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【文件名】:06416@52RD_Microwave.Circuit.Modeling.Using.Electromagnetic.Field.Simulation.part01.rar
【格 式】:rar
【大 小】:1457K
【简 介】:
【目 录】:
Contents
Preface xv
Chapter 1 Introduction 1
1.1 General Field-Solver Applications 2
1.2 A Note on Color Plots 3
1.3 A Note on 3D Wireframe Views 4
1.4 A Brief Historical View 6
0.00References 8
Chapter 2 CAD of Passive Components 9
2.1 Circuit-Theory-Based CAD 10
2.2 Field-Theory-Based CAD 13
2.3 Solution Time for Circuit Theory and Field Theory 16
2.4 A “Hybrid” Approach to Circuit Analysis 18
2.5 Optimization 23
2.6 Modern Microwave CAD—What’s Missing? 24
2.7 The Next Decade 26
0.00References 27
Chapter 3 Numerical Electromagnetics 29
3.1 Microwave Analysis and Design 30
3.2 Methods of Electromagnetic Analysis 32
3.3 The Features Common to All Numerical Methods 34
3.4 The Differences Between Numerical Methods 35
3.5 Categories of Numerical Methods 35
3.6 Expansion Functions 37
3.7 Strategies for Finding the Unknown Coefficients 40
3.8 The Method of Moments 43
0.003.8.1 2.5D Planar MoM Solvers 49
viii Microwave Circuit Modeling Using Electromagnetic Field Simulation
3.9 The Finite Element Method 50
0.00 3.9.1 Linear Expansion Functions and Unknown Coefficients 51
0.0003.9.2 Strategy for Determining the Unknown
0.0000.0.00Expansion Coefficients 53
3.10 Finite Difference and Finite Integration Methods 55
0.0003.10.1 Finite Difference Formulations 55
0.0003.10.2 Finite Integration Formulation 58
0.0003.10.3 Solution Strategies 59
3.11 Finite Difference Time Domain Formulations 61
0.0003.11.1 Stability 65
0.0003.11.2 Initial and Boundary Conditions 66
0.0003.11.3 Output from FDTD Simulators 66
3.12 Transmission Line Matrix Methods 67
0.0003.12.1 TLM Basics and the Two-Dimensional
0.0000.00.00TLM Shunt Mesh 67
0.0003.12.2 The Three-Dimensional Expanded TLM Mesh 70
0.0003.12.3 The Symmetrical Condensed Node TLM Mesh 71
0.0003.12.4 Inhomogeneous Materials and Losses 72
0.0003.12.5 Initial and Boundary Conditions 72
0.0003.12.6 Stability 73
3.13 Output from Electromagnetic Simulators 73
3.14 Discussion and Conclusion 75
3.15 Further Reading 77
0.000References 77
Chapter 4 Alternative Classifications 81
4.1 Classification by Geometry 81
0.004.1.1 2D Cross-Section-Solvers 81
0.004.1.2 2.5D Planar-Solvers 83
0.004.1.3 3D Arbitrary Solvers 84
0.004.1.4 Summary 85
4.2 Classification by Solution Domain 85
0.004.2.1 Frequency Domain Solvers 86
0.004.2.2 Time Domain Solvers 86
0.004.2.3 Eigenmode-solvers 87
0.00References 88
Chapter 5 Moment Method Simulators 89
5.1 Closed Box Moment Method—Strengths 89
5.2 Closed Box Moment Method—Weaknesses 89
5.3 Laterally Open Moment Method—Strengths 90
5.4 Laterally Open Moment Method—Weaknesses 90
5.5 Issues Common to Both MoM Formulations 91
Contents ix
5.6 Exceptions to General MoM Comments 92
5.7 50-Ohm Microstrip Line 92
5.8 MoM—Cells and Subsections 95
5.9 MoM—Validation Structures 96
5.10 MoM Meshing and Convergence 98
0.0005.10.1 Uniform Versus Edge-Meshing 99
0.0005.10.2 Microstrip Convergence 100
0.0005.10.3 Summary for Meshing and Impedance Convergence 101
5.11 Controlling Meshing 102
