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【文件名】:061029@52RD_Design of Compact Stacked-Patch Antennas on LTCC.pdf
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Design of Compact Stacked-Patch Antennas on LTCC
Technology for Wireless Communication Applications
E. Tentzeris, R. L. Li, K. Lim, M. Mseng, E. Tsai, G. DeJean, and J. Laskar
School of Electrical and Computer Engineering
Georgia Institute of Technology, Atlanta, GA 30332-0250, USA
I. Introduction
The exploding growth of wireless communications systems leads to an increasing
demand far integrated compact low-cost antennas, As a result, LTCC (Low Temperalure
Co-fired Ceramics) multilayer technology is becoming more and more popular for the
production of highly integrated, complex multilayer modules and antennas. This
technology is appreciated for its flexibility in realizing an arbitrary number of layers.
However, LTCC materials typically possess a high dielectric constant, On one hand, this
helps reduce the antenna size, but on the other hand it also reduces the bandwidth of
planar patch antennas, thus making the design for practical wireless communication
systems more difficult and therefore more challenging.
A common approach for improving the bandwidth performance of a patch antenna is
to add parasitic elements to the antenna ~ t m ~ t u ree.g,. , a stacked patch [I]. This reduces
the impedance variation of the antenna with frequency, thus enhancing bandwidth
performance. Various arrangements of stacked structures have been investigated in 121-
131. Typically a foam and IOW dielectric constant substrate stacked configuration or a high
and low dielectric constant m a t e d combination is used to achieve a broad bandwidth.
These SlNChlres require a thicker substrate (typically the total antenna thickness4.lb.
;*o=wavelength in free space) and different materials. This is not suitable for compact
antenna designs, especially using LTCC technology In addition, a tedious procedure may
be required in the design of such a different-subsuate-stacked patch antenna. There are
many parameters that need to be adjusted far an optimized bandwidth performance, such
as the length and width of each patch, the thickness of each substrate, as well as the
position of the feed point. In practice, it is very difficult to adjust every parameter

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