5.4.  Pcb Connectors
     Section 5.5.  Modeling Vias
     Section 5.6.  The Future of On-Chip Interconnections

   Chapter 6.  Differential Signaling
     Section 6.1.  Single-Ended Circuits
     Section 6.2.  Two-Wire Circuits
     Section 6.3.  Differential Signaling
     Section 6.4.  Differential and Common-Mode Voltages and Currents
     Section 6.5.  Differential and Common-Mode Velocity
     Section 6.6.  Common-Mode Balance
     Section 6.7.  Common-Mode Range
     Section 6.8.  Differential to Common-Mode Conversion
     Section 6.9.  Differential Impedance
     Section 6.10.  Pcb Configurations
     Section 6.11.  Pcb Applications
     Section 6.12.  Intercabinet Applications
     Section 6.13.  LVDS Signaling

   Chapter 7.  Generic Building-Cabling Standards
     Section 7.1.  Generic Cabling Architecture
     Section 7.2.  SNR Budgeting
     Section 7.3.  Glossary of Cabling Terms
     Section 7.4.  Preferred Cable Combinations
     Section 7.5.  FAQ: Building-Cabling Practices
     Section 7.6.  Crossover Wiring
     Section 7.7.  Plenum-Rated Cables
     Section 7.8.  Laying Cables in an Uncooled Attic Space
     Section 7.9.  FAQ: Older Cable Types

   Chapter 8.  100-Ohm Balanced Twisted-Pair Cabling
     Section 8.1.  UTP Signal Propagation
     Section 8.2.  UTP Transmission Example: 10BASE-T
     Section 8.3.  UTP Noise and Interference
     Section 8.4.  UTP Connectors
     Section 8.5.  Issues with Screening
     Section 8.6.  Category-3 UTP at Elevated Temperature

   Chapter 9.  150-Ohm STP-A Cabling
     Section 9.1.  150-W STP-A Signal Propagation
     Section 9.2.  150-W STP-A Noise and Interference
     Section 9.3.  150-W STP-A: Skew
     Section 9.4.  150-W STP-A: Radiation and Safety
     Section 9.5.  150-W STP-A: Comparison with UTP
     Section 9.6.  150-W STP-A Connectors

   Chapter 10.  Coaxial Cabling
     Section 10.1.  Coaxial Signal Propagation
     Section 10.2.  Coaxial Cable Noise and Interference
     Section 10.3.  Coaxial Cable Connectors

   Chapter 11.  Fiber-Optic Cabling
     Section 11.1.  Making Glass Fiber
     Section 11.2.  Finished Core Specifications
     Section 11.3.  Cabling the Fiber
     Section 11.4.  Wavelengths of Operation
     Section 11.5.  Multimode Glass Fiber-Optic Cabling
     Section 11.6.  Single-Mode Fiber-Optic Cabling

   Chapter 12.  Clock Distribution
     Section 12.1.  Extra Fries, Please
     Section 12.2.  Arithmetic of Clock Skew
     Section 12.3.  Clock Repeaters
     Section 12.4.  Stripline vs. Microstrip Delay
     Section 12.5.  Importance of Terminating Clock Lines
     Section 12.6.  Effect of Clock Receiver Thresholds
     Section 12.7.  Effect of Split Termination
     Section 12.8.  Intentional Delay Adjustments
     Section 12.9.  Driving Multiple Loads with Source Termination
     Section 12.10.  Daisy-Chain Clock Distribution
     Section 12.11.  The Jitters
     Section 12.12.  Power Supply Filtering for Clock Sources, Repeaters, and PLL Circuits
     Section 12.13.  Intentional Clock Modulation
     Section 12.14.  Reduced-Voltage Signaling
     Section 12.15.  Controlling Crosstalk on Clock Lines
     Section 12.16.  Reducing Emissions

   Chapter 13.  Time-Domain Simulation Tools and Methods
     Section 13.1.  Ringing in a New Era
     Section 13.2.  Signal Integrity Simulation Process
     Section 13.3.  The Underlying Simulation Engine
     Section 13.4.  IBIS (I/O Buffer Information Specification)
     Section 13.5.  IBIS: History and Future Direction
     Section 13.6.  IBIS: Issues with Interpolation
     Section 13.7.  IBIS: Issues with SSO Noise
     Section 13.8.  Nature of EMC Work
     Section 13.9.  Power and Ground Resonance

   Points to Remember
   Appendix A.  Building a Signal Integrity Department
   Appendix B.  Calculation of Loss Slope
   Appendix C.  Two-Port Analysis
     Simple Cases Involving Transmission Lines
     Fully Configured Transmission Line
     Complicated Configurations

   Appendix D.  Accuracy of Pi Model
     Pi-Model Operated in the LC Region

   Appendix E.  erf( )

【文件名】:0727@52RD_High-Speed.Signal.Propagation.Advanced.Black.Magic.part1.rar
【格　式】:rar
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sunoosun

共5个压缩包 其余四个在下一篇文章中。

20021104030

另外的部分在哪呢？[em10]

jimcmwang

thanks