0.0005.11.1 Meshing a Microstrip Tee-Junction 103
0.0005.11.2 Meshing a Wiggly Coupler 105
0.0005.11.3 Meshing a Printed Spiral Inductor 105
0.0005.11.4 Meshing Printed Capacitors 107
0.0005.11.5 Meshing Overlay and MIM Capacitors 111
0.0005.11.6 Exceptions to Mesh Control Discussion 113
0.0005.11.7 Summary for Mesh Control 113
5.12 MoM—Displaying Voltage 114
5.13 MoM—Calibration Structures 116
0.0005.13.1 Microstrip Ideal Short Circuit 116
0.0005.13.2 Microstrip Open Circuit 118
0.0005.13.3 Microstrip Thin-Film Resistor 118
0.0005.13.4 Summary for Microstrip Calibration Structures 121
5.14 Visualization 122
0.000References 122
Chapter 6 Finite Element Method Simulators 125
6.1 Finite Element Method—Strengths 125
6.2 Finite Element Method—Weaknesses 127
6.3 FEM Simulators—Validation Structures 128
6.4 Controlling Meshing 128
0.006.4.1 Meshing The Coaxial Standard—
0.000.0.00Geometrical Resolution 130
0.006.4.2 Meshing a Coaxial Resonator—
0.000.0.00Dummies and Seeding 132
0.006.4.3 Meshing a Coaxial Step Discontinuity—
0.000.0.00Dummies and Seeding 137
0.006.4.4 Solving the Step Discontinuity in 2D 143
0.006.4.5 Mesh Control Summary 143
6.5 FEM Calibration Structures 145
0.006.5.1 7-mm Coaxial Through Line 145
0.006.5.2 7-mm Coaxial Short 147
0.006.5.3 7-mm Shielded Coaxial Open 148
0.006.5.4 7-mm Coaxial Termination 149
x Microwave Circuit Modeling Using Electromagnetic Field Simulation
0.006.5.5 7-mm Coax—TEM Behavior 150
6.6 Visualization 150
0.00References 151
Chapter 7 FDTD and TLM Simulators 153
7.1 FDTD and TLM—Strengths 153
7.2 FDTD and TLM—Weaknesses 154
7.3 FDTD and TLM—Validation Structures 156
0.007.3.1 TE101 Mode Convergence 158
0.007.3.2 Wideband Rectangular Waveguide Validation 160
7.4 Controlling Meshing 163
0.007.4.1 Meshing the Stripline Standard 165
0.007.4.2 Meshing the Coaxial Step Discontinuity 166
7.5 Visualization 170
0.00References 170
Chapter 8 Ports and De-embedding 173
8.1 Ports—Connecting Fields to Circuits 173
8.2 De-embedding and Unterminating 176
8.3 Closed Box MoM Ports and De-embedding 180
8.4 Laterally Open MoM Ports and De-embedding 183
8.5 3D FEM Ports and De-embedding 184
8.6 3D FDTD and TLM Ports and De-embedding 187
8.7 Internal, Lumped, and Gap Ports 189
0.008.7.1 Exceptions to the Comments on Internal Ports 192
8.8 Symmetry and Ports 193
0.00References 196
Chapter 9 Numerical Methods Summary 199
9.1 Meshing 199
0.009.1.1 Surface Meshing 200
0.009.1.2 Volume Meshing 200
9.2 Convergence 200
0.009.2.1 Guide Wavelength 201
0.009.2.2 Spatial Wavelength 201
0.009.2.3 Geometrical Resolution 201
9.3 Validation Structures 202
9.4 Calibration Structures 202
9.5 Ports and De-embedding 203
0.009.5.1 MoM Ports 203
0.009.5.2 FEM, FDTD, and TLM Ports 204
0.009.5.3 Internal, Lumped, and Gap Ports 204
Contents xi
Chapter 10 Microstrip 205
10.1 Discontinuities 205
10.2 Microstrip Vias and Slots 207
10.3 Microstrip 3D Vias 209
10.4 Modeling Microstrip Vias 212
10.5 Microstrip Mitered Bend 215
10.6 Microstrip Tee-Junction 217
10.7 Summary for Microstrip Discontinuities 219
10.8 Quasi-TEM Nature of Microstrip 220
10.9 Evanescent Modes in Microstrip 222
10.10 Microstrip Loss 224
