射频/微波电路板设计指南

nustyw

目录
1 概述(GENERAL)................................................................................................................................ 1
1.1 目的(Purpose)........................................................................................................................... 1
1.2 范围(Scope).............................................................................................................................. 1
1.3 术语和定义(Terms and Definitions)......................................................................................... 1
2 应用文档(Application Documents) ..................................................................................................... 3
2.1 国际互联与封装协会(IPC) ...................................................................................................... 3
2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 3
2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3
2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3
2.5 国际标准化组织(International Organization for Standardization)........................................... 3
2.6 参考文档(Reference Information) ............................................................................................ 3
3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3
3.1 最初输入(Initial Input).............................................................................................................. 3
3.2 设计方案(Design Options)........................................................................................................ 3
3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3
3.4 电气设计(Electrical Design)..................................................................................................... 3
3.5 机械设计(Mechanical Design).................................................................................................. 3
3.6 设计预审(Preliminary Design Review) .................................................................................... 3
3.7 电路实验板(Breadboard).......................................................................................................... 3
3.8 原型(Prototype)........................................................................................................................ 3
3.9 文件编制(Documentation)........................................................................................................ 3
3.10 最终设计评审(Final Design Review)..................................................................................... 3
4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5
4.1 产品特性列表(Design Features Listing) .................................................................................. 5
4.2 原图(Master Drawing) .............................................................................................................. 5
4.3 原始图形(Master Pattern) ......................................................................................................... 5
5 材料(MATERIALS)............................................................................................................................ 5
5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5
5.1.1 基材选择(Substrate Selection)....................................................................................... 5
5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5
5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6
5.1.1.3 厚度(Thickness) .................................................................................................. 6
5.1.1.4 环境(Environment).............................................................................................. 7
5.1.1.5 成本(Cost) ........................................................................................................... 7
5.1.1.6 供应商(Supplier) ................................................................................................. 7
5.2 粘接膜(Bonding Films)............................................................................................................. 7
5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7
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July 2002
5.2.2 热固性粘接膜(Thermoset Bonding Films) ....................................................................7
5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) .........................................................8
5.3 金属(Metals)............................................................................................................................. 8
5.3.1 金属覆层(Cladding) .......................................................................................................8
5.3.1.1 薄金属覆层(Thin Cladding Considerations).......................................................8
5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................8
5.3.2 金属镀层(Metal Plating) ................................................................................................8
5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)......................9
5.3.2.2 电镀铜(Electrodeposited Copper) .......................................................................9
5.3.2.3 镀镍(Nickel) ........................................................................................................9
5.3.2.4 镀金(Gold)...........................................................................................................9
5.3.2.5 镀银(Silver) .........................................................................................................9
5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................9
5.3.2.7 焊料镀层Solder Coating......................................................................................9
5.3.2.8 浸锡(Immersion Tin) ...........................................................................................9
5.3.2.9 电镀锡(Electroplated Tin) ...................................................................................9
5.3.3 电化腐蚀(Galvanic Corrosion).......................................................................................9
5.3.4 铬转换镀层(Chromate Conversion Coating) ...............................................................10
5.4 仿型涂层(Conformal Coating)................................................................................................10
5.4.1 一般注意事项(General Caution)..................................................................................10
5.4.2 聚四氟乙烯(PTFE Considerations)..............................................................................10
6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................10
6.1 带状线(Stripline) ..................................................................................................................... 11
6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 11
6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11
6.1.1.2 宽信号线(Wide Signal Lines) ...........................................................................12
6.1.2 带状线的衰减(Attenuation in Stripline) ......................................................................12
6.1.2.1 窄信号线(Narrow signal lines)..........................................................................12
6.1.2.2 宽信号线(Wide signal lines) .............................................................................12
6.2 非对称带状线(Asymmetric Stripline).....................................................................................13
6.3 微带线(Microstrip) ..................................................................................................................13
6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective
Permittivity f Microstrip)................................................................................................................13
6.3.2 微带线的衰减(Attenuation in Microstrip) ...................................................................15
7 板的详细要求(TAILED BOARD REQUIREMENTS) .....................................................................15
7.1 机械特性(Machined Features) ................................................................................................15
7.1.1 尺寸和公差(Dimensioning and Tolerancing)...............................................................15
7.1.2 金属化过孔(Plated-Through Holes).............................................................................16
7.1.2.1 销针/接地(Pinning/Ground Connections) .........................................................17
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IPC-2252
7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17
7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18
7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18
7.1.6 外形(Periphery)............................................................................................................ 18
7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18
7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18
7.2 出图(Imaging) ......................................................................................................................... 18
7.2.1 底片(Artwork).............................................................................................................. 19
7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 19
7.2.3 环孔(Annular Rings) .................................................................................................... 19
7.3 PTFE活化(PTFE Activation) ................................................................................................... 19
7.4 金属化(Metallization) ............................................................................................................. 19
7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19
7.4.2 镀铜(Copper Plating) ................................................................................................... 19
7.5 蚀刻(Etching) .......................................................................................................................... 20
7.6 粘接(Bonding)........................................................................................................................ 20
7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21
7.8 测试(Testing).......................................................................................................................... 21
8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21
8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21
8.1.1 机械固定（Mechanical Mounting）........................................................................... 21
8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21
8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21
8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22
8.1.4 软钎焊（Soldering）................................................................................................... 22
8.1.4.1 温度警示（Temperature Caution）.................................................................. 22
8.1.5 直接粘结（Direct Bonding）...................................................................................... 22
8.2 连接器安装（Connector Attachment） ................................................................................. 22
8.2.1 边缘连接器（Edge Connector） ................................................................................ 22
8.2.2 表面连接器（Surface Connector） ............................................................................ 23
8.3 器件安装（Device Attachment）........................................................................................... 23
8.3.1 焊接连接（Welded Bonds）....................................................................................... 23
8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23
8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23
8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24
8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24
8.3.1.5 软钎焊（Soldering）........................................................................................ 24
8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24
8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
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July 2002
8.3.2.2 热压焊（Thermal Compression Bonding） .....................................................24
8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................24
8.3.3 器件安装（Device Attachment）................................................................................24
8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................24
8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ...............................................25
8.3.3.3 平行间隙焊接（Parallel Gap Welding）..........................................................25
8.3.3.4 热压键合（Thermal Compression Bonding） .................................................25
8.3.3.5 再流焊（Solder Reflow）.................................................................................25
9 质量保证（QUALITY ASSURANCE） ..........................................................................................25
9.1 质量一致性鉴定（Quality Conformance Evaluations） .......................................................25
9.2 可靠性（Reliability）.............................................................................................................26
【文件名】:061130@52RD_微波电路板设计指南.pdf
【格　式】:pdf
【大　小】:1578K
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sunzh198

把我的资料偷来卖？
太不厚道了！！！！！
建议版主扣分，删贴！

nustyw

我的资料是在其他论坛上看到的
感觉还不错就贴上了
和楼上的没有关系

lobster

看介绍都是很实用的东东，谢谢分享！[em08]

wpz627

最关心里面PTFE材料的应用，感谢分享

ldhlek

怎扣了币，没看到下来文件呢？

xyfyhello

ftp不管用