10.11 Compaction of Microstrip Circuits 229
00.00010.11.1 Cascade of Mitered Bends 230
00.00010.11.2 Stripline Meander Line 232
00.00010.11.3 Microstrip Branchline Coupler 233
00.000References 234
Chapter 11 Computing Impedance 237
11.1 Single Strip Impedance and Phase Velocity 237
11.2 Single Strip Impedance Using Symmetry 244
11.3 Coupled Line Parameters Using Symmetry 246
11.4 CPW with Dielectric Overlay 250
11.5 Buried Transmission Lines 252
11.6 Other Applications of 2D Cross-Section-Solvers 253
00.00References 254
Chapter 12 Vias, Via Fences, and Grounding Pads 255
12.1 Vias in FR4 255
12.2 A More Advanced Via Model 258
12.3 Summary for Microstrip Single Layer Vias 262
12.4 Via Isolation Fences—Part I 263
0.00012.4.1 2.5D MoM Simulation 263
0.00012.4.2 3D FEM Simulation 267
12.5 Via Isolation Fences—Part II 268
12.6 Grounding Pads 271
12.7 Summary for Grounding Pads 281
0.000References 282
Chapter 13 Multilayer Printed Circuit Boards 283
13.1 A Multilayer Transition in FR4 283
13.2 Controlled Impedance Transitions 290
0.00013.2.1 Analysis Using Closed Box MoM 291
xii Microwave Circuit Modeling Using Electromagnetic Field Simulation
0.00013.2.2 Analysis Using Laterally Open MoM 299
0.00013.2.3 Analysis Using 3D FEM 301
13.3 A 10-GHz Switch Matrix 305
13.4 Summary 311
0.000References 313
Chapter 14 Connectors 315
14.1 RF Edge-Launch Connectors 315
14.2 Digital Edge-Launch Connectors 321
14.3 Another Digital Edge-Launch Example 323
14.4 Through Hole SMA Connectors 326
14.5 Surface Mount SMA Connectors 333
14.6 Summary 336
0.000References 337
Chapter 15 Backward Wave Couplers 339
15.1 PCS Band CPW Coupler 339
15.2 Couplers and Metal Thickness 347
15.3 Lange Couplers 357
15.4 PCS Band 15-dB Coupler 363
15.5 PCS Band Coax-to-Coax Transition 369
00.00References 375
Chapter 16 Microstrip Filters 377
16.1 Interdigital Filters 378
16.2 Edge-Coupled Filters 384
16.3 22.5-GHz Bandpass Filter 387
16.4 3.7-GHz Bandpass Filter 394
16.5 1.5 to 5.5-GHz Bandpass Filter 399
16.6 22.5-GHz Bandstop Filter 401
00.00References 405
Chapter 17 Other Microwave Filters 407
17.1 Coaxial Lowpass Filters 407
17.2 3.5-GHz Combline Filter 414
17.3 2.14-GHz Combline Filter 425
00.00References 431
Chapter 18 Choosing the Right Software 433
18.1 The Solution Process From Start to Finish 433
18.2 Features All Tools Must Have 434
18.3 Features That Are Nice to Have 435
18.4 Visualization 435
Contents xiii
18.5 Ease of Use and Total Solution Time 436
18.6 The Right Tool for the Job 437
00.00References 438
Appendix A Survey of Field-Solver Software 439
A.1 2D Cross-Section-Solvers 439
0.00A.1.1 Stand-Alone Software–PDE Solvers 439
0.00A.1.2 Stand-Alone 2D Electrostatic Solvers 441
0.00A.1.3 Summary for Stand-Alone 2D Solvers 442
0.00A.1.4 Integrated 2D Field-Solvers 443
0.00A.1.5 Summary for Integrated 2D Field-Solvers 445
A.2 2.5D Planar Solvers (3D Mostly Planar) 445
A.3 3D Arbitrary Geometry Solvers 449
Appendix B List of Software Vendors 453
Appendix C List of Internet Sites 457
About the Authors 459
Index 461
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发表于 2006-4-16 01:46:00